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Texas Instruments TMS320C6455DZTZ
- Part No.:
- TMS320C6455DZTZ
- Manufacturer:
- Texas Instruments
- Category:
- DSP (Digital Signal Processors)
- Package:
- 697-BFBGA, FCBGA
- Datasheet:
-
TMS320C6455DZTZ.pdf
- Description:
- IC DSP FIXED-POINT 697FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,006
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Product details
Overview
TMS320C6455DZTZ from Texas Instruments is a high-performance fixed-point digital signal processor (DSP) built on the C64x+™ VLIW architecture, operating at up to 1.2 GHz with 9600 MIPS and integrated DDR2 memory controller, EMAC, Serial RapidIO®, and dual coprocessors (VCP2/TCP2), deployed in telecom infrastructure baseband processing, wireless infrastructure, and video analytics systems.
For engineers reviewing the TMS320C6455DZTZ datasheet, TMS320C6455DZTZ pinout, TMS320C6455DZTZ application, or TMS320C6455DZTZ equivalent, key selection criteria include its 697-pin CTZ/GTZ/ZTZ BGA package, 1.2-V core/1.8-V DDR2 I/O voltage support, L1/L2 memory configuration flexibility, and hardware-accelerated Viterbi/Turbo decoding capability for 3GPP-compliant wireless base stations.
Technical Context
The TMS320C6455DZTZ implements an eight-functional-unit C64x+™ DSP core with dual 32-bit register files and two data paths, enabling eight 16-bit × 16-bit MACs per cycle. Its memory subsystem includes 32KB L1P (direct-mapped cache), 32KB L1D (2-way set-associative cache), and 2048KB configurable L2 unified RAM/cache with 32KB on-chip ROM.
Peripheral integration includes a 32-bit DDR2-533 SDRAM controller (533-MHz data rate), 64-bit EMIFA supporting asynchronous/synchronous memories, IEEE 802.3-compliant 10/100/1000-Mb/s EMAC with RGMII/MII/GMII/RMII interfaces, four 1×/one 4× Serial RapidIO® v1.2 links, and dual 64-bit timers configurable as four 32-bit units.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Clock Rate | Up to 1.2 GHz - enables 9600 MIPS at 16-bit precision for real-time baseband signal processing. |
| L1 Memory | 32KB L1P (direct-mapped cache) + 32KB L1D (2-way set-associative cache) - supports low-latency instruction fetch and data access critical for tight-loop DSP kernels. |
| L2 Memory | 2048KB unified RAM/cache - configurable allocation between program/data space for flexible algorithm partitioning and buffer management. |
| DDR2 Interface | 32-bit, 533-MHz data rate (DDR2-533) - delivers up to 4.2 GB/s bandwidth to external SDRAM for high-throughput streaming applications. |
| EMAC Interface | 10/100/1000-Mb/s Ethernet MAC with RGMII/GMII/MII/RMII - enables direct connection to PHYs without glue logic in packet-processing front-ends. |
| Serial RapidIO | Four 1× or one 4× v1.2-compliant links - provides deterministic, low-latency inter-DSP communication for multi-core wireless baseband systems. |
| VCP2/TCP2 | Enhanced Viterbi (694+ AMR channels) and Turbo (eight 2-Mbps 3GPP streams) coprocessors - offloads channel decoding from CPU, reducing latency and power in cellular infrastructure. |
Pinout & Package
697-pin flip-chip plastic BGA (CTZ/GTZ/ZTZ package family), 24 mm × 24 mm body, 0.8-mm ball pitch, RoHS-compliant. Pinout validated per TI SPRS276M Figure 1-1 (bottom view) and Section 2.5 "Pin Assignments".
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKIN1 / CLKIN2 | Primary/secondary clock inputs | Feed PLL1 (system clock generation) and PLL2 (DDR2/EMAC clocks); support crystal or LVDS input for jitter-sensitive timing domains. |
| DDR2_DQ[31:0] | DDR2 data bus | 32-bit bidirectional data interface compliant with JEDEC DDR2-533; requires matched trace lengths and termination for signal integrity. |
| EMAC_MDIO / EMAC_MDC | Management Data I/O | Provides MDIO bus for auto-discovery and configuration of up to 32 PHY devices in Ethernet-based systems. |
| SRIO_TX[3:0]/RX[3:0] | Serial RapidIO differential lanes | Supports 1.25–3.125 Gbps link rates per lane; enables chip-to-chip interconnect with congestion control and message passing extensions. |
| HPI[31:0] | Host-port interface | 32-bit parallel interface for host processor access to internal memory/peripherals; configurable as 16-bit mode to reduce pin count. |
Key Features
| Feature | Design Value |
|---|---|
| SPLOOP instruction buffer | Enables interruptible software-pipelined loops with reduced code size - improves throughput of FFT, FIR, and correlation kernels without manual scheduling. |
| Compact 16-bit instructions | Reduces code footprint by up to 30% for common operations (ADD, MPY, AND) when constrained to specific register sets - lowers memory bandwidth pressure and cache miss rate. |
| EDMA3 with 64 channels | Hardware-managed data movement independent of CPU - enables zero-overhead transfers between L2, DDR2, peripherals, and coprocessor buffers for sustained DMA bandwidth. |
| IEEE 1149.6-compliant I/Os | Supports AC-coupled boundary-scan testing on high-speed differential signals (e.g., SRIO, RGMII) - ensures test coverage in dense BGA layouts without dedicated test pads. |
| Advanced Event Triggering (AET) | Hardware-assisted debug trigger on complex conditions (e.g., memory address + data value + cycle count) - accelerates root-cause analysis of timing-critical DSP failures. |
Applications
| Wireless Base Station Modem | Video Analytics Edge Node |
|---|---|
Use Scenario: Real-time LTE/3GPP physical layer processing including channel estimation, equalization, and OFDM modulation/demodulation in macrocell BTS. IC Role / Device Role / Timing Role: Primary baseband DSP executing Layer 1 algorithms with hardware acceleration via VCP2/TCP2 coprocessors and DDR2-backed frame buffers. Use Value: Achieves sub-1ms processing latency for 20-MHz LTE bandwidth using 9600-MIPS throughput and 4.2-GB/s DDR2 bandwidth - meets 3GPP TS 36.101 timing requirements. | Use Scenario: On-device video preprocessing (motion detection, background subtraction, ROI encoding) in IP surveillance cameras with AI inference co-processing. IC Role / Device Role / Timing Role: Preprocessing engine feeding compressed video streams to external AI accelerator; handles pixel-level arithmetic and temporal filtering via L1/L2 memory hierarchy. Use Value: Leverages 32KB L1D cache and EDMA3 to sustain 1080p@30fps YUV422 processing with <500-μs pipeline latency - reduces host CPU load and system power. |
| Telecom Media Gateway | Medical Imaging Reconstruction |
Use Scenario: Voice/media transcoding, echo cancellation, and SIP signaling in carrier-grade session border controllers and media gateways. IC Role / Device Role / Timing Role: Multi-channel DSP handling 128+ concurrent G.711/G.729 calls with hardware-accelerated Viterbi decoding and McBSP-linked codecs. Use Value: Delivers 694+ AMR voice channels via VCP2 while maintaining <15-ms end-to-end delay - satisfies ITU-T G.114 conversational quality thresholds. | Use Scenario: Real-time back-projection and filtered back-projection in portable ultrasound and CT reconstruction engines. IC Role / Device Role / Timing Role: High-throughput math engine performing floating-point emulation and fixed-point FFTs on sensor data streams from ADC arrays. Use Value: Uses 8 functional units and SPLOOP to execute 1024-point FFTs in <8 μs - enables sub-second image reconstruction at point-of-care. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar fixed-point DSP applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMS320C6457DZTZ | Same C64x+ core, adds dual 1-Gbps Ethernet ports and enhanced security features (AES/SHA); no TCP2/VCP2. | Better suited for secure packet-forwarding gateways; lacks hardware turbo/viterbi acceleration for wireless baseband. | Select for network security or dual-EMAC routing; avoid if VCP2/TCP2 acceleration is required. |
| TMS320C6678ACYPA | Multi-core C66x (8-core), 1.25 GHz/core, KeyStone architecture, no VCP2/TCP2; supports floating-point. | Targeted at scalable radar/beamforming; higher aggregate throughput but no legacy 3GPP coprocessor compatibility. | Choose for floating-point-intensive MIMO or beamforming; not drop-in compatible for C6455-based 3GPP stacks. |
Compared with TMS320C6455DZTZ, the TMS320C6457DZTZ trades VCP2/TCP2 for dual EMAC and security, while the TMS320C6678ACYPA replaces fixed-point acceleration with multi-core floating-point scalability - neither offers pin-compatible replacement nor identical coprocessor functionality.
Availability
TMS320C6455DZTZ is available at Aetrix Electronics and suitable for wireless infrastructure, telecom media gateways, and medical imaging reconstruction requiring stable component supply across extended temperature ranges (–40°C to 105°C).
Supply support for TMS320C6455DZTZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and connectivity technologies, with leadership in DSP, microcontrollers, and power management ICs.
The TMS320C6455DZTZ belongs to TI's C6000™ DSP platform, designed specifically for high-throughput, low-latency fixed-point signal processing in wireless infrastructure, video analytics, and telecom equipment.
FAQ
What is the maximum operating frequency of the TMS320C6455DZTZ?
The TMS320C6455DZTZ operates at up to 1.2 GHz, delivering 9600 MIPS at 16-bit precision. This frequency is supported under recommended operating conditions (1.25-V core, 105°C max case temperature) and enables real-time execution of demanding baseband algorithms in wireless infrastructure applications. The TMS320C6455DZTZ achieves this performance using TI's 0.09-μm CMOS process and advanced C64x+™ VLIW architecture with eight functional units.
Does the TMS320C6455DZTZ support DDR2 memory, and what are its interface specifications?
Yes, the TMS320C6455DZTZ integrates a dedicated DDR2 memory controller supporting DDR2-533 SDRAM with a 32-bit bus width and 533-MHz data rate, providing up to 4.2 GB/s bandwidth. It supports standard JEDEC DDR2 protocols including auto-precharge, self-refresh, and write leveling, and requires 1.8-V I/O voltage. The controller is clocked by PLL2 and is fully configurable via registers at 0x7800 0000–0x7FFF FFFF.
What peripheral interfaces are available on the TMS320C6455DZTZ for connecting to external networking components?
The TMS320C6455DZTZ includes a full IEEE 802.3-compliant 10/100/1000-Mb/s Ethernet MAC (EMAC) with RGMII, GMII, MII, and RMII support, plus four 1× or one 4× Serial RapidIO® v1.2 links operating at 1.25–3.125 Gbps per lane. These interfaces enable direct connection to PHYs, switches, and other DSPs without external glue logic, making the TMS320C6455DZTZ ideal for distributed baseband processing and media gateway designs.
How does the TMS320C6455DZTZ handle real-time channel decoding for 3GPP wireless standards?
The TMS320C6455DZTZ integrates two dedicated hardware coprocessors: the Enhanced Viterbi Decoder (VCP2), supporting over 694 AMR voice channels, and the Enhanced Turbo Decoder (TCP2), supporting up to eight 2-Mbps 3GPP streams (6 iterations). Both operate at CPU/3 clock rate and are programmed via dedicated control registers (0x02B8 0000–0x02BB FFFF), offloading decoding from the main C64x+™ core to ensure deterministic latency and reduce CPU utilization in LTE/WCDMA base stations.
What boot modes and memory configurations are supported by the TMS320C6455DZTZ?
The TMS320C6455DZTZ supports multiple boot modes including HPI, EMIF, and SPI, configured via boot pins at reset. Its memory subsystem allows flexible allocation of 32KB L1P (direct-mapped), 32KB L1D (2-way set-associative), and 2048KB L2 (unified RAM/cache) - all configurable as SRAM, cache, or mixed modes via memory protection registers. Internal 32KB ROM contains boot loader and peripheral initialization routines, accessible only below 750 MHz CPU frequency.
TMS320C6455DZTZ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- TMS320C645x
- Package/Case:
- 697-BFBGA, FCBGA
- Packaging:
- Tube
- Product Status:
- Obsolete
- Type:
- Fixed Point
- Interface:
- Host Interface, I2C, McBSP, PCI, UTOPIA
- Clock Rate:
- 1GHz
- Non-Volatile Memory:
- ROM (32kB)
- On-Chip RAM:
- 2.1MB
- Voltage - I/O:
- 1.2V,1.25V,1.5V,1.8V,3.3V
- Voltage - Core:
- 1.20V
- Operating Temperature:
- 0°C ~ 90°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 697-FCBGA (24x24)
TMS320C6455DZTZ FAQ
1.How can I place an order for TMS320C6455DZTZ through Aetrix?
Please submit a Request for Quotation (RFQ) for TMS320C6455DZTZ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TMS320C6455DZTZ reliable?
The price and inventory of TMS320C6455DZTZ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMS320C6455DZTZ is usually 5 days.
3.What payment methods are accepted for TMS320C6455DZTZ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMS320C6455DZTZ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TMS320C6455DZTZ?
TMS320C6455DZTZ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TMS320C6455DZTZ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TMS320C6455DZTZ?
For technical support, including TMS320C6455DZTZ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMS320C6455DZTZ requirements.
6.How does Aetrix verify that TMS320C6455DZTZ is sourced from the original manufacturer or authorized distributors?
All TMS320C6455DZTZ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMS320C6455DZTZ meets industry standards.
7.What is the process for return or replacement of TMS320C6455DZTZ?
All TMS320C6455DZTZ units undergo pre-shipment inspection (PSI). If there is an issue with TMS320C6455DZTZ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TMS320C6455DZTZ part is unused and in its original packaging.
Return procedure for TMS320C6455DZTZ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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