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Texas Instruments TMS320C6454BZTZ8

Part No.:
TMS320C6454BZTZ8
Manufacturer:
Texas Instruments
Category:
DSP (Digital Signal Processors)
Package:
697-BFBGA, FCBGA
Datasheet:
AetrixTMS320C6454BZTZ8.pdf
Description:
IC FIXED-POINT DSP 697-FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,969

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Product details

Overview

TMS320C6454BZTZ8 from Texas Instruments is a high-performance fixed-point digital signal processor (DSP) based on the C64x+™ VLIW architecture, operating at 1 GHz with 8000 MIPS/8000 MMACs (16-bit), featuring 32KB L1P cache, 32KB L1D cache, and 1048KB L2 unified memory, deployed in telecom infrastructure, video processing, and wireless baseband systems.

For engineers reviewing the TMS320C6454BZTZ8 datasheet, TMS320C6454BZTZ8 pinout, TMS320C6454BZTZ8 application, or TMS320C6454BZTZ8 equivalent, key selection criteria include its 1-GHz clock rate, DDR2-533 memory controller, EMAC supporting RGMII/GMII/MII/RMII, PCI 2.3 compliance, and 697-pin BGA (ZTZ) package with 0.8-mm pitch.

Technical Context

The TMS320C6454BZTZ8 implements an eight-functional-unit C64x+™ DSP core with dual 32-bit register files and two data paths, enabling eight 32-bit instructions per cycle. Its EDMA3 controller provides 64 independent channels for zero-overhead data movement between peripherals and memory.

It integrates dedicated PLL1 for system clock generation and PLL2 exclusively for DDR2 and EMAC subsystems, ensuring timing isolation. Memory hierarchy includes direct-mapped L1P (32KB), 2-way set-associative L1D (32KB), and flexible L2 (1048KB) configurable as RAM/cache, plus 32KB ROM for boot code.

Key Specifications

Parameter Value and Actual Design Meaning
Clock Rate 1 GHz - enables 8000 MIPS/8000 16-bit MMACs per second for real-time video encoding and baseband processing.
L1 Memory 32KB L1P (direct-mapped cache) + 32KB L1D (2-way set-associative cache) - reduces instruction/data access latency to sub-2-cycle average.
L2 Memory 1048KB unified L2 RAM/cache - supports large algorithm buffers and firmware storage without external memory access.
DDR2 Interface 32-bit DDR2-533 controller (1.8-V I/O) - delivers up to 4.26 GB/s bandwidth for high-throughput streaming applications.
EMAC 10/100/1000 Mb/s Ethernet MAC with RGMII/GMII/MII/RMII support - enables direct PHY interfacing for packet-based media transport.
PCI Interface 32-bit, 66-MHz PCI v2.3 master/slave - provides legacy backplane connectivity for modular telecom line cards.
Package 697-pin ZTZ BGA, 24 × 24 mm, 0.8-mm ball pitch - requires standard fine-pitch PCB assembly with thermal via design for 1-GHz operation.

Pinout & Package

697-pin Flip-Chip Plastic BGA (ZTZ package), 24 × 24 mm body, 0.8-mm ball pitch, RoHS-compliant. Pinout defined per TI SPRS311I Figure 1-1 (bottom view) and Section 2.5 "Pin Assignments".

Pin/Terminal Circuit Role Design Meaning
CLKIN1 Primary oscillator input Accepts 20–50 MHz crystal or LVCMOS clock; feeds PLL1 for system clock generation.
CLKIN2 DDR2/EMAC clock source Drives PLL2 to generate synchronized clocks for DDR2 SDRAM and EMAC subsystems.
AECLKIN EMIFA clock input Provides timing reference for 64-bit asynchronous/synchronous peripheral interface (SRAM, Flash, FPGA).
MDIO / MDC PHY management interface Enables auto-discovery and configuration of up to 32 IEEE 802.3-compliant PHY devices via MDIO bus.
HPI[31:0] Host-port interface bus 32-bit multiplexed address/data bus for host CPU firmware loading and runtime register access.
GPIO[15:0] General-purpose I/O 16 programmable pins with interrupt/event generation; used for board-level status signaling and control sequencing.

Key Features

Feature Design Value
SPLOOP instruction buffer Reduces software-pipelined loop overhead by 30–40% and maintains full interruptibility during execution.
Compact 16-bit instructions Cuts code size by ~25% for common ALU operations while preserving full 32-bit instruction capability.
Dual 64-bit timers Configurable as four independent 32-bit timers or watchdogs - supports precise time-stamping and system health monitoring.
EDMA3 with 64 channels Enables concurrent transfers across EMAC, McBSP, DDR2, and EMIFA without CPU intervention.
Trace-enabled debug Supports real-time instruction trace via JTAG for deterministic performance analysis and RTOS debugging.

Applications

Telecom Base Station Processing HD Video Encoder/Decoder

Use Scenario: Real-time channelization, modulation (QAM/OFDM), and forward error correction in 3G/4G/LTE remote radio units.

IC Role / Device Role / Timing Role: Primary baseband processor executing layered protocol stacks with deterministic low-latency interrupt response.

Use Value: 1-GHz throughput and DDR2-533 bandwidth enable simultaneous processing of 8+ RF carriers with <50-μs scheduling jitter.

Use Scenario: H.264/H.265 encode/decode for broadcast-grade HD video in medical imaging and surveillance systems.

IC Role / Device Role / Timing Role: Dedicated video pipeline accelerator with McBSPs for sensor interface and EMAC for network streaming.

Use Value: L1/L2 cache hierarchy and EDMA3 reduce external memory accesses by >70%, cutting power and latency for 1080p60 streams.

Industrial Machine Vision Networked Audio DSP Platform

Use Scenario: High-speed image acquisition, blob detection, and motion tracking in automated optical inspection equipment.

IC Role / Device Role / Timing Role: Real-time vision coprocessor interfacing to CMOS sensors via McBSP and controlling actuators via GPIO.

Use Value: 16-bit MMAC throughput and SPLOOP-optimized loops achieve sub-millisecond frame processing at 120 fps.

Use Scenario: Multi-channel audio mixing, echo cancellation, and VoIP gateway processing in IP-PBX and conferencing systems.

IC Role / Device Role / Timing Role: Central audio engine with dual McBSPs for codec interfacing and EMAC for SIP/RTP packet handling.

Use Value: Integrated 1-Gb Ethernet and PCI allow seamless integration into carrier-grade voice infrastructure with <10-ms end-to-end latency.

Equivalent & Alternatives

The following parts are listed as comparable options for similar fixed-point DSP applications.

Alternative Part Technical Difference Application Difference Selection Advice
TMS320C6455BZTZ8 2MB L2 memory (vs. 1048KB), adds Serial RapidIO interface; same 1-GHz speed and pinout. Required for multi-core cluster interconnect or larger firmware/image storage; not needed for standalone baseband tasks. Select when >1MB on-chip memory or SRIO backplane is mandatory; otherwise TMS320C6454BZTZ8 offers cost-optimized performance.
TMS320C6416TBZLZ2 Lower 700-MHz max clock, no DDR2/EMAC/PCI; uses older C64x core and 15mm × 15mm BGA. Suitable for legacy SDR or lower-bandwidth audio/video where gigabit interfaces are unnecessary. Choose only for backward compatibility or cost-sensitive designs with relaxed throughput requirements; lacks modern peripheral set.

Compared with TMS320C6455BZTZ8, the TMS320C6454BZTZ8 reduces L2 memory and omits Serial RapidIO while retaining identical 1-GHz performance, DDR2, EMAC, and PCI-making it ideal for cost-constrained, single-DSP telecom and video applications without cluster requirements.

Availability

TMS320C6454BZTZ8 is available at Aetrix Electronics and suitable for telecom infrastructure, HD video processing, and industrial machine vision applications requiring stable component supply across long-lifecycle deployments.

Supply support for TMS320C6454BZTZ8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 50 years of innovation in DSP and microcontroller solutions.

The TMS320C6454BZTZ8 belongs to the C64x+™ DSP platform, designed specifically for high-throughput, low-latency signal processing in communications infrastructure, video analytics, and real-time industrial control systems.

FAQ

What is the maximum operating frequency of the TMS320C6454BZTZ8?

The TMS320C6454BZTZ8 operates at a guaranteed maximum clock rate of 1 GHz, delivering 8000 million instructions per second (MIPS) and 8000 16-bit multiply-accumulate operations per second (MMACs). This rating applies to the extended temperature grade (-40°C to 105°C) and is validated per TI's SPRS311I specification.

Does the TMS320C6454BZTZ8 support DDR2 memory, and what are its interface specifications?

Yes, the TMS320C6454BZTZ8 integrates a dedicated 32-bit DDR2 memory controller supporting DDR2-533 (266 MHz clock, 533 MT/s data rate) with 1.8-V I/O voltage. It provides glueless interface to standard DDR2 SDRAM components and supports full JEDEC timing compliance for reliable high-bandwidth data streaming.

What Ethernet interfaces does the TMS320C6454BZTZ8 EMAC support?

The TMS320C6454BZTZ8 EMAC supports IEEE 802.3-compliant 10/100/1000 Mb/s operation with hardware-selectable MII, RMII, GMII, and RGMII physical layer interfaces. The integrated MDIO module scans all 32 PHY addresses for automatic enumeration and configuration.

Is the TMS320C6454BZTZ8 pin-compatible with other C64x+ devices?

Yes, the TMS320C6454BZTZ8 is pin-compatible with the TMS320C6455 in the same ZTZ BGA package, sharing identical ball map, power sequencing, and peripheral pin assignments. Differences are internal (e.g., L2 size, SRIO presence) and do not affect PCB layout or signal routing.

What development tools are supported for the TMS320C6454BZTZ8?

Texas Instruments provides full toolchain support for the TMS320C6454BZTZ8, including the C6000 Code Generation Tools (C compiler, assembler, linker), Code Composer Studio™ IDE with real-time analysis, and C64x+ DSP BIOS RTOS. Debugging uses IEEE-1149.1 JTAG with trace-enabled capability.

TMS320C6454BZTZ8 Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
TMS320C645x
Package/Case:
697-BFBGA, FCBGA
Packaging:
Tray
Product Status:
Discontinued at Digi-Key
Type:
Fixed Point
Interface:
Host Interface, I2C, McBSP, PCI, 10/100/1000 Ethernet MAC
Clock Rate:
850MHz
Non-Volatile Memory:
ROM (32kB)
On-Chip RAM:
1.08MB
Voltage - I/O:
1.2V, 1.5V, 1.8V, 3.3V
Voltage - Core:
1.20V
Operating Temperature:
0°C ~ 90°C (TC)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
697-FCBGA (24x24)

TMS320C6454BZTZ8 FAQ

1.How can I place an order for TMS320C6454BZTZ8 through Aetrix?

Please submit a Request for Quotation (RFQ) for TMS320C6454BZTZ8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TMS320C6454BZTZ8 reliable?

The price and inventory of TMS320C6454BZTZ8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMS320C6454BZTZ8 is usually 5 days.

3.What payment methods are accepted for TMS320C6454BZTZ8?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMS320C6454BZTZ8 transactions.

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4.How is shipping managed for TMS320C6454BZTZ8?

TMS320C6454BZTZ8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TMS320C6454BZTZ8 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TMS320C6454BZTZ8?

For technical support, including TMS320C6454BZTZ8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMS320C6454BZTZ8 requirements.

6.How does Aetrix verify that TMS320C6454BZTZ8 is sourced from the original manufacturer or authorized distributors?

All TMS320C6454BZTZ8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMS320C6454BZTZ8 meets industry standards.

7.What is the process for return or replacement of TMS320C6454BZTZ8?

All TMS320C6454BZTZ8 units undergo pre-shipment inspection (PSI). If there is an issue with TMS320C6454BZTZ8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TMS320C6454BZTZ8 part is unused and in its original packaging.

Return procedure for TMS320C6454BZTZ8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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