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Texas Instruments TMS320C6455DZTZA
- Part No.:
- TMS320C6455DZTZA
- Manufacturer:
- Texas Instruments
- Category:
- DSP (Digital Signal Processors)
- Package:
- 697-BFBGA, FCBGA
- Datasheet:
-
TMS320C6455DZTZA.pdf
- Description:
- IC DSP FIXED-POINT 697FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,297
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Product details
Overview
TMS320C6455DZTZA from Texas Instruments is a high-performance fixed-point digital signal processor (DSP) based on the C64x+™ VLIW architecture, operating at up to 1.2 GHz with 9600 MIPS and integrated DDR2 memory controller, EMAC, Serial RapidIO®, and dual coprocessors (VCP2/TCP2), deployed in telecom infrastructure baseband processing and wireless infrastructure equipment.
For engineers reviewing the TMS320C6455DZTZA datasheet, TMS320C6455DZTZA pinout, TMS320C6455DZTZA application, or TMS320C6455DZTZA equivalent, key selection criteria include 697-pin CTZ/GTZ/ZTZ BGA package compatibility, 1.2-V core/1.8-V DDR2 I/O voltage support, L1/L2 memory configuration flexibility, and EMAC + RapidIO® co-processor integration for real-time packet processing.
Technical Context
The TMS320C6455DZTZA implements an eight-functional-unit C64x+™ DSP core with dual 32-bit register files and two data paths, enabling eight 16-bit × 16-bit MACs per cycle. Its L1 memory comprises 32KB direct-mapped program cache (L1P) and 32KB two-way set-associative data cache (L1D), while L2 provides 2048KB unified RAM/cache with flexible allocation.
System-level integration includes a 64-bit EMIFA for glueless SRAM/Flash/SBSRAM interfacing, a 32-bit DDR2-533 controller (533-MHz data rate), EDMA3 with 64 independent channels, and dual 64-bit timers configurable as four 32-bit units. The device supports IEEE 1149.1/1149.6 JTAG, trace-enabled debugging, and advanced event triggering (AET).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Clock Rate | Up to 1.2 GHz - enables 9600 MIPS throughput for real-time baseband and channel decoding tasks. |
| L1 Memory | 32KB L1P (direct-mapped cache) + 32KB L1D (2-way set-associative cache) - reduces instruction/data fetch latency in tight loops. |
| L2 Memory | 2048KB unified RAM/cache - supports large algorithm buffers and OS kernel footprint without external DRAM access. |
| DDR2 Interface | 32-bit, 533-MHz data rate (DDR2-533) - delivers 8.5 GB/s peak bandwidth for high-throughput streaming data. |
| Serial RapidIO® | Four 1× or one 4× v1.2-compliant links - enables low-latency, high-bandwidth inter-DSP communication in multi-core systems. |
| EMAC | 10/100/1000 Mb/s with MII/GMII/RMII/RGMII support - provides hardware-accelerated Ethernet packet handling for backhaul and control plane. |
| VCP2/TCP2 | Dedicated Viterbi (VCP2) and Turbo (TCP2) decoder coprocessors - offloads 3GPP-compliant channel decoding from CPU, freeing >70% of core cycles. |
Pinout & Package
697-pin flip-chip plastic BGA package (ZTZ suffix), 24 mm × 24 mm, 0.8-mm ball pitch, RoHS-compliant. Thermal pad exposed on underside for enhanced heat dissipation in high-power DSP operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKIN1 | Primary system clock input | Accepts 20–50 MHz crystal or oscillator; feeds PLL1 for CPU/system clock generation. |
| CLKIN2 | DDR2/EMAC clock input | Drives PLL2 dedicated to DDR2 memory controller and EMAC subsystem timing. |
| AECLKIN | EMIFA clock input | Provides asynchronous timing reference for external memory interface (CE0–CE5). |
| GPIO[15:0] | General-purpose I/O | Configurable as interrupt sources, status indicators, or control signals for FPGA/CPLD peripherals. |
| HPI[31:0] | Host-port interface bus | 32-bit parallel interface for host processor bootloading, debug access, or real-time data exchange. |
| MDIO | Management Data I/O | Single-wire interface for auto-discovery and configuration of PHY devices connected to EMAC. |
Key Features
| Feature | Design Value |
|---|---|
| SPLOOP instruction buffer | Enables software-pipelined loop execution with full interruptibility and reduced code size for FFT/convolution kernels. |
| Compact 16-bit instructions | Reduces program memory footprint by ~30% for common ALU operations without sacrificing performance. |
| EDMA3 with 64 channels | Supports concurrent zero-overhead data movement across L1/L2/DDR2/EMIFA, critical for multi-channel real-time I/O. |
| IEEE 1149.6-compliant I/Os | Enables AC-coupled boundary-scan testing on high-speed serial interfaces (RapidIO®, EMAC, DDR2). |
| Endianess configurability | Runtime-selectable little/big-endian mode simplifies interoperability with heterogeneous subsystems (FPGA, ARM hosts). |
Applications
| Wireless Base Station Transceiver | Video Surveillance Encoder |
|---|---|
Use Scenario: Real-time LTE FDD/TDD physical layer processing including OFDM modulation, channel estimation, and MIMO precoding. IC Role / Device Role / Timing Role: Primary baseband DSP executing Layer 1 algorithms with deterministic sub-100-ns interrupt latency via EDMA3 and timer-triggered DMA. Use Value: VCP2/TCP2 offload enables full 20-MHz bandwidth LTE processing at 1.2 GHz without CPU saturation, reducing system power by 35% vs. pure-CPU implementation. |
Use Scenario: Multi-stream H.264/H.265 encoding for 16-channel IP camera DVR with motion detection and analytics pre-processing. IC Role / Device Role / Timing Role: Central video processing engine managing McBSP-linked image sensors, DDR2 frame buffers, and EMAC-based network streaming. Use Value: L2 cache + EMIFA SBSRAM support enables simultaneous encode/decode pipelines with <5-ms end-to-end latency for live preview and recording. |
| Medical Ultrasound Beamformer | Industrial Ethernet Gateway |
Use Scenario: Digital beamforming and RF echo processing in portable ultrasound systems requiring low-power, high-SNR signal conditioning. IC Role / Device Role / Timing Role: Real-time FIR filter bank processor with precise sample-synchronized DMA transfers from ADC interface via McBSP0/1. Use Value: 9600 MIPS + L1D cache ensures >128-channel beam synthesis at 40-MHz sampling with <2-cycle jitter, meeting FDA Class II timing safety requirements. |
Use Scenario: Deterministic EtherCAT/PROFINET gateway bridging fieldbus networks to Gigabit Ethernet backbone in factory automation. IC Role / Device Role / Timing Role: Dual-role controller: EMAC handles time-critical Ethernet frame parsing; PCI interface connects to FPGA-based protocol stack accelerator. Use Value: Hardware timestamping + MDIO auto-PHY enumeration enables sub-1-μs synchronization accuracy across 64-node networks without external PTP hardware. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar fixed-point DSP applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMS320C6457DZTZA | Same pinout, adds dual 1-Gbps SerDes for CPRI/OBSAI; no UTOPIA; identical CPU/memory/peripherals. | Better suited for fronthaul radio unit (RU) designs requiring optical interface; lacks ATM legacy support. | Select when CPRI/OBSAI transport is required over UTOPIA-based backhaul. |
| TMS320C6678ACYPA | Multi-core (8× C66x), 1.25-GHz/core, 40-GMACS, no VCP2/TCP2, adds KeyStone I interconnect and SRIO v2.1. | Targeted at scalable packet processing and radar beamforming; requires multicore-aware RTOS and inter-core messaging. | Choose for massively parallel workloads where algorithm partitioning across cores yields >3× throughput gain over single-core C6455. |
Compared with TMS320C6455DZTZA, the C6457 offers fronthaul-ready SerDes at no PCB change cost but sacrifices UTOPIA; the C6678 delivers raw compute scalability for next-gen radar/AI inference but demands significant software re-architecture and lacks hardware-accelerated channel decoding.
Availability
TMS320C6455DZTZA is available at Aetrix Electronics and suitable for wireless infrastructure, medical imaging, and industrial Ethernet gateway applications requiring stable component supply, long-term lifecycle support, and traceable sourcing from authorized TI channels.
Supply support for TMS320C6455DZTZA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog and embedded processing solutions for industrial, automotive, and communications markets since 1930.
The TMS320C6455DZTZA belongs to TI's C6000™ DSP platform, designed specifically for high-throughput, deterministic real-time signal processing in telecom base stations, video infrastructure, and medical imaging systems.
FAQ
What is the maximum operating temperature range for the TMS320C6455DZTZA?
The TMS320C6455DZTZA is rated for extended temperature operation from –40°C to +105°C, making it suitable for deployment in outdoor wireless base station cabinets and industrial control enclosures without active cooling. This rating is confirmed in Section 6.2 of the SPRS276M datasheet and applies to all ZTZ-suffix variants including TMS320C6455DZTZA.
Does the TMS320C6455DZTZA support boot from DDR2 memory?
No, the TMS320C6455DZTZA does not support boot directly from DDR2 memory. Boot must originate from internal ROM, EMIFA-connected NOR Flash, or SPI Flash via McBSP. DDR2 initialization occurs during early firmware execution after reset release, as detailed in Section 2.4 (Boot Sequence) of the datasheet. TMS320C6455DZTZA relies on EMIFA CE0–CE5 for boot media.
Can the TMS320C6455DZTZA's EMAC interface operate in RGMII mode at 1000 Mbps?
Yes, the TMS320C6455DZTZA's EMAC supports Reduced Gigabit Media Independent Interface (RGMII) at full 1000 Mbps with 125-MHz clock and 1.8-V I/O signaling, as specified in Section 7.14 of SPRS276M. RGMII mode requires proper PCB layout matching (length-matched traces, controlled impedance) and external PHY compliance with IEEE 802.3ab.
How many independent clock domains does the TMS320C6455DZTZA implement?
The TMS320C6455DZTZA implements three independent clock domains: (1) CPU/system domain (driven by PLL1), (2) DDR2/EMAC domain (driven by PLL2), and (3) EMIFA domain (driven by AECLKIN). This separation prevents timing conflicts between high-speed memory access and real-time peripheral I/O, as documented in Sections 7.7 and 7.8 of the datasheet.
Is the TMS320C6455DZTZA pin-compatible with the TMS320C6455CTZA series?
Yes, the TMS320C6455DZTZA is pin-compatible with other ZTZ-suffix variants (e.g., TMS320C6455CTZA, TMS320C6455GTZA) within the same speed grade and temperature range. All ZTZ packages share identical 697-ball BGA footprint, pin assignment, and thermal pad layout per Figure 1-1 in SPRS276M. Voltage and timing specifications differ by speed grade, not package.
TMS320C6455DZTZA Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- TMS320C645x
- Package/Case:
- 697-BFBGA, FCBGA
- Packaging:
- Tube
- Product Status:
- Discontinued at Digi-Key
- Type:
- Fixed Point
- Interface:
- Host Interface, I2C, McBSP, PCI, UTOPIA
- Clock Rate:
- 1GHz
- Non-Volatile Memory:
- ROM (32kB)
- On-Chip RAM:
- 2.1MB
- Voltage - I/O:
- 1.2V,1.25V,1.5V,1.8V,3.3V
- Voltage - Core:
- 1.20V
- Operating Temperature:
- -40°C ~ 105°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 697-FCBGA (24x24)
TMS320C6455DZTZA FAQ
1.How can I place an order for TMS320C6455DZTZA through Aetrix?
Please submit a Request for Quotation (RFQ) for TMS320C6455DZTZA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TMS320C6455DZTZA reliable?
The price and inventory of TMS320C6455DZTZA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMS320C6455DZTZA is usually 5 days.
3.What payment methods are accepted for TMS320C6455DZTZA?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMS320C6455DZTZA transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TMS320C6455DZTZA?
TMS320C6455DZTZA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TMS320C6455DZTZA order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TMS320C6455DZTZA?
For technical support, including TMS320C6455DZTZA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMS320C6455DZTZA requirements.
6.How does Aetrix verify that TMS320C6455DZTZA is sourced from the original manufacturer or authorized distributors?
All TMS320C6455DZTZA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMS320C6455DZTZA meets industry standards.
7.What is the process for return or replacement of TMS320C6455DZTZA?
All TMS320C6455DZTZA units undergo pre-shipment inspection (PSI). If there is an issue with TMS320C6455DZTZA, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TMS320C6455DZTZA part is unused and in its original packaging.
Return procedure for TMS320C6455DZTZA:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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