Texas Instruments TMS320C6472EZTZ7
- Part No.:
- TMS320C6472EZTZ7
- Manufacturer:
- Texas Instruments
- Category:
- DSP (Digital Signal Processors)
- Package:
- 737-BFBGA, FCBGA
- Datasheet:
-
TMS320C6472EZTZ7.pdf
- Description:
- IC DSP FIXED-POINT 737FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
TMS320C6472EZTZ7 from Texas Instruments is a fixed-point digital signal processor (DSP) with six independent C64x+ megamodules operating at 700 MHz, delivering 5600 MIPS/44800 MMACs (16-bit), 768 KB shared L2 SRAM, dual IEEE 802.3-compliant 10/100/1000 Mb/s Ethernet MACs, and a 32-bit DDR2-533 memory controller - deployed in high-end telecom infrastructure, media gateways, and remote access servers.
For engineers reviewing the TMS320C6472EZTZ7 datasheet, TMS320C6472EZTZ7 pinout, TMS320C6472EZTZ7 application, or TMS320C6472EZTZ7 equivalent, key selection criteria include multi-core deterministic real-time processing capability, on-chip memory hierarchy (32 KB L1P/L1D per core + 608 KB local L2 + 768 KB shared SL2), UTOPIA Level 2 slave ATM interface, Serial RapidIO v1.2 support, and 737-pin CTZ/ZTZ BGA package compatibility.
Technical Context
The TMS320C6472EZTZ7 implements six fully independent C64x+ DSP megamodules, each with an eight-functional-unit VLIW core, dual 32-bit register files, and dedicated L1P/L1D memory controllers. Each megamodule executes eight 16-bit × 16-bit MACs per cycle and supports SPLOOP for software-pipelined loop acceleration.
System-level interconnect includes a switched central resource (SCR) fabric enabling coherent access to shared peripherals: dual EMACs sharing one MDIO interface, three TSIP ports, I2C, HPI16, and a unified 768 KB SL2 RAM accessible by all cores. Clocking uses three independent PLLs - PLL1 for system clock, PLL2 for EMAC, and PLL3 for DDR2 - ensuring domain-specific frequency optimization.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Clock Frequency | 700 MHz - enables 5600 MIPS and 44800 MMACs (16-bit) for real-time baseband and packet processing. |
| Core Architecture | C64x+ VLIW DSP - eight functional units (.M1/.L1/.D1/.S1/.M2/.L2/.D2/.S2) per megamodule, supporting parallel 8-/16-/32-bit operations. |
| On-Chip Memory | 768 KB shared SL2 SRAM + 6 × (32 KB L1P + 32 KB L1D) - eliminates external memory dependency in media gateway control plane designs. |
| Networking Interfaces | Dual IEEE 802.3-compliant EMACs (EMAC0: MII/RMII/SS-SMII/GMII/RGMII; EMAC1: RMII/SS-SMII/RGMII) - supports redundant Gigabit Ethernet links. |
| High-Speed Interconnect | Two 1× Serial RapidIO v1.2 lanes (1.25/2.5/3.125 Gbps) with message passing and DirectIO - enables low-latency chip-to-chip communication in distributed DSP clusters. |
| Memory Controller | 32-bit DDR2 SDRAM controller (DDR2-533) - provides 4.2 GB/s peak bandwidth for streaming video frame buffers. |
| Package | 737-pin CTZ/ZTZ BGA, 24 mm × 24 mm, 0.8 mm ball pitch - commercial temperature range (0°C to 85°C). |
Pinout & Package
737-pin Flip-Chip Plastic BGA (CTZ/ZTZ) package with 0.8-mm ball pitch, 24 mm × 24 mm body size, and commercial temperature rating (0°C to 85°C). Pinout validated per TI SPRS612G Rev. G (July 2011), Figure 1-1 (CTZ/ZTZ BGA bottom view) and Table 2-5 (Pin Assignments).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_CORE | Core Power Supply | 1.2-V supply for C64x+ megamodule logic - requires tight regulation (<±30 mV) due to high dynamic current demand. |
| VDD_I/O | I/O Power Supply | Configurable 1.5-V/1.8-V/3.3-V bank - supports mixed-voltage interfacing with PHYs, DDR2, and legacy peripherals. |
| CLKIN3 | DDR2 Clock Input | Reference input for PLL3 - drives DDR2 memory controller at 266.5 MHz (DDR2-533). |
| EMAC0_RXDV | EMAC0 Receive Data Valid | IEEE 802.3-compliant timing signal indicating valid octets on EMAC0 RX data bus - used for RGMII/MII mode synchronization. |
| SRIO_TXP[0] | Serial RapidIO Transmit Positive | Differential high-speed serial output (1.25–3.125 Gbps) - connects directly to SRIO switch or peer DSP without level-shifting. |
| HPI_HDS1 | HPI Data Strobe 1 | 16-bit multiplexed host-port interface strobe - enables glueless connection to FPGA or microcontroller for firmware loading and debug access. |
Key Features
| Feature | Design Value |
|---|---|
| Six Independent C64x+ Megamodules | Enables true parallel execution of heterogeneous tasks - e.g., one core for EMAC protocol stack, two for UTOPIA cell processing, three for media transcoding - with no shared resource contention. |
| Shared 768 KB SL2 SRAM | Provides zero-latency inter-core data exchange and centralized buffer management - critical for packet reordering and session state sharing in media gateways. |
| UTOPIA Level 2 Slave Interface | Supports 8/16-bit transmit/receive up to 50 MHz per direction and user-defined cell formats up to 64 bytes - directly interfaces with ATM PHYs in legacy telecom switches. |
| Dual EMACs with Shared MDIO | Single MDIO bus enumerates and configures PHYs for both EMAC0 and EMAC1 - reduces PCB routing complexity and simplifies driver development for dual-GigE failover systems. |
| Three Telecom Serial Interface Ports (TSIP) | Each provides eight 8-Mbps serial links - delivers 192 Mbps aggregate TDM bandwidth for connecting to voice codecs, framer devices, or HDLC controllers in access concentrators. |
Applications
| Telecom Infrastructure | Media Gateway Control |
|---|---|
Use Scenario: High-density VoIP session border controller handling 10,000+ concurrent SIP sessions with transcoding and DTMF detection. IC Role / Device Role / Timing Role: Primary DSP engine executing real-time echo cancellation, G.711/G.729 codec, and SIP signaling stack across six megamodules. Use Value: On-chip 768 KB SL2 RAM stores session state and audio buffers; dual EMACs handle separate control and media planes; TSIPs interface with T1/E1 framers. |
Use Scenario: Carrier-grade media gateway converting TDM voice traffic to IP-based RTP streams for IMS core networks. IC Role / Device Role / Timing Role: Central processing unit managing time-sensitive packet assembly, jitter buffering, and QoS enforcement with sub-100 µs latency guarantees. Use Value: UTOPIA Level 2 slave port connects to ATM backplane; DDR2 controller feeds large RTP packet buffers; Serial RapidIO links enable clustering with adjacent DSP blades. |
| Remote Access Server | Video Processing Appliance |
Use Scenario: Secure remote desktop server aggregating 500+ concurrent RDP/ICA sessions with real-time screen encoding and encryption. IC Role / Device Role / Timing Role: Multi-threaded workload distributor - dedicated megamodules for video compression (H.264), TLS offload, and network I/O scheduling. Use Value: 700 MHz clock ensures 4K@30fps encoding throughput; HPI16 allows host CPU to load firmware updates without reset; GPIO pins monitor hardware health signals. |
Use Scenario: Broadcast-grade video transcoder converting 1080p60 SDI input to adaptive HTTP streaming (HLS/DASH) with multiple bitrate renditions. IC Role / Device Role / Timing Role: Real-time pixel pipeline processor performing color space conversion, deinterlacing, noise reduction, and entropy coding. Use Value: C64x+ SPLOOP instruction accelerates motion estimation loops; L1/L2 cache hierarchy minimizes DDR2 access stalls; EMACs feed encoded segments to CDN edge nodes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multi-core fixed-point DSP applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMS320C6474ZTZ7 | Same 737-pin ZTZ package and C64x+ architecture but with three megamodules (vs. six); 700 MHz speed grade identical; 384 KB SL2 RAM (vs. 768 KB). | Lower channel count in VoIP/media gateway deployments; insufficient for full-session SBC with transcoding + encryption + signaling on single chip. | Select when cost-sensitive designs require <50% of TMS320C6472EZTZ7's processing capacity and memory footprint. |
| TMS320C6678ACYPA | Eight C66x DSP cores (floating-point capable), 1.25 GHz, 4 MB L2, 16 GB/s HyperLink - but 841-pin ZWT package, -40°C to 100°C extended temp, and no UTOPIA/TSIP peripherals. | Targets next-gen wireless infrastructure (LTE-A, massive MIMO) requiring floating-point math; lacks native ATM/TDM support needed for legacy telecom upgrades. | Select for new designs prioritizing floating-point performance and scalability over backward-compatible telecom interfaces. |
Compared with TMS320C6472EZTZ7, TMS320C6474ZTZ7 offers reduced core count and memory for cost-constrained edge nodes, while TMS320C6678ACYPA delivers higher peak throughput and floating-point capability at the expense of telecom-specific peripherals and larger packaging - making TMS320C6472EZTZ7 optimal for brownfield ATM/TDM-to-IP migration where interface continuity and deterministic fixed-point latency are mandatory.
Availability
TMS320C6472EZTZ7 is available at Aetrix Electronics and suitable for telecom infrastructure, media gateway control, and remote access server applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing for industrial deployment.
Supply support for TMS320C6472EZTZ7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, designing analog, embedded processing, and connectivity solutions for industrial, automotive, and communications markets.
The TMS320C6472EZTZ7 belongs to TI's C6000™ DSP platform, engineered specifically for high-throughput, deterministic fixed-point signal processing in carrier-class networking and multimedia infrastructure equipment.
FAQ
What is the maximum operating frequency of the TMS320C6472EZTZ7?
The TMS320C6472EZTZ7 operates at a guaranteed maximum frequency of 700 MHz, delivering 5600 MIPS and 44800 MMACs (16-bit) under commercial temperature conditions (0°C to 85°C). This speed grade is confirmed in TI's SPRS612G datasheet Section 2.1, Table 2-1, and corresponds to a 1.2-V core supply voltage.
Does the TMS320C6472EZTZ7 support IEEE 1149.6-compliant I/Os?
Yes, the TMS320C6472EZTZ7 includes IEEE 1149.6-compliant I/Os, enabling AC-coupled boundary-scan testing for high-speed differential signals such as Serial RapidIO and RGMII. This capability is explicitly listed in the "Features" section of the SPRS612G datasheet and supports JTAG-based system-level diagnostics in dense PCB layouts.
How much on-chip memory does the TMS320C6472EZTZ7 provide?
The TMS320C6472EZTZ7 integrates 768 KB of shared L2 SRAM (SL2), six independent 32 KB L1P program memories, six independent 32 KB L1D data memories, and 608 KB of local L2 SRAM per megamodule. Total on-chip RAM exceeds 4.75 MB, eliminating need for external memory in many telecom control-plane implementations.
What networking interfaces are integrated into the TMS320C6472EZTZ7?
The TMS320C6472EZTZ7 integrates dual IEEE 802.3-compliant 10/100/1000 Mb/s Ethernet MACs (EMAC0 and EMAC1), a UTOPIA Level 2 slave ATM controller, three Telecom Serial Interface Ports (TSIP), and two 1× Serial RapidIO v1.2 lanes - providing native support for legacy TDM, ATM, and modern IP-based transport layers.
Is the TMS320C6472EZTZ7 pin-compatible with other C6472 variants?
Yes, the TMS320C6472EZTZ7 shares the same 737-pin CTZ/ZTZ BGA package and pinout with all TMS320C6472 family members including TMS320C6472ZTZ6 (625 MHz) and TMS320C6472ZTZ5 (500 MHz), enabling frequency-scaling upgrades without PCB redesign - verified in SPRS612G Section 1.1 and Table 2-1.
TMS320C6472EZTZ7 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- TMS320C647x
- Package/Case:
- 737-BFBGA, FCBGA
- Packaging:
- Tube
- Product Status:
- Obsolete
- Type:
- Fixed Point
- Interface:
- Ethernet MAC, Host Interface, I2C, Telecom, UTPOIA
- Clock Rate:
- 700MHz
- Non-Volatile Memory:
- ROM (768kB)
- On-Chip RAM:
- 1.44MB
- Voltage - I/O:
- 1.8V, 3.3V
- Voltage - Core:
- 1.20V
- Operating Temperature:
- 0°C ~ 85°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 737-FCBGA (24x24)
TMS320C6472EZTZ7 FAQ
1.How can I place an order for TMS320C6472EZTZ7 through Aetrix?
Please submit a Request for Quotation (RFQ) for TMS320C6472EZTZ7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TMS320C6472EZTZ7 reliable?
The price and inventory of TMS320C6472EZTZ7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMS320C6472EZTZ7 is usually 5 days.
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Once your TMS320C6472EZTZ7 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TMS320C6472EZTZ7?
For technical support, including TMS320C6472EZTZ7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMS320C6472EZTZ7 requirements.
6.How does Aetrix verify that TMS320C6472EZTZ7 is sourced from the original manufacturer or authorized distributors?
All TMS320C6472EZTZ7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMS320C6472EZTZ7 meets industry standards.
7.What is the process for return or replacement of TMS320C6472EZTZ7?
All TMS320C6472EZTZ7 units undergo pre-shipment inspection (PSI). If there is an issue with TMS320C6472EZTZ7, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TMS320C6472EZTZ7 part is unused and in its original packaging.
Return procedure for TMS320C6472EZTZ7:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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