Texas Instruments TMS320C6452ZUT9
- Part No.:
- TMS320C6452ZUT9
- Manufacturer:
- Texas Instruments
- Category:
- DSP (Digital Signal Processors)
- Package:
- 529-BFBGA
- Datasheet:
-
TMS320C6452ZUT9.pdf
- Description:
- IC FIXED-POINT DSP 529-FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
TMS320C6452ZUT9 from Texas Instruments is a high-performance fixed-point digital signal processor (DSP) based on the C64x+™ VLIW architecture, operating at 900 MHz with 7200 MIPS and 8800 MMACS (8×8-bit), featuring 32KB L1P direct-mapped cache, 32KB L1D 2-way set-associative cache, and 1408KB unified L2 RAM/cache. It integrates a 3-port Gigabit Ethernet switch subsystem, DDR2 SDRAM controller, EMIFA, McASP, TSIP, PCI, VLYNQ, and HPI-targeting real-time radar, medical imaging, and telecom infrastructure.
For engineers reviewing the TMS320C6452ZUT9 datasheet, TMS320C6452ZUT9 pinout, TMS320C6452ZUT9 application, or TMS320C6452ZUT9 equivalent, key selection criteria include its 900-MHz C64x+ core performance, 529-pin nFBGA (ZUT) package with 19×19 mm 0.8-mm pitch, dual-voltage operation (1.2-V core / 1.8-V & 3.3-V I/O), and support for industrial temperature range (–40°C to 105°C).
Technical Context
The TMS320C6452ZUT9 implements an eight-functional-unit C64x+ DSP core with six ALUs and two multipliers, enabling four 16×16-bit or eight 8×8-bit MACs per cycle. Its memory subsystem uses a two-level cache hierarchy: L1P (256K-bit direct-mapped), L1D (256K-bit 2-way set-associative), and flexible 1408KB L2 configurable as RAM, cache, or hybrid.
Peripherals include a 3-port Ethernet switch with dual SGMII interfaces and MDIO management, a 32-bit DDR2 SDRAM controller supporting 512MB address space, asynchronous 16-bit EMIFA with glueless SRAM/Flash interface, and rich I/O including McASP (10 serializers + SPDIF), dual TSIP, UART with flow control, SPI, I²C, 32 GPIO, and 64-bit HPI-designed for deterministic real-time media and signal processing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Clock Rate | 900 MHz (–900 suffix); enables 7200 MIPS and 8800 MMACS for intensive real-time filtering and FFT workloads. |
| L1 Memory | 32KB L1P (direct-mapped cache) + 32KB L1D (2-way set-associative cache); minimizes instruction/data fetch latency in tight loops. |
| L2 Memory | 1408KB unified RAM/cache; configurable allocation between program/data space supports large algorithm buffers without external DRAM access. |
| External Memory | 32-bit DDR2 SDRAM controller (1.8-V I/O, 512MB space) + 16-bit EMIFA (asynchronous/synchronous); enables high-bandwidth baseband and video frame buffering. |
| Peripherals | 3-port Gigabit Ethernet switch (dual SGMII + MDIO), McASP (10 serializers + SPDIF), dual TSIP, PCI33/66, VLYNQ, HPI; supports multi-protocol backhaul and sensor fusion I/O. |
| Package & Temp | 529-pin nFBGA (ZUT), 19×19 mm, 0.8-mm pitch; rated for industrial temperature (–40°C to 105°C), suitable for deployed radar and medical equipment. |
| Power Supply | 1.2-V core, 1.8-V and 3.3-V I/O; supports low-power active modes and dynamic voltage scaling for thermal-constrained embedded systems. |
Pinout & Package
529-pin nFBGA (ZUT) package, 19×19 mm body, 0.8 mm ball pitch, RoHS-compliant, designed for high-density PCB layouts in industrial and aerospace applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_CORE | Core power supply | 1.2-V regulated input powering C64x+ CPU, L1/L2 memory, and internal logic; requires low-noise decoupling near package. |
| VDD_I/O | I/O power supply | 1.8-V or 3.3-V selectable rail powering DDR2, EMIFA, McASP, GPIO, and peripheral I/O banks; supports mixed-voltage system interfacing. |
| CLKIN1 | Main oscillator input | Accepts 12–50 MHz crystal or clock source; feeds PLL1 for generating 900-MHz SYSCLK via x15–x32 multiplication. |
| DDR2_DQ[31:0] | DDR2 data bus | 32-bit bidirectional data interface to DDR2 SDRAM; requires matched-length routing and termination for 400-MHz data rates. |
| EMIFA_A[22:0] | EMIFA address bus | 23-bit address lines for asynchronous/synchronous memory mapping across up to 128MB total reach (64MB per CE space). |
| TSIP0_CLK / TSIP0_FS | Telecom serial interface clock/frame sync | Dedicated timing signals for TDM voice/data framing on TSIP0 port; supports E1/T1 and JTAG-compatible test modes. |
| MDIO / MDC | Management Data I/O interface | IEEE 802.3-compliant MDIO/MDC pair for auto-discovery and configuration of up to 32 PHY devices in Ethernet switch topology. |
Key Features
| Feature | Design Value |
|---|---|
| VelociTI.2™ VLIW Architecture | Eight independent functional units execute up to eight 32-bit instructions/cycle; enables parallelized signal processing kernels without manual assembly scheduling. |
| EDMA3 Controller | 64 independent channels with QDMA support; offloads CPU from memory moves during real-time audio/video streaming and packet buffering. |
| McASP with SPDIF | 10 programmable serializers supporting TDM, I²S, and DIT (SPDIF) modes; enables direct connection to ADC/DACs and digital audio transceivers without FPGA glue logic. |
| 3-Port Ethernet Switch Subsystem | Integrated switch fabric with dual SGMII ports and MDIO management; eliminates external switch IC in compact base stations and edge routers. |
| Flexible Boot Options | On-chip ROM bootloader supports boot from NAND/NOR flash, SPI EEPROM, I²C EEPROM, or HPI; simplifies field firmware updates and secure boot design. |
| Advanced Power Management | Multiple low-power states (IDLE, STANDBY, DEEPSLEEP) controlled via PSC; reduces active power in burst-mode radar and battery-backed medical diagnostics. |
Applications
| Radar Signal Processing | Medical Imaging Acceleration |
|---|---|
Use Scenario: Real-time pulse-Doppler processing in airborne SAR systems with sub-microsecond latency requirements. IC Role / Device Role / Timing Role: Primary compute engine executing CFAR, beamforming, and FFT-based range-Doppler mapping in deterministic time slots. Use Value: 900-MHz C64x+ core delivers 8800 MMACS for 16-bit complex FFTs; L2 RAM holds full chirp buffers; McASP streams ADC samples directly. |
Use Scenario: High-resolution ultrasound image reconstruction with real-time B-mode and Doppler overlay on portable diagnostic units. IC Role / Device Role / Timing Role: Dedicated DSP coprocessor handling beam synthesis, envelope detection, and color-flow mapping while host ARM handles UI. Use Value: Dual TSIP ports interface to analog front-end ASICs; DDR2 controller sustains 1.6 GB/s pixel throughput; EDMA3 manages DMA from multiple ADC channels. |
| Industrial Machine Vision | Secure Telecom Gateway |
Use Scenario: Embedded vision inspection system performing real-time defect classification on PCB assemblies using CNN inference kernels. IC Role / Device Role / Timing Role: Fixed-point accelerator running optimized TI C64x+ libraries for convolution, histogram equalization, and blob analysis. Use Value: L1P/L1D caches minimize instruction/data stalls; GPIO pins trigger strobes and capture encoder position; EMIFA connects to local frame buffer SRAM. |
Use Scenario: Multi-protocol VoIP gateway aggregating T1/E1 trunks, SIP signaling, and encrypted media streams for enterprise PBX. IC Role / Device Role / Timing Role: Central media processor handling transcoding, echo cancellation, jitter buffering, and packet switching via integrated Ethernet switch. Use Value: TSIP0/TSIP1 handle 32-channel TDM; PCI interface connects to host x86 controller; VLYNQ links to FPGA-based crypto accelerator. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar fixed-point DSP applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMS320C6455ZUT9 | Higher L2 (2048KB vs. 1408KB), same 900-MHz C64x+ core, identical ZUT package and pinout. | Better suited for larger FFTs, multi-channel radar, or video codecs requiring >1.4MB on-chip memory. | Select TMS320C6455ZUT9 when algorithm memory footprint exceeds 1408KB and board layout must remain unchanged. |
| TMS320C6678ACYPA | Multi-core (8× C66x), 1.25-GHz/core, 40-GMACS, KeyStone architecture, 17-mm × 17-mm BGA (CYPA). | Targets massively parallel tasks (e.g., MIMO beamforming, deep learning inference) where single-core throughput is insufficient. | Choose TMS320C6678ACYPA only if workload scales across cores and redesign for new package/power/thermal constraints is acceptable. |
Compared with TMS320C6452ZUT9, the TMS320C6455ZUT9 offers drop-in memory expansion within identical mechanical and electrical constraints, while the TMS320C6678ACYPA introduces architectural divergence-requiring full software re-architecture and PCB revision-but delivers order-of-magnitude higher throughput for scalable parallel workloads.
Availability
TMS320C6452ZUT9 is available at Aetrix Electronics and suitable for radar signal processing, medical imaging acceleration, industrial machine vision, and secure telecom gateway applications requiring stable component supply, long-term industrial temperature support, and mature DSP toolchain compatibility.
Supply support for TMS320C6452ZUT9 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and digital signal processing technologies, with decades of heritage in high-reliability DSP platforms for industrial and mission-critical systems.
The TMS320C6452ZUT9 belongs to TI's C6000™ DSP platform, engineered for deterministic, high-throughput fixed-point signal processing in radar, medical imaging, and telecom infrastructure-emphasizing real-time performance, peripheral integration, and industrial-grade robustness.
FAQ
What is the maximum operating frequency of the TMS320C6452ZUT9?
The TMS320C6452ZUT9 operates at a maximum clock rate of 900 MHz (denoted by the "–900" speed grade), delivering 7200 MIPS and 8800 MMACS (8×8-bit). This frequency is achieved using the on-chip PLL1 with CLKIN1 multiplied by 18–32, and is validated for industrial temperature range (–40°C to 105°C). The TMS320C6452ZUT9 datasheet specifies 1.11 ns instruction cycle time at this speed.
Does the TMS320C6452ZUT9 support DDR2 memory interfacing?
Yes, the TMS320C6452ZUT9 integrates a dedicated 32-bit DDR2 SDRAM memory controller supporting 1.8-V I/O, 512MB address space, and JEDEC-compliant timing. It drives DDR2-800 (400 MHz clock) with full command/address/data bus separation and on-die termination control-enabling high-bandwidth frame storage for radar and video applications without external memory controllers.
What peripherals are included in the TMS320C6452ZUT9 for audio and telecom applications?
The TMS320C6452ZUT9 includes a multichannel audio serial port (McASP) with ten serializers supporting TDM, I²S, and SPDIF (DIT) modes; two telecom serial interface ports (TSIP0/TSIP1) for E1/T1 framing; and an I²C bus for codec configuration. These enable direct connection to ADCs, DACs, line interface units, and voice processing peripherals in medical ultrasound and VoIP gateways.
Is the TMS320C6452ZUT9 pin-compatible with other C645x devices?
Yes, the TMS320C6452ZUT9 shares the same 529-pin nFBGA (ZUT) package, pinout, and power sequencing with the TMS320C6455ZUT9 and TMS320C6457ZUT9. All three support identical voltage rails (1.2-V core, 1.8-V/3.3-V I/O), thermal pad layout, and JTAG boundary-scan configuration-allowing drop-in replacement where L2 memory size or peripheral enablement permits.
What boot options does the TMS320C6452ZUT9 support?
The TMS320C6452ZUT9 features an on-chip ROM bootloader that supports boot from NAND Flash, NOR Flash, SPI EEPROM, I²C EEPROM, or Host Port Interface (HPI). Boot mode is selected via strap pins (BOOTMODE[4:0]), and the bootloader validates image integrity before execution-enabling secure, field-upgradable firmware deployment in medical and defense systems.
TMS320C6452ZUT9 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- TMS320C645x
- Package/Case:
- 529-BFBGA
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Type:
- Fixed Point
- Interface:
- Host Interface, I2C, McASP, PCI, UART
- Clock Rate:
- 900MHz
- Non-Volatile Memory:
- ROM (64kB)
- On-Chip RAM:
- 1.375MB
- Voltage - I/O:
- 1.8V, 3.3V
- Voltage - Core:
- 1.20V
- Operating Temperature:
- 0°C ~ 90°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 529-FCBGA (19x19)
TMS320C6452ZUT9 FAQ
1.How can I place an order for TMS320C6452ZUT9 through Aetrix?
Please submit a Request for Quotation (RFQ) for TMS320C6452ZUT9 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TMS320C6452ZUT9 reliable?
The price and inventory of TMS320C6452ZUT9 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMS320C6452ZUT9 is usually 5 days.
3.What payment methods are accepted for TMS320C6452ZUT9?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMS320C6452ZUT9 transactions.
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4.How is shipping managed for TMS320C6452ZUT9?
TMS320C6452ZUT9 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TMS320C6452ZUT9 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TMS320C6452ZUT9?
For technical support, including TMS320C6452ZUT9 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMS320C6452ZUT9 requirements.
6.How does Aetrix verify that TMS320C6452ZUT9 is sourced from the original manufacturer or authorized distributors?
All TMS320C6452ZUT9 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMS320C6452ZUT9 meets industry standards.
7.What is the process for return or replacement of TMS320C6452ZUT9?
All TMS320C6452ZUT9 units undergo pre-shipment inspection (PSI). If there is an issue with TMS320C6452ZUT9, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TMS320C6452ZUT9 part is unused and in its original packaging.
Return procedure for TMS320C6452ZUT9:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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