Texas Instruments TMS320C6455BGTZ2

Overview

TMS320C6455BGTZ2 from Texas Instruments is a high-performance fixed-point digital signal processor (DSP) based on the C64x+™ VLIW architecture, operating at 1.2 GHz with 9600 MIPS/16-bit MMACs, integrated DDR2 memory controller (533 MHz), dual McBSPs, 10/100/1000-Mb/s Ethernet MAC, and four Serial RapidIO® v1.2 links - deployed in telecom infrastructure baseband processing, wireless infrastructure, and video analytics systems.

For engineers reviewing the TMS320C6455BGTZ2 datasheet, TMS320C6455BGTZ2 pinout, TMS320C6455BGTZ2 application, or TMS320C6455BGTZ2 equivalent, key selection considerations include its 697-pin BGA (GTZ package), 1.2-V core/1.8-V DDR2 I/O voltage compliance, EDMA3 controller with 64 channels, L1/L2 memory configuration flexibility (32KB L1P, 32KB L1D, 2048KB L2 unified), and hardware-accelerated VCP2/TCP2 coprocessors for real-time turbo and Viterbi decoding.

Technical Context

The TMS320C6455BGTZ2 implements an eight-functional-unit C64x+™ DSP core with dual 32-bit register files and two data paths, enabling eight 16×16-bit MACs per cycle at 1.2 GHz. Its memory subsystem features configurable L1P (direct-mapped cache) and L1D (2-way set-associative cache), plus 2048KB of flexible L2 unified RAM/cache with memory protection and bandwidth management.

Peripherals are tightly coupled via switched central resources: PLL1 drives CPU/EMIFA/PCI, while PLL2 independently clocks DDR2 and EMAC; the EDMA3 controller supports scatter-gather transfers across 64 independent channels; and the Serial RapidIO® interface operates at 1.25–3.125 Gbps per lane with message passing and congestion control extensions.

Key Specifications

Pinout & Package

697-pin Flip-Chip Plastic BGA (GTZ package), 24 mm × 24 mm, 0.8-mm ball pitch, RoHS-compliant. Ball map defined per SPRS276M Figure 1-1 (CTZ/GTZ/ZTZ bottom view). I/O voltage groups: 1.25/1.2-V core, 1.5/1.8-V DDR2, 3.3-V PCI/HPI/EMIFA.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar fixed-point DSP applications.

Compared with TMS320C6455BGTZ2, the TMS320C6457BGTZ2 offers identical DSP performance and pin compatibility but trades UTOPIA for dual EMAC, whereas the TMS320C6678ACYPA delivers higher aggregate throughput at the cost of architectural discontinuity, larger footprint, and no hardware-level backward compatibility.

Availability

TMS320C6455BGTZ2 is available at Aetrix Electronics and suitable for wireless infrastructure, telecom media gateways, and industrial imaging systems requiring stable component supply across extended temperature ranges (–40°C to 105°C) and long lifecycle support.

Supply support for TMS320C6455BGTZ2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of DSP innovation rooted in the TMS320 platform.

The TMS320C6455BGTZ2 belongs to TI's C64x+™ fixed-point DSP product line, designed specifically for high-throughput, deterministic signal processing in telecom, video, and medical imaging equipment where MIPS efficiency and hardware acceleration are critical.

FAQ

What is the maximum operating temperature range for the TMS320C6455BGTZ2?

The TMS320C6455BGTZ2 is rated for extended temperature operation from –40°C to +105°C, making it suitable for deployment in outdoor wireless base stations and industrial control cabinets without active cooling. This rating is confirmed in Section 6.2 of the SPRS276M datasheet under Recommended Operating Conditions, and applies to all GTZ-suffix variants including the TMS320C6455BGTZ2.

Does the TMS320C6455BGTZ2 support DDR2-800 memory?

No, the TMS320C6455BGTZ2 supports only DDR2-533 (533-MHz data rate, 266-MHz clock), as specified in Section 7.9 of SPRS276M. Its DDR2 memory controller is hardwired for 32-bit width and 1.8-V I/O, with timing parameters validated up to 266 MHz; attempting DDR2-800 will violate setup/hold margins and cause system instability.

Can the TMS320C6455BGTZ2 execute code directly from its internal ROM?

Yes, the TMS320C6455BGTZ2 contains 32KB of on-chip ROM mapped at address 0x0010 0000, but execution is restricted to CPU frequencies below 750 MHz per Section 1.2 of SPRS276M. At 1.2 GHz operation (TMS320C6455BGTZ2's rated speed), code must be loaded into L2 SRAM or external DDR2 for reliable execution.

How many independent Serial RapidIO® lanes does the TMS320C6455BGTZ2 support?

The TMS320C6455BGTZ2 supports four independent 1× Serial RapidIO® lanes (or one aggregated 4× lane), compliant with v1.2 specification and capable of 1.25–3.125 Gbps per lane. This is implemented via dedicated differential TX/RX pairs (SRIO_LN[3:0]) and verified in the functional block diagram (Figure 1-2) and Section 7.20 of SPRS276M.

Is the TMS320C6455BGTZ2 pin-compatible with the TMS320C6455CTZ2?

Yes, the TMS320C6455BGTZ2 and TMS320C6455CTZ2 share identical 697-pin BGA footprints (CTZ and GTZ packages both use 24×24 mm, 0.8-mm pitch), with fully aligned signal assignments per Figure 1-1 of SPRS276M. The only difference is thermal performance: GTZ uses flip-chip construction for improved heat dissipation in high-power 1.2-GHz operation.