My Inquiry
My Account
Texas Instruments TMS320C6454BZTZ7
- Part No.:
- TMS320C6454BZTZ7
- Manufacturer:
- Texas Instruments
- Category:
- DSP (Digital Signal Processors)
- Package:
- 697-BFBGA, FCBGA
- Datasheet:
-
TMS320C6454BZTZ7.pdf
- Description:
- IC FIXED-POINT DSP 697-FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,726
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TMS320C6454BZTZ7 from Texas Instruments is a high-performance fixed-point digital signal processor (DSP) based on the C64x+™ VLIW architecture, operating at 1 GHz with 8000 MIPS/8000 MMACs (16-bit), featuring 32KB L1P cache, 32KB L1D cache, and 1048KB L2 unified memory, used in video infrastructure, telecom baseband processing, and industrial imaging systems.
For engineers reviewing the TMS320C6454BZTZ7 datasheet, TMS320C6454BZTZ7 pinout, TMS320C6454BZTZ7 application, or TMS320C6454BZTZ7 equivalent, key selection criteria include its 1-GHz CPU clock, DDR2-533 memory controller, EMAC supporting RGMII/GMII/MII/RMII, PCI 2.3 compliance, and 697-pin BGA package with 0.8-mm pitch.
Technical Context
The TMS320C6454BZTZ7 implements an eight-functional-unit C64x+™ DSP core with dual 32-bit register files and two data paths, enabling eight 32-bit instructions per cycle. Its SPLOOP instruction buffer supports software-pipelined loops with full interruptibility and compact 16-bit instruction encoding for code density.
Memory hierarchy includes direct-mapped 32KB L1P (program), 2-way set-associative 32KB L1D (data), and flexible 1048KB L2 unified RAM/cache, managed by dedicated L1/L2 memory controllers with bandwidth management and protection. The device integrates dual PLLs - PLL1 for system clock generation and PLL2 dedicated to DDR2 and EMAC subsystems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Clock Rate | 1 GHz - enables 8000 MIPS/8000 16-bit MMACs per second for real-time video encode/decode and baseband signal processing. |
| L1 Memory | 32KB L1P (direct-mapped cache) + 32KB L1D (2-way set-associative cache) - reduces instruction/data fetch latency without external SRAM dependency. |
| L2 Memory | 1048KB unified RAM/cache - configurable allocation between program/data space, supporting large algorithm buffers and OS footprint. |
| DDR2 Interface | 32-bit, 533-MHz data rate (DDR2-533) - delivers up to 4.26 GB/s bandwidth for high-throughput frame buffering and streaming applications. |
| EMAC Interface | 10/100/1000 Mb/s with RGMII/GMII/MII/RMII support - provides low-latency, standards-compliant packet I/O for IP-based media transport and control plane communication. |
| PCI Interface | 32-bit, 66-MHz, PCI Local Bus Specification v2.3 compliant - enables legacy host connectivity and high-bandwidth peripheral bridging without glue logic. |
| Package | 697-pin BGA (ZTZ suffix), 24 × 24 mm, 0.8-mm ball pitch - supports high I/O count while meeting thermal and routing constraints in dense DSP carrier boards. |
Pinout & Package
697-pin Flip-Chip Plastic BGA (ZTZ package), 24 mm × 24 mm body, 0.8-mm ball pitch, RoHS-compliant. Ball grid organized in 27 × 27 array with corner balls omitted; thermal pad centered on underside.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKIN1 | Primary oscillator input | Accepts 12–50 MHz crystal or LVCMOS clock; feeds PLL1 for system clock derivation (e.g., 1-GHz CPU clock). |
| CLKIN2 | Secondary oscillator input | Drives PLL2 dedicated to DDR2 memory controller and EMAC, enabling independent frequency scaling of memory/peripheral domains. |
| AECLKIN | EMIFA clock input | Provides asynchronous timing reference for 64-bit external memory interface (SRAM/Flash/SBSRAM), decoupled from CPU clock domain. |
| MDIO | Management Data I/O | Single-wire interface for auto-discovery and configuration of up to 32 Ethernet PHY devices via EMAC MDIO module. |
| HPI[31:0] | Host-port interface bus | 32-bit parallel interface supporting DMA-capable host access to internal memory and registers; multiplexed with PCI pins. |
| GPIO[15:0] | General-purpose I/O | 16 programmable pins with interrupt/event generation capability - used for board-level status signaling, reset coordination, or peripheral handshaking. |
Key Features
| Feature | Design Value |
|---|---|
| EDMA3 Controller | 64 independent channels with QDMA and parameter RAM - enables zero-CPU-overhead data movement between L2, DDR2, EMAC, McBSP, and peripherals. |
| McBSP Interfaces | Two multichannel buffered serial ports supporting TDM, AC97, SPI, and codec interfacing - used for audio capture/playback and sensor data acquisition. |
| I²C Module | Standard-mode (100 kHz) and fast-mode (400 kHz) master-only interface - simplifies control of PMICs, temperature sensors, and EEPROMs without GPIO bit-banging. |
| Timer Subsystem | Two 64-bit timers configurable as four 32-bit timers or watchdog units - provides precise time-stamping, PWM generation, and system health monitoring. |
| Trace Support | IEEE-1149.1 JTAG boundary-scan + real-time trace-enabled debug port - enables non-intrusive instruction-level tracing and hardware-assisted profiling. |
Applications
| Video Surveillance Encoder | Wireless Baseband Processor |
|---|---|
Use Scenario: Real-time H.264 encoding of multiple 1080p video streams in edge AI cameras. IC Role / Device Role / Timing Role: Primary compute engine executing motion estimation, DCT, quantization, and entropy coding kernels with deterministic latency. Use Value: 8000 MMACs at 1 GHz and DDR2-533 bandwidth enable concurrent multi-stream compression without external co-processors. |
Use Scenario: Layer-1 processing in LTE femtocell base stations handling channel estimation, FFT/IFFT, and turbo decoding. IC Role / Device Role / Timing Role: Fixed-point DSP accelerator offloading PHY-layer math-intensive operations from ARM host. Use Value: C64x+ instruction enhancements (complex multiply, packed 8/16-bit ops) accelerate OFDM symbol processing within subframe deadlines. |
| Medical Ultrasound Beamformer | Industrial Vision Controller |
Use Scenario: Digital beamforming and RF echo processing in portable ultrasound systems. IC Role / Device Role / Timing Role: Real-time FIR filtering, delay-and-sum beam synthesis, and envelope detection on channelized ADC data. Use Value: L1/L2 memory hierarchy and EDMA3 enable low-latency, cache-coherent access to large coefficient tables and line buffers. |
Use Scenario: High-speed inspection of PCB assemblies using line-scan camera and real-time defect classification. IC Role / Device Role / Timing Role: Image preprocessing pipeline (filtering, thresholding, blob analysis) coupled with Gigabit Ethernet output. Use Value: Integrated EMAC with RGMII and 1-GHz CPU deliver deterministic 1 Gbps image streaming to host PC without PCIe bridge. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar fixed-point DSP applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMS320C6455BZTZ7 | 2MB L2 memory (vs. 1048KB), Serial RapidIO interface, higher cost; identical CPU, DDR2, EMAC, and package. | Required for systems needing >1MB on-chip memory or chip-to-chip interconnect beyond PCI/EMAC. | Select C6455 only if L2 capacity or RapidIO is mandatory; C6454 offers lower BOM cost for DDR2/EMAC-focused designs. |
| TMS320C6416TBZLZ7 | Older C64x core, 720 MHz max, no DDR2 controller, 133-MHz SDRAM interface, smaller 361-pin BGA. | Suitable for legacy upgrades where bandwidth and peripheral count are constrained; lacks gigabit Ethernet and modern memory interface. | Choose C6416T only for cost-sensitive, lower-throughput applications where DDR2/EMAC are unnecessary. |
Compared with TMS320C6455BZTZ7, the TMS320C6454BZTZ7 trades L2 capacity and Serial RapidIO for lower cost and identical DDR2/EMAC/PCI performance; versus TMS320C6416TBZLZ7, it delivers 39% higher MIPS, modern memory interface, and integrated gigabit MAC - making it optimal for new designs requiring balanced compute, I/O, and cost.
Availability
TMS320C6454BZTZ7 is available at Aetrix Electronics and suitable for video infrastructure, wireless baseband, and industrial imaging applications requiring stable component supply, long-term lifecycle support, and qualified industrial-temperature operation (-40°C to 105°C).
Supply support for TMS320C6454BZTZ7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of DSP innovation and broad industrial qualification.
The TMS320C6454 belongs to TI's C6000™ DSP platform, designed specifically for high-throughput, deterministic fixed-point signal processing in video, telecom, medical, and industrial real-time systems.
FAQ
What is the maximum operating temperature range for the TMS320C6454BZTZ7?
The TMS320C6454BZTZ7 is rated for extended temperature operation from –40°C to +105°C, validated per TI's production data specifications. This makes it suitable for industrial and outdoor deployment where ambient conditions exceed commercial-grade limits. The ZTZ suffix explicitly denotes the extended-temperature variant, and thermal design must account for 1.25-V core and 1.8-V/3.3-V I/O supply derating above 85°C case temperature.
Does the TMS320C6454BZTZ7 support boot from NAND flash?
No, the TMS320C6454BZTZ7 does not natively support NAND flash boot. Its hardware boot modes include EMIF (CE0/CE1), HPI, and PCI; NAND requires software-based initialization via the on-chip ROM bootloader, which lacks built-in NAND drivers. External FPGA or companion MCU is required for NAND boot sequences. Supported external memory boot sources are NOR flash, SRAM, and SBSRAM connected to EMIFA CE2–CE5.
How many independent clock domains does the TMS320C6454BZTZ7 implement?
The TMS320C6454BZTZ7 implements three independent clock domains: (1) CPU/system domain driven by PLL1 (1 GHz), (2) DDR2/EMAC domain driven by PLL2 (derived from CLKIN2), and (3) EMIFA domain optionally driven by AECLKIN. This separation allows dynamic power management, asynchronous memory interfacing, and jitter-isolated peripheral operation - critical for mixed-signal systems with sensitive analog front-ends.
Can the TMS320C6454BZTZ7 execute code directly from DDR2 SDRAM?
No, the TMS320C6454BZTZ7 cannot execute code directly from DDR2 SDRAM. Its program fetch path is restricted to L1P cache, L2 memory, internal ROM, or EMIFA-connected memories (NOR/SRAM). DDR2 is mapped exclusively to data space (E000 0000–FFFF FFFF) and lacks instruction prefetch capability. Code must be loaded into L2 or EMIFA memory at boot or runtime before execution.
Is the TMS320C6454BZTZ7 pin-compatible with the TMS320C6455BZTZ7?
Yes, the TMS320C6454BZTZ7 is fully pin-compatible with the TMS320C6455BZTZ7 in the same ZTZ package - identical ball map, power/ground assignments, and signal definitions. Functional differences (e.g., absence of Serial RapidIO, reduced L2 size) do not affect PCB layout. Migration requires only firmware and memory map updates; no hardware revision is needed.
TMS320C6454BZTZ7 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- TMS320C645x
- Package/Case:
- 697-BFBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Discontinued at Digi-Key
- Type:
- Fixed Point
- Interface:
- Host Interface, I2C, McBSP, PCI, 10/100/1000 Ethernet MAC
- Clock Rate:
- 720MHz
- Non-Volatile Memory:
- ROM (32kB)
- On-Chip RAM:
- 1.08MB
- Voltage - I/O:
- 1.2V, 1.5V, 1.8V, 3.3V
- Voltage - Core:
- 1.20V
- Operating Temperature:
- 0°C ~ 90°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 697-FCBGA (24x24)
TMS320C6454BZTZ7 FAQ
1.How can I place an order for TMS320C6454BZTZ7 through Aetrix?
Please submit a Request for Quotation (RFQ) for TMS320C6454BZTZ7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TMS320C6454BZTZ7 reliable?
The price and inventory of TMS320C6454BZTZ7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMS320C6454BZTZ7 is usually 5 days.
3.What payment methods are accepted for TMS320C6454BZTZ7?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMS320C6454BZTZ7 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TMS320C6454BZTZ7?
TMS320C6454BZTZ7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TMS320C6454BZTZ7 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TMS320C6454BZTZ7?
For technical support, including TMS320C6454BZTZ7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMS320C6454BZTZ7 requirements.
6.How does Aetrix verify that TMS320C6454BZTZ7 is sourced from the original manufacturer or authorized distributors?
All TMS320C6454BZTZ7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMS320C6454BZTZ7 meets industry standards.
7.What is the process for return or replacement of TMS320C6454BZTZ7?
All TMS320C6454BZTZ7 units undergo pre-shipment inspection (PSI). If there is an issue with TMS320C6454BZTZ7, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TMS320C6454BZTZ7 part is unused and in its original packaging.
Return procedure for TMS320C6454BZTZ7:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TMS320C6454BZTZ7 Tags
-
TMS320C5535AZAY10
Texas Instruments
-
TMS320VC5501PGF300
Texas Instruments
-
ADSP-BF592KCPZ
Analog Devices Inc.
-
ADAU1463WBCPZ150
Analog Devices Inc.
-
TMS320VC5402PGE100
Texas Instruments
-
ADAU1701JSTZ-RL
Analog Devices Inc.
-
ADAU1701JSTZ
Analog Devices Inc.
-
TMS320VC5502PGF300
Texas Instruments
-
ADAU1462WBCPZ300RL
Analog Devices Inc.
-
ADAU1452KCPZRL
Analog Devices Inc.
-
ADAU1452WBCPZ-RL
Analog Devices Inc.
-
TMS320C6747DZKB3
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
