Texas Instruments TMS320C6416TBGLZA8

Overview

TMS320C6416TBGLZA8 from Texas Instruments is a 1-GHz fixed-point digital signal processor (DSP) with VelociTI.2™ VLIW architecture, eight functional units (six ALUs + two multipliers), 16KB L1P/L1D caches, and 1024KB unified L2 RAM/cache. It integrates VCP and TCP coprocessors for real-time AMR and 3GPP channel decoding, targeting wireless baseband processing in telecom infrastructure.

For engineers reviewing the TMS320C6416TBGLZA8 datasheet, TMS320C6416TBGLZA8 pinout, TMS320C6416TBGLZA8 application, or TMS320C6416TBGLZA8 equivalent, key selection criteria include its 8000 MIPS throughput, dual EMIFs (64-bit EMIFA + 16-bit EMIFB), PCI 2.2 interface, UTOPIA Level 2 slave support, and 532-pin GLZ BGA package with 0.8-mm pitch.

Technical Context

The TMS320C6416TBGLZA8 implements a two-side CPU core with 64 × 32-bit general-purpose registers, non-aligned load-store architecture, and instruction packing enabling variable-length execute packets across fetch boundaries. Its VelociTI.2™ extensions deliver quad-8-bit and dual-16-bit arithmetic per cycle alongside 32-bit operations.

It features dedicated hardware acceleration via VCP (supporting >833 × 7.95-Kbps AMR voice channels at CPU/4 clock) and TCP (supporting up to 60 × 384-Kbps or 10 × 2-Mbps 3GPP turbo decoding at CPU/2), both interfaced via EDMA. Memory hierarchy includes direct-mapped L1P, 2-way set-associative L1D, and flexible L2 allocation between cache and mapped RAM.

Key Specifications

Pinout & Package

532-pin Ball Grid Array (BGA) package with GLZ suffix, 23 mm × 23 mm footprint, 0.8-mm ball pitch, and 0.09-µm CMOS process. Designed for high-density telecom PCB layouts with thermal and signal integrity optimization.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar fixed-point DSP applications.

Compared with TMS320C6416TBGLZA8, the TMS320C6415TBGLZA8 removes hardware channel-decoding acceleration but retains full software compatibility, while the TMS320C6416TGBZUA8 offers identical functionality in an equivalent ZLZ-package variant-both require no PCB redesign but serve distinct supply-chain or feature requirements.

Availability

TMS320C6416TBGLZA8 is available at Aetrix Electronics and suitable for wireless infrastructure, telecom baseband processing, and industrial edge analytics requiring stable component supply over extended product lifecycles.

Supply support for TMS320C6416TBGLZA8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of leadership in DSP innovation.

The TMS320C64x™ platform was engineered specifically for high-throughput, low-latency wireless infrastructure applications, emphasizing hardware-accelerated channel coding, scalable memory architecture, and multi-standard protocol support.

FAQ

What is the maximum clock frequency supported by the TMS320C6416TBGLZA8?

The TMS320C6416TBGLZA8 operates at a guaranteed maximum clock frequency of 1 GHz, delivering 8000 million instructions per second (MIPS) and 8000 million multiply-accumulates per second (MMACS) for 8-bit operations. This rating is validated across commercial temperature range (0°C to 90°C) with 1.2-V core supply and 3.3-V I/O.

Does the TMS320C6416TBGLZA8 include hardware accelerators for wireless channel decoding?

Yes, the TMS320C6416TBGLZA8 integrates two dedicated coprocessors: the Viterbi Decoder Coprocessor (VCP) supporting >833 concurrent 7.95-Kbps AMR voice channels, and the Turbo Decoder Coprocessor (TCP) handling up to 60 × 384-Kbps or 10 × 2-Mbps 3GPP-compliant turbo decoding. Both operate independently of the main CPU and communicate via EDMA.

What package type and pin count does the TMS320C6416TBGLZA8 use?

The TMS320C6416TBGLZA8 uses a 532-pin Ball Grid Array (BGA) package with GLZ suffix, measuring 23 mm × 23 mm with 0.8-mm ball pitch. It is mechanically and electrically identical to ZLZ/CLZ variants, sharing the same footprint, thermal profile, and solder-reflow specifications.

Is the TMS320C6416TBGLZA8 pin-compatible with other C64xT devices?

Yes, the TMS320C6416TBGLZA8 is pin-for-pin compatible with TMS320C6414TBGLZA8 and TMS320C6415TBGLZA8 when configured identically-specifically, with PCI and UTOPIA peripherals disabled on the latter two. Pin compatibility requires proper BEA[9:7] strap configuration and matching peripheral selection mode.

What memory interfaces does the TMS320C6416TBGLZA8 support?

The TMS320C6416TBGLZA8 features two external memory interfaces: a 64-bit EMIFA supporting SDRAM, ZBT SRAM, and FIFO, and a 16-bit EMIFB for smaller peripherals or auxiliary memory. Together they provide up to 1280 MB of addressable external space, with glueless operation eliminating need for address latches or bus transceivers.