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Texas Instruments TMS320C6413GTS500

Part No.:
TMS320C6413GTS500
Manufacturer:
Texas Instruments
Category:
DSP (Digital Signal Processors)
Package:
288-BBGA, FCBGA
Datasheet:
AetrixTMS320C6413GTS500.pdf
Description:
IC DSP FIXED-POINT 288-FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,930

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Product details

Overview

TMS320C6413GTS500 from Texas Instruments is a fixed-point digital signal processor (DSP) built on the C64x+ VLIW architecture, delivering 4000 MIPS at 500 MHz with 1 MB on-chip L2 unified RAM/cache, integrated EMIFA supporting SDRAM and asynchronous memory, and dual McASP peripherals for multichannel audio I/O. It targets real-time embedded audio processing in telecom infrastructure and industrial voice systems.

For engineers reviewing the TMS320C6413GTS500 datasheet, TMS320C6413GTS500 pinout, TMS320C6413GTS500 application, or TMS320C6413GTS500 equivalent, key selection criteria include EMIFA bus width (32-bit), McASP channel count (16 transmit/16 receive per port), L2 memory configuration (1024 KB), PLL lock time (≤100 µs), and BGA-352 GTS package thermal performance under sustained 500-MHz operation.

Technical Context

The TMS320C6413GTS500 implements an eight-functional-unit C64x+ CPU core with VelociTI.2™ extensions, enabling parallel execution of up to eight 16-bit instructions per cycle. Its memory subsystem includes 64 KB L1P program cache, 64 KB L1D data cache, and configurable 1024 KB L2 memory usable as SRAM or cache.

Peripheral integration includes two McASPs with time-division multiplexing support, one HPI-16 interface, two I²C modules, three 32-bit timers, and a 32-bit external memory interface (EMIFA) with programmable synchronous/asynchronous timing, SDRAM controller, and boot ROM support via EMIFA 8-bit mode.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core C64x+ VLIW DSP core, 8 functional units, 4000 MIPS @ 500 MHz
L2 Memory 1024 KB configurable as SRAM or cache; enables real-time buffer storage without external DRAM latency
EMIFA Width 32-bit external memory interface supporting SDRAM, SRAM, ROM, and flash with programmable timing
McASP Count Two independent multichannel audio serial ports, each with 16 transmit and 16 receive channels
Package 352-pin ZQFP-style ball grid array (GTS), 27 mm × 27 mm, 1.0 mm pitch, RoHS-compliant
Supply Voltages CVDD = 1.2 V (core), DVDD = 3.3 V (I/O), OSCVDD = 1.2 V (crystal oscillator power)
PLL Lock Time ≤100 µs typical for 500-MHz operation; ensures rapid system startup and clock domain stability

Pinout & Package

The TMS320C6413GTS500 uses a 352-ball fine-pitch BGA (GTS package), with 1.0 mm ball pitch, 27 mm × 27 mm body size, and thermal pad exposed on underside for heatsink attachment. Ball map follows TI's standard GTS bottom-view layout per SPRS247F Section 2.1.

Pin/Terminal Circuit Role Design Meaning
AEA[31:0] EMIFA Address Bus 32-bit address lines for external memory mapping; AEA[22:3] supports boot mode configuration
ED[31:0] EMIFA Data Bus 32-bit bidirectional data path; supports 32-bit SDRAM bursts and 8/16-bit asynchronous transfers
CLKIN Input Clock Reference Accepts 12–25 MHz crystal or external clock; feeds PLL for internal 500-MHz generation
CLKOUT4 Output Clock Signal Dedicated 500-MHz output for synchronizing external logic or ADC/DAC sampling clocks
MCASP0_AXR[15:0] McASP0 Transmit Data 16-bit parallel transmit data bus for primary audio port; supports TDM, I²S, and custom frame formats
HPI_EN / TOUT0 Multiplexed Control Pin Selects HPI-16 peripheral enable or general-purpose timer output; configured at reset via AEA[20:19]

Key Features

Feature Design Value
VelociTI.2™ VLIW Architecture Enables deterministic 4000-MIPS throughput for real-time FIR/IIR filtering, FFT, and codec execution
Configurable L2 Memory 1024 KB partitioned as SRAM or cache; eliminates external memory bottlenecks in audio buffering
Dual McASP Peripherals Each supports 16 TDM slots, 384 kHz sample rate, and independent clocking-ideal for multi-mic beamforming
EMIFA Boot Support 8-bit ROM boot mode via AEA[22:21]=11 allows direct execution from SPI flash or parallel EEPROM
Low-Power Power-Down Modes Four modes (IDLE, STANDBY, HALT, DEEPSLEEP) reduce active current to ≤2 mA while retaining L2 context

Applications

Voice-over-IP Gateway Industrial Voice Recognition Terminal

Use Scenario: Real-time G.729/G.722 encoding/decoding with echo cancellation across 32 concurrent VoIP channels.

IC Role / Device Role / Timing Role: Primary DSP executing codec algorithms, managing EMIFA-connected DDR2 for packet buffering, and synchronizing McASP0/McASP1 to CODEC ICs.

Use Value: 4000-MIPS headroom enables simultaneous acoustic echo cancellation + jitter buffering + encryption without external coprocessor.

Use Scenario: Far-field speech capture using 8-mic linear array with beamforming and keyword spotting in factory-floor HMI.

IC Role / Device Role / Timing Role: Audio preprocessing engine: McASP0 ingests mic data, L2 RAM stores beamformer coefficients, McASP1 streams processed audio to host MCU.

Use Value: Dual McASP with independent TDM clocks allows synchronized 192-kHz sampling across all mics, eliminating inter-channel skew.

Telecom Baseband Processing Unit Professional Audio Digital Mixer

Use Scenario: Channelized T1/E1 line card performing CAS/CCS signaling, HDLC framing, and PCM transcoding.

IC Role / Device Role / Timing Role: Line interface controller: EMIFA interfaces to FPGA-based framer, McASP0 handles TDM backplane, HPI16 communicates with host ARM processor.

Use Value: HPI-16 + EMIFA coexistence enables parallel control-plane (HPI) and data-plane (EMIFA) traffic without arbitration overhead.

Use Scenario: 32-in/32-out digital mixing console with real-time dynamics processing, EQ, and effects routing.

IC Role / Device Role / Timing Role: Audio stream router and effect accelerator: McASP0 receives analog-to-digital converter outputs, McASP1 drives DACs, L2 RAM hosts 128-band parametric EQ tables.

Use Value: 1024 KB L2 configured as SRAM provides zero-wait-state access to 256 KB of coefficient memory for 32-channel parallel processing.

Equivalent & Alternatives

The following parts are listed as comparable options for similar fixed-point DSP applications.

Alternative Part Technical Difference Application Difference Selection Advice
TMS320C6414GTS500 Same package and pinout; adds 256 KB L2 cache (vs. 1024 KB unified RAM) and EMIF-A only (no EMIF-B) Lower L2 flexibility limits large buffer applications; suitable where cache efficiency outweighs raw SRAM need Select when prioritizing cache-based algorithm reuse over static buffer allocation
TMS320C6416GLZ500 608-pin BGA (GLZ); 1024 KB L2 same, but adds second EMIF (EMIF-B), additional McASP, and 32-bit HPI-32 Supports dual-memory banks and higher I/O bandwidth; requires PCB redesign due to larger package and pin count Choose for scalable systems needing redundant memory paths or expanded audio I/O beyond dual McASP

Compared with TMS320C6413GTS500, the C6414 offers tighter cache coherence for iterative algorithms but sacrifices L2 configurability, while the C6416 provides architectural expansion at the cost of footprint and layout complexity-neither is pin-compatible.

Availability

TMS320C6413GTS500 is available at Aetrix Electronics and suitable for voice-over-IP gateways, industrial voice recognition terminals, and telecom baseband processing units requiring stable component supply, long-term lifecycle assurance, and full traceability from wafer lot to shipment.

Supply support for TMS320C6413GTS500 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity solutions, with decades of DSP innovation rooted in the TMS320 family.

The TMS320C6413GTS500 belongs to TI's C64x+ fixed-point DSP product line, engineered for high-throughput, low-latency signal processing in communications infrastructure, professional audio, and industrial automation where deterministic MIPS and peripheral integration are critical.

FAQ

What is the maximum operating frequency of the TMS320C6413GTS500?

The TMS320C6413GTS500 operates at a guaranteed maximum frequency of 500 MHz, delivering 4000 million instructions per second (MIPS). This rating is validated across the full industrial temperature range (–40°C to 105°C case temperature) and specified under recommended supply conditions: CVDD = 1.2 V ± 3%, DVDD = 3.3 V ± 5%. The device achieves this performance using its C64x+ VLIW core with VelociTI.2™ enhancements and on-chip PLL.

Does the TMS320C6413GTS500 support booting from external flash memory?

Yes, the TMS320C6413GTS500 supports booting from external flash via its EMIFA 8-bit ROM boot mode, enabled by setting AEA[22:21] = 11 at reset. In this mode, the device fetches the boot vector and initial code from address 0x00000000 on the EMIFA data bus, allowing direct execution from parallel NOR flash or SPI flash connected through a glueless interface. Configuration details are documented in Section 4.12 of SPRS247F.

How much on-chip memory does the TMS320C6413GTS500 provide, and how is it allocated?

The TMS320C6413GTS500 integrates 1024 KB of on-chip L2 memory, fully configurable as SRAM or cache, plus 64 KB L1P program cache and 64 KB L1D data cache. Unlike earlier C64x devices, the L2 block is unified and software-managed-no fixed split between instruction and data space. This flexibility allows developers to allocate all 1024 KB as scratch RAM for audio buffers or partition it for mixed code/data use without hardware constraints.

Can the TMS320C6413GTS500 interface directly with SDRAM, and what are the timing requirements?

Yes, the TMS320C6413GTS500's EMIFA includes a dedicated SDRAM controller supporting 16-/32-bit x 1M/2M/4M/8M devices with programmable CAS latency (2 or 3), burst length (1/2/4/8), and refresh intervals. Key timing parameters include tRC ≥ 60 ns, tRCD ≥ 20 ns, and tRP ≥ 20 ns at 500-MHz CPU clock. All SDRAM timing registers (SDRAMCR, SDCR, etc.) are memory-mapped at 0x01800000 and configurable in real time via the DSP's EDMA or CPU.

What peripheral interfaces are available on the TMS320C6413GTS500 for audio applications?

The TMS320C6413GTS500 features two independent Multichannel Audio Serial Ports (McASP0 and McASP1), each supporting 16 transmit and 16 receive channels, TDM, I²S, and custom frame formats. Each McASP includes dedicated clock generators, serializers, and DMA-aware data FIFOs. Additional audio-relevant peripherals include I²C (for CODEC configuration), GPIO (for mute/reset control), and EMIFA (for external audio buffer memory), making the TMS320C6413GTS500 a self-contained audio processing node.

TMS320C6413GTS500 Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
TMS320C6410/12/13/18
Package/Case:
288-BBGA, FCBGA
Packaging:
Bulk
Product Status:
Active
Type:
Fixed Point
Interface:
Host Interface, I2C, McASP, McBSP
Clock Rate:
500MHz
Non-Volatile Memory:
External
On-Chip RAM:
288kB
Voltage - I/O:
3.30V
Voltage - Core:
1.20V
Operating Temperature:
0°C ~ 90°C (TC)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
288-FCBGA (23x23)

TMS320C6413GTS500 FAQ

1.How can I place an order for TMS320C6413GTS500 through Aetrix?

Please submit a Request for Quotation (RFQ) for TMS320C6413GTS500 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TMS320C6413GTS500 reliable?

The price and inventory of TMS320C6413GTS500 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMS320C6413GTS500 is usually 5 days.

3.What payment methods are accepted for TMS320C6413GTS500?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMS320C6413GTS500 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TMS320C6413GTS500?

TMS320C6413GTS500 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TMS320C6413GTS500 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TMS320C6413GTS500?

For technical support, including TMS320C6413GTS500 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMS320C6413GTS500 requirements.

6.How does Aetrix verify that TMS320C6413GTS500 is sourced from the original manufacturer or authorized distributors?

All TMS320C6413GTS500 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMS320C6413GTS500 meets industry standards.

7.What is the process for return or replacement of TMS320C6413GTS500?

All TMS320C6413GTS500 units undergo pre-shipment inspection (PSI). If there is an issue with TMS320C6413GTS500, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TMS320C6413GTS500 part is unused and in its original packaging.

Return procedure for TMS320C6413GTS500:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

TMS320C6413GTS500 Tags

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