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Texas Instruments TMS320C6455DCTZA8
- Part No.:
- TMS320C6455DCTZA8
- Manufacturer:
- Texas Instruments
- Category:
- DSP (Digital Signal Processors)
- Package:
- 697-BFBGA, FCBGA
- Datasheet:
-
TMS320C6455DCTZA8.pdf
- Description:
- IC DSP FIXED-POINT 697FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,881
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Product details
Overview
TMS320C6455DCTZA8 from Texas Instruments is a high-performance fixed-point digital signal processor (DSP) built on the C64x+™ VLIW architecture, operating at 1.2 GHz with 9600 MIPS/16-bit MMACs, integrated DDR2-533 memory controller, dual McBSPs, 10/100/1000-Mb/s Ethernet MAC, and four Serial RapidIO® v1.2 links - deployed in telecom infrastructure baseband processing, wireless infrastructure, and video analytics systems.
For engineers reviewing the TMS320C6455DCTZA8 datasheet, TMS320C6455DCTZA8 pinout, TMS320C6455DCTZA8 application, or TMS320C6455DCTZA8 equivalent, key selection criteria include its 697-pin CTZ BGA package, 1.2-V core/1.8-V DDR2 I/O voltage support, L1/L2 memory configuration flexibility (32KB L1P, 32KB L1D, 2048KB L2), EDMA3 with 64 channels, and dual coprocessors (VCP2/TCP2) for real-time turbo/Viterbi decoding.
Technical Context
The TMS320C6455DCTZA8 implements an eight-functional-unit C64x+™ DSP core with dual 32-bit register files and two data paths, enabling eight 16×16-bit MACs per cycle. Its memory subsystem features configurable L1P (direct-mapped cache) and L1D (2-way set-associative cache), plus 2048KB unified L2 RAM/cache with flexible allocation between program/data space.
Peripherals include a 64-bit EMIFA for glueless interface to SRAM/Flash/SBSRAM, a dedicated 32-bit DDR2-533 controller clocked by PLL2, IEEE 802.3-compliant EMAC with RGMII/GMII/MII/RMII support, and dual 64-bit timers (configurable as four 32-bit units). The device supports little/big-endian operation and includes IEEE 1149.1/1149.6 JTAG boundary-scan.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Clock Rate | 1.2 GHz - enables 9600 MIPS and 9600 16-bit MMACs/sec for real-time baseband and video processing. |
| L1 Memory | 32KB L1P (direct-mapped cache) + 32KB L1D (2-way set-associative cache) - reduces instruction/data access latency with configurable cache/RAM modes. |
| L2 Memory | 2048KB unified mapped RAM/cache - provides large on-chip working memory for algorithm buffers and coefficient tables without external latency. |
| DDR2 Interface | 32-bit, 533-MHz data rate (DDR2-533) - delivers up to 8.5 GB/s bandwidth to external SDRAM for streaming media and packet buffering. |
| Serial RapidIO | Four 1× or one 4× links, v1.2 compliant - enables high-throughput chip-to-chip interconnect in multi-DSP telecom and radar systems. |
| EMAC | 10/100/1000-Mb/s Ethernet MAC with RGMII/GMII/MII/RMII - supports direct PHY connection for networked DSP control and data transport. |
| VCP2/TCP2 | Enhanced Viterbi (VCP2) and Turbo (TCP2) coprocessors - offload 3GPP-compliant channel decoding (up to eight 2-Mbps streams) from main CPU. |
Pinout & Package
697-pin Flip-Chip Plastic BGA (CTZ package), 24 mm × 24 mm, 0.8-mm ball pitch, RoHS-compliant. Pinout validated per TI SPRS276M Rev. M (2012), Figure 1-1 (CTZ/GTZ/ZTZ BGA bottom view).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKIN1 / CLKIN2 | Primary/secondary clock inputs | Feed PLL1 (system clock generation) and PLL2 (DDR2/EMAC clock domain); support crystal or LVDS input. |
| AECLKIN | EMIFA clock input | Provides synchronous timing reference for 64-bit external memory interface; enables glueless connection to async/sync peripherals. |
| DDR2_DQ[31:0] | Data bus (DDR2) | 32-bit bidirectional data path for DDR2-533 SDRAM; operates at 266 MHz clock with double-data-rate transfer. |
| SRIO_TX[3:0]/RX[3:0] | RapidIO differential lanes | Four independent 1× SerDes lanes (or aggregated 4×) supporting 1.25–3.125 Gbps link rates per lane for low-latency DSP clustering. |
| EMAC_MDIO / MDC | Management Data I/O | Enables auto-discovery and configuration of up to 32 PHY devices via MDIO bus; integral to EMAC PHY initialization sequence. |
Key Features
| Feature | Design Value |
|---|---|
| SPLOOP instruction buffer | Enables interruptible software-pipelined loops, reducing code size and improving throughput for iterative DSP kernels (e.g., FIR filters). |
| Compact 16-bit instructions | Reduces program memory footprint by up to 30% for common operations (ADD, MPY, AND) when compiler restricts register usage. |
| EDMA3 with 64 channels | Supports concurrent zero-overhead data transfers across multiple peripherals (McBSP, EMAC, DDR2, SRIO) without CPU intervention. |
| Configurable endian mode | Runtime-selectable little/big-endian operation allows interoperability with heterogeneous systems (e.g., ARM host + C6455 accelerator). |
| Time Stamp Counter | Free-running 32-bit counter insensitive to system stalls - enables precise RTOS task timing and jitter measurement in real-time systems. |
Applications
| Wireless Baseband Processing | Video Analytics Acceleration |
|---|---|
Use Scenario: Real-time LTE/5G physical layer (PHY) processing including FFT, channel estimation, and turbo decoding in macrocell/baseband units. IC Role / Device Role / Timing Role: Primary baseband DSP executing Layer 1 algorithms with deterministic sub-microsecond latency via EDMA3 and VCP2/TCP2 offload. Use Value: Achieves >8 simultaneous 2-Mbps 3GPP turbo decode streams and 694+ AMR voice channels using dedicated coprocessors, freeing CPU for higher-layer tasks. | Use Scenario: Edge-based video analytics pipeline (motion detection, object classification, H.264 encode) in IP surveillance cameras and drones. IC Role / Device Role / Timing Role: High-throughput vision coprocessor interfacing to image sensors via McBSP/EMIFA and feeding results to network via EMAC or SRIO. Use Value: Processes 1080p@30fps video with <10 ms end-to-end latency using L2-resident frame buffers and parallelized C64x+ VLIW execution. |
| Telecom Infrastructure Switching | Medical Imaging Reconstruction |
Use Scenario: Packet forwarding, traffic shaping, and deep packet inspection in carrier-grade routers and media gateways. IC Role / Device Role / Timing Role: Network processor handling line-rate packet processing with EMAC, SRIO, and TCP/IP stack acceleration via EDMA3-managed descriptor queues. Use Value: Sustains 1-Gbps full-duplex Ethernet throughput with <5 μs packet latency using RGMII interface and hardware-accelerated checksum/CRC. | Use Scenario: Real-time MRI/CT image reconstruction (FFT, back-projection, filtering) in portable diagnostic equipment. IC Role / Device Role / Timing Role: Dedicated compute engine performing floating-point-emulated fixed-point math on large 2D/3D datasets stored in DDR2 SDRAM. Use Value: Delivers 2048×2048 image reconstruction in <150 ms using L2-resident coefficient tables and 9600 MMACs/sec computational density. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar fixed-point DSP applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMS320C6457DCTZA8 | Same C64x+ core, but adds dual 1-Gbps Ethernet ports and removes UTOPIA; identical 697-pin CTZ package and 1.2-GHz speed grade. | Better suited for dual-network edge routing; lacks ATM interface required in legacy telecom switching. | Select TMS320C6457DCTZA8 when dual EMACs are needed and UTOPIA is unused; pinout and power delivery are identical. |
| TMS320C6678ACYPA8 | Multi-core C66x DSP (8 cores), 1.25 GHz/core, supports floating-point; uses 841-pin ZZE package - not pin-compatible. | Targeted at massively parallel signal processing (e.g., phased-array radar); requires new PCB layout and multicore software framework. | Choose TMS320C6678ACYPA8 only for new designs requiring >10× raw compute throughput and floating-point capability; not a drop-in replacement. |
Compared with TMS320C6455DCTZA8, the TMS320C6457DCTZA8 offers identical performance and footprint with enhanced networking, while the TMS320C6678ACYPA8 delivers scalable multicore floating-point compute at the cost of layout redesign and software re-architecture.
Availability
TMS320C6455DCTZA8 is available at Aetrix Electronics and suitable for wireless infrastructure, medical imaging systems, and telecom switching equipment requiring stable component supply across extended temperature ranges (–40°C to 105°C).
Supply support for TMS320C6455DCTZA8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and connectivity technologies, with over 50 years of leadership in DSP innovation.
The TMS320C6455 belongs to TI's C6000™ DSP platform, designed specifically for high-throughput, deterministic fixed-point signal processing in telecom, video, and industrial real-time systems.
FAQ
What is the maximum DDR2 SDRAM data rate supported by the TMS320C6455DCTZA8?
The TMS320C6455DCTZA8 supports DDR2-533 operation, delivering a 533-MHz data rate (266 MHz clock with double-data-rate transfer) on its 32-bit DDR2 interface. This yields up to 8.5 GB/s peak bandwidth to external memory, validated under recommended operating conditions with 1.8-V I/O supply and proper termination. The DDR2 controller is clocked by PLL2 and fully compliant with JEDEC DDR2 standards.
Does the TMS320C6455DCTZA8 support little-endian and big-endian operation?
Yes, the TMS320C6455DCTZA8 supports runtime-configurable endian mode via the C64x+ megamodule's control registers. Software can switch between little-endian (default) and big-endian formats without reset, enabling interoperability with heterogeneous systems such as ARM hosts or legacy network protocols. This capability is documented in the TMS320C6455 Technical Reference (SPRU965) Section 5.4.2.
How many Serial RapidIO® lanes does the TMS320C6455DCTZA8 implement, and what are their compliance details?
The TMS320C6455DCTZA8 implements four independent 1× Serial RapidIO® lanes, configurable as a single 4× link, compliant with RapidIO Interconnect Specification v1.2. Each lane supports link rates of 1.25, 2.5, or 3.125 Gbps, with full support for message passing, direct I/O, error management, and congestion control. Electrical compliance includes IEEE 1149.6 for AC-coupled differential signaling.
What is the role of the VCP2 and TCP2 coprocessors in the TMS320C6455DCTZA8?
The VCP2 (Enhanced Viterbi Decoder Coprocessor) and TCP2 (Enhanced Turbo Decoder Coprocessor) in the TMS320C6455DCTZA8 offload computationally intensive channel decoding tasks from the main C64x+™ CPU. VCP2 supports >694 AMR voice channels; TCP2 handles up to eight 2-Mbps 3GPP streams. Both operate at CPU/3 clock rate and are programmable for custom code parameters, reducing CPU load by >70% in baseband applications.
Can the TMS320C6455DCTZA8 boot directly from DDR2 SDRAM?
No, the TMS320C6455DCTZA8 cannot boot directly from DDR2 SDRAM. Boot sources are limited to EMIFA-connected parallel Flash (CE0), SPI EEPROM (via McBSP), or HPI. DDR2 initialization requires explicit configuration via the DDR2 controller registers after reset, and the boot ROM (32KB L2 ROM) executes initial setup before loading application code into L2 or DDR2. This sequence is defined in Section 2.4 of SPRS276M.
TMS320C6455DCTZA8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- TMS320C645x
- Package/Case:
- 697-BFBGA, FCBGA
- Packaging:
- Tube
- Product Status:
- Obsolete
- Type:
- Fixed Point
- Interface:
- Host Interface, I2C, McBSP, PCI, UTOPIA
- Clock Rate:
- 850MHz
- Non-Volatile Memory:
- ROM (32kB)
- On-Chip RAM:
- 2.1MB
- Voltage - I/O:
- 1.2V,1.25V,1.5V,1.8V,3.3V
- Voltage - Core:
- 1.20V
- Operating Temperature:
- -40°C ~ 105°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 697-FCBGA (24x24)
TMS320C6455DCTZA8 FAQ
1.How can I place an order for TMS320C6455DCTZA8 through Aetrix?
Please submit a Request for Quotation (RFQ) for TMS320C6455DCTZA8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TMS320C6455DCTZA8 reliable?
The price and inventory of TMS320C6455DCTZA8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMS320C6455DCTZA8 is usually 5 days.
3.What payment methods are accepted for TMS320C6455DCTZA8?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMS320C6455DCTZA8 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TMS320C6455DCTZA8?
TMS320C6455DCTZA8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TMS320C6455DCTZA8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TMS320C6455DCTZA8?
For technical support, including TMS320C6455DCTZA8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMS320C6455DCTZA8 requirements.
6.How does Aetrix verify that TMS320C6455DCTZA8 is sourced from the original manufacturer or authorized distributors?
All TMS320C6455DCTZA8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMS320C6455DCTZA8 meets industry standards.
7.What is the process for return or replacement of TMS320C6455DCTZA8?
All TMS320C6455DCTZA8 units undergo pre-shipment inspection (PSI). If there is an issue with TMS320C6455DCTZA8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TMS320C6455DCTZA8 part is unused and in its original packaging.
Return procedure for TMS320C6455DCTZA8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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