Texas Instruments TMS320C6455BZTZA
- Part No.:
- TMS320C6455BZTZA
- Manufacturer:
- Texas Instruments
- Category:
- DSP (Digital Signal Processors)
- Package:
- 697-BFBGA, FCBGA
- Datasheet:
-
TMS320C6455BZTZA.pdf
- Description:
- IC FIXED-POINT DSP 697-FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
TMS320C6455BZTZA from Texas Instruments is a high-performance fixed-point digital signal processor (DSP) based on the C64x+™ VLIW architecture, operating at 1.2 GHz with 9600 MIPS/16-bit MMACs, integrated DDR2 memory controller (533 MHz), dual McBSPs, 10/100/1000-Mb/s Ethernet MAC, and four Serial RapidIO® v1.2 links - deployed in telecom infrastructure baseband processing, wireless infrastructure, and video analytics systems.
For engineers reviewing the TMS320C6455BZTZA datasheet, TMS320C6455BZTZA pinout, TMS320C6455BZTZA application, or TMS320C6455BZTZA equivalent, key selection criteria include its 697-pin CTZ/GTZ/ZTZ BGA package, 1.2-V core voltage, L1/L2 memory hierarchy (32KB L1P, 32KB L1D, 2048KB L2), EDMA3 controller with 64 channels, and IEEE 1149.1/1149.6 JTAG-compliant debug support.
Technical Context
The TMS320C6455BZTZA implements an eight-functional-unit C64x+™ DSP core with dual 32-bit register files and two data paths, enabling eight 16×16-bit MACs per cycle. Its memory subsystem features configurable L1P (direct-mapped cache) and L1D (2-way set-associative cache), plus 2048KB unified L2 RAM/cache with flexible allocation and memory protection.
Peripherals are tightly coupled via switched central resources: PLL1 drives CPU/EMIFA/PCI, while PLL2 independently clocks DDR2 and EMAC; EDMA3 supports zero-overhead transfers across L2, external memory, and peripherals; and the 64-bit EMIFA provides glueless interface to SRAM, Flash, SBSRAM, and FPGA logic.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Clock Rate | 1.2 GHz - delivers 9600 MIPS and 9600 16-bit MMACs per second for real-time baseband and video processing. |
| L1 Memory | 32KB L1P (direct-mapped cache) + 32KB L1D (2-way set-associative cache) - enables low-latency instruction fetch and data access with configurable cache/RAM mode. |
| L2 Memory | 2048KB unified L2 RAM/cache - supports flexible allocation between program/data space with memory protection and bandwidth management. |
| DDR2 Interface | 32-bit, 533-MHz data rate (DDR2-533) - interfaces directly to up to 512MB external DDR2 SDRAM with dedicated PLL2 clocking. |
| Serial RapidIO | Four 1× or one 4× v1.2-compliant links - provides 1.25/2.5/3.125 Gbps inter-DSP communication for scalable multi-core telecom and radar systems. |
| EMAC | 10/100/1000-Mb/s Ethernet MAC with MII/GMII/RMII/RGMII support - enables direct network connectivity without external PHY for embedded gateway applications. |
| EDMA3 Channels | 64 independent channels - handles concurrent memory-to-peripheral, peripheral-to-memory, and memory-to-memory transfers with minimal CPU overhead. |
Pinout & Package
697-pin flip-chip plastic BGA (CTZ/GTZ/ZTZ package), 24 mm × 24 mm, 0.8-mm ball pitch, RoHS-compliant. Package supports thermal dissipation for sustained 1.2-GHz operation in extended temperature range (–40°C to 105°C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKIN1 | Primary oscillator input | Accepts 20–50 MHz crystal or clock source for PLL1; determines system clock domain for CPU, EMIFA, and PCI. |
| CLKIN2 | Secondary oscillator input | Drives PLL2 to generate dedicated clocks for DDR2 memory controller and EMAC, isolating timing-critical interfaces. |
| AECLKIN | EMIFA clock input | Optional asynchronous clock source for EMIFA, enabling independent timing control when CLKIN1 is not used for external memory. |
| MDIO / MDC | Management Data I/O interface | Provides bidirectional serial bus to configure and monitor up to 32 Ethernet PHY devices without CPU intervention. |
| RX_CLK / TX_CLK | RapidIO reference clocks | Differential clock inputs for each RapidIO lane group; required for 1.25–3.125 Gbps link synchronization and jitter tolerance. |
Key Features
| Feature | Design Value |
|---|---|
| VCP2 Coprocessor | Hardware-accelerated Viterbi decoding supporting >694 concurrent 7.95-Kbps AMR voice channels - offloads baseband processing from CPU in 3G/4G BTS systems. |
| TCP2 Coprocessor | Parallel turbo decoding engine handling up to eight 2-Mbps 3GPP streams (6 iterations) - enables real-time channel decoding in LTE eNodeB and small-cell platforms. |
| HPI Interface | User-selectable 16-/32-bit host-port interface - allows direct memory-mapped access to L2 and peripherals by an external ARM or microcontroller for heterogeneous system control. |
| Advanced Event Triggering (AET) | Hardware-assisted trace and debug capability - captures precise execution flow, data values, and pipeline states for deterministic real-time software validation. |
| IEEE 1149.6 Compliance | AC-coupled boundary-scan support for high-speed differential I/Os (RapidIO, RGMII) - enables production test and board-level diagnostics on dense BGA layouts. |
Applications
| Wireless Base Station Processing | Video Analytics Edge Node |
|---|---|
Use Scenario: Real-time Layer 1 processing in macrocell and small-cell LTE/5G NR base stations. IC Role / Device Role / Timing Role: Primary baseband DSP executing FFT, channel estimation, modulation/demodulation, and VCP2/TCP2-accelerated coding/decoding. Use Value: 9600 MMACs at 1.2 GHz and dedicated coprocessors enable full-bandwidth 20-MHz LTE processing with <100-μs latency per subframe. |
Use Scenario: On-device AI inference and motion-compensated video enhancement in IP surveillance cameras and drones. IC Role / Device Role / Timing Role: Fixed-point vision accelerator running H.264/H.265 encode/decode, background subtraction, and object detection kernels. Use Value: L2 cache coherence and EDMA3-managed DMA to DDR2 enable 1080p@30fps encoding with <8-ms end-to-end pipeline delay. |
| Medical Imaging Backend | Industrial Ethernet Gateway |
Use Scenario: Real-time beamforming and Doppler processing in portable ultrasound systems. IC Role / Device Role / Timing Role: High-throughput signal processor interfacing to ADCs/DACs via McBSPs and managing time-critical FIR filtering and FFT operations. Use Value: Dual McBSPs with programmable frame sync and 100-Mbps serial rates support simultaneous acquisition from multiple transducer arrays. |
Use Scenario: Deterministic protocol translation between PROFINET, EtherNet/IP, and Modbus TCP in factory automation gateways. IC Role / Device Role / Timing Role: Real-time Ethernet controller with hardware timestamping, packet classification, and dual-RX/TX queue management. Use Value: Integrated EMAC with RGMII and MDIO eliminates external PHY, reducing BOM cost and PCB area while meeting <1-μs jitter requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar fixed-point DSP applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMS320C6457BZTZA | Same C64x+ core, but adds dual 1-Gbps SerDes for CPRI/OBSAI; no UTOPIA or VCP2/TCP2. | Optimized for fronthaul transport and radio unit interfaces rather than baseband coding/decoding. | Select for CPRI-based 4G/5G RU designs requiring deterministic low-latency serial links over fiber. |
| TMS320C6678ACYPA | Multi-core (8× C66x), 1.25-GHz/core, supports floating-point; lacks VCP2/TCP2, includes KeyStone I interconnect. | Targets higher-level algorithmic workloads (e.g., MIMO precoding, radar FFTs) where floating-point precision and inter-core coherence are critical. | Choose when migrating from single-core fixed-point to scalable multi-core floating-point processing with cache coherency. |
Compared with TMS320C6455BZTZA, the TMS320C6457BZTZA trades baseband acceleration for fronthaul SerDes, while the TMS320C6678ACYPA replaces fixed-point specialization with multi-core floating-point versatility - making TMS320C6455BZTZA optimal for cost-sensitive, latency-critical, and coprocessor-dependent telecom infrastructure.
Availability
TMS320C6455BZTZA is available at Aetrix Electronics and suitable for wireless infrastructure, medical imaging, and industrial Ethernet gateway applications requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for TMS320C6455BZTZA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of leadership in DSP innovation and industrial-grade reliability.
The TMS320C6455BZTZA belongs to TI's C6000™ DSP platform, designed specifically for high-throughput, low-latency fixed-point signal processing in telecom, video, and medical equipment where deterministic real-time performance is mandatory.
FAQ
What is the maximum operating frequency of the TMS320C6455BZTZA?
The TMS320C6455BZTZA operates at a maximum CPU clock rate of 1.2 GHz, delivering 9600 million instructions per second (MIPS) and 9600 16-bit multiply-accumulates per second. This frequency is achieved using a 1.25-V core supply and requires proper thermal management within the extended temperature range (–40°C to 105°C). The TMS320C6455BZTZA datasheet specifies timing margins and voltage tolerances for stable 1.2-GHz operation.
Does the TMS320C6455BZTZA support DDR2 memory, and what are the interface specifications?
Yes, the TMS320C6455BZTZA integrates a dedicated DDR2 memory controller supporting 32-bit wide, 533-MHz data rate (DDR2-533) operation, compatible with standard DDR2 SDRAM components. It provides 512MB of total addressable external memory space via CE0, uses 1.8-V I/O signaling, and is clocked independently by PLL2 to isolate memory timing from CPU domains. The TMS320C6455BZTZA supports configurable burst lengths, refresh modes, and memory protection.
What debugging and trace capabilities does the TMS320C6455BZTZA provide?
The TMS320C6455BZTZA includes IEEE 1149.1 (JTAG) boundary-scan, IEEE 1149.6 AC-jitter-tolerant scan for high-speed I/Os, and Advanced Event Triggering (AET) hardware trace. AET enables cycle-accurate instruction tracing, data watchpoints, and pipeline state capture - essential for validating real-time DSP algorithms. The TMS320C6455BZTZA also supports in-circuit emulation via TI's XDS560v2 and XDS200 debug probes.
Can the TMS320C6455BZTZA be used in extended temperature applications?
Yes, the TMS320C6455BZTZA is qualified for extended temperature operation from –40°C to 105°C, with full electrical specifications guaranteed across this range. Its 0.09-μm CMOS process, thermal design of the 697-pin CTZ/GTZ/ZTZ BGA package, and validated PLL/DDR2 timing margins ensure reliable 1.2-GHz operation in harsh environments such as outdoor wireless base stations and industrial control cabinets. The TMS320C6455BZTZA meets TI's extended temperature product definition.
How many Serial RapidIO® links does the TMS320C6455BZTZA support, and at what speeds?
The TMS320C6455BZTZA supports four 1× Serial RapidIO® v1.2 links or one aggregated 4× link, operating at 1.25, 2.5, or 3.125 Gbps per lane. Each link includes dedicated differential clock inputs (RX_CLK/TX_CLK), hardware flow control, congestion management, and message passing extensions. This enables scalable multi-DSP topologies in radar, telecom, and video processing systems - a capability confirmed in the TMS320C6455BZTZA functional block diagram and SPRS276M datasheet.
TMS320C6455BZTZA Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- TMS320C645x
- Package/Case:
- 697-BFBGA, FCBGA
- Packaging:
- Tube
- Product Status:
- Obsolete
- Type:
- Fixed Point
- Interface:
- Host Interface, I2C, McBSP, PCI, UTOPIA
- Clock Rate:
- 1GHz
- Non-Volatile Memory:
- ROM (32kB)
- On-Chip RAM:
- 2.1MB
- Voltage - I/O:
- 1.2V,1.25V,1.5V,1.8V,3.3V
- Voltage - Core:
- 1.20V
- Operating Temperature:
- -40°C ~ 105°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 697-FCBGA (24x24)
TMS320C6455BZTZA FAQ
1.How can I place an order for TMS320C6455BZTZA through Aetrix?
Please submit a Request for Quotation (RFQ) for TMS320C6455BZTZA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TMS320C6455BZTZA reliable?
The price and inventory of TMS320C6455BZTZA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMS320C6455BZTZA is usually 5 days.
3.What payment methods are accepted for TMS320C6455BZTZA?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMS320C6455BZTZA transactions.
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4.How is shipping managed for TMS320C6455BZTZA?
TMS320C6455BZTZA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TMS320C6455BZTZA order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TMS320C6455BZTZA?
For technical support, including TMS320C6455BZTZA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMS320C6455BZTZA requirements.
6.How does Aetrix verify that TMS320C6455BZTZA is sourced from the original manufacturer or authorized distributors?
All TMS320C6455BZTZA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMS320C6455BZTZA meets industry standards.
7.What is the process for return or replacement of TMS320C6455BZTZA?
All TMS320C6455BZTZA units undergo pre-shipment inspection (PSI). If there is an issue with TMS320C6455BZTZA, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TMS320C6455BZTZA part is unused and in its original packaging.
Return procedure for TMS320C6455BZTZA:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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