Texas Instruments TMS320C6416TBCLZ1

Overview

TMS320C6416TBCLZ1 from Texas Instruments is a 1-GHz fixed-point digital signal processor (DSP) with VelociTI.2™ VLIW architecture, eight functional units (six ALUs, two multipliers), 64 × 32-bit general-purpose registers, and dual on-chip coprocessors (VCP and TCP) for real-time wireless channel decoding. It delivers 8000 MIPS and 8000 MMACS, targeting baseband processing in 3G/UMTS infrastructure.

For engineers reviewing the TMS320C6416TBCLZ1 datasheet, TMS320C6416TBCLZ1 pinout, TMS320C6416TBCLZ1 application, or TMS320C6416TBCLZ1 equivalent, key selection criteria include its 1-GHz clock rate, integrated VCP/TCP acceleration for AMR and 3GPP turbo decoding, 532-pin CLZ BGA package, dual EMIFs (64-bit EMIFA + 16-bit EMIFB), and PCI 2.2 interface support.

Technical Context

The TMS320C6416TBCLZ1 implements a two-level memory hierarchy: 16KB L1P direct-mapped cache, 16KB L1D 2-way set-associative cache, and 1024KB flexible L2 unified RAM/cache. Its CPU executes up to eight 32-bit instructions per cycle using non-aligned load-store architecture and conditional execution across all instructions.

It integrates application-specific hardware including a Viterbi Decoder Coprocessor (VCP) supporting >833 × 7.95-Kbps AMR voice channels and a Turbo Decoder Coprocessor (TCP) handling up to 10 × 2-Mbps or 60 × 384-Kbps 3GPP frames-both programmable for constraint length, code rate, and iteration count, with EDMA-managed data transfer to/from CPU.

Key Specifications

Pinout & Package

532-pin CLZ BGA package (23 mm × 23 mm, 0.8-mm ball pitch), RoHS-compliant, 0.09-µm CMOS process. Thermal pad exposed on underside for enhanced heat dissipation in high-clock-rate operation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar fixed-point DSP applications.

Compared with TMS320C6416TBCLZ1, the TMS320C6416TBCZ1 offers identical functionality in a larger package requiring board rework, while the TMS320C6415TBCZ1 removes critical channel-decoding hardware - making it unsuitable for voice or turbo decode workloads despite shared pinout and software compatibility.

Availability

TMS320C6416TBCLZ1 is available at Aetrix Electronics and suitable for wireless infrastructure, telecom baseband processing, and broadband access gateway applications requiring stable component supply and long-term industrial availability.

Supply support for TMS320C6416TBCLZ1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of leadership in DSP innovation.

The TMS320C64x™ product line was engineered for high-throughput, low-latency signal processing in wireless infrastructure - delivering scalable performance from 600 MHz to 1 GHz with hardware-accelerated channel coding.

FAQ

What is the maximum clock frequency supported by the TMS320C6416TBCLZ1?

The TMS320C6416TBCLZ1 operates at a maximum clock frequency of 1 GHz, achieving 8000 million instructions per second (MIPS) and 8000 million multiply-accumulates per second (MMACS). This rating is validated under recommended operating conditions: 1.2-V core voltage, 3.3-V I/O, and case temperature ≤ 90°C. The device uses an internal PLL with x20 multiplier to generate this frequency from a 50-MHz CLKIN source.

Does the TMS320C6416TBCLZ1 include hardware accelerators for wireless channel decoding?

Yes, the TMS320C6416TBCLZ1 integrates two dedicated coprocessors: the Viterbi Decoder Coprocessor (VCP) and Turbo Decoder Coprocessor (TCP). The VCP supports >833 × 7.95-Kbps AMR voice channels, and the TCP handles up to 10 × 2-Mbps or 60 × 384-Kbps 3GPP frames. Both are fully programmable and communicate with the CPU via the EDMA controller.

What package type and pin count does the TMS320C6416TBCLZ1 use?

The TMS320C6416TBCLZ1 uses a 532-pin CLZ Ball Grid Array (BGA) package with 23 mm × 23 mm body size and 0.8-mm ball pitch. It is RoHS-compliant and fabricated on TI's 0.09-µm CMOS process. The CLZ suffix denotes the specific thermal and mechanical variant optimized for high-frequency signal integrity and thermal dissipation.

Is the TMS320C6416TBCLZ1 pin-compatible with other C641xT devices?

Yes, the TMS320C6416TBCLZ1 is pin-for-pin compatible with the TMS320C6414T and TMS320C6415T when configured identically - specifically, with PCI and UTOPIA peripherals disabled on the latter two. Pin compatibility assumes matching BEA[9:7] strap configurations and consistent peripheral selection mode across devices.

What memory architecture does the TMS320C6416TBCLZ1 implement?

The TMS320C6416TBCLZ1 features a two-level memory hierarchy: 16KB L1P direct-mapped program cache, 16KB L1D 2-way set-associative data cache, and 1024KB unified L2 memory that can be flexibly allocated between mapped RAM and cache (up to 256KB cache). This architecture balances low-latency access with large working memory for complex signal processing kernels.