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Texas Instruments TMS320C6474FCUN2
- Part No.:
- TMS320C6474FCUN2
- Manufacturer:
- Texas Instruments
- Category:
- DSP (Digital Signal Processors)
- Package:
- 561-BFBGA, FCCSPBGA
- Datasheet:
-
TMS320C6474FCUN2.pdf
- Description:
- IC DSP MULTICORE 561CSP
- Quantity:
- Payment:
- Shipping:
Inventory:2,093
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Product details
Overview
TMS320C6474FCUN2 from Texas Instruments is a 1.2-GHz triple-core C64x+ DSP for high-throughput telecom infrastructure, featuring three independent 32-bit DSP subsystems, 32 KB L1P direct-mapped cache and 32 KB L1D two-way set-associative cache per core, 3072 KB unified L2 SRAM/Cache, and integrated VCP2/TCP2 coprocessors for real-time AMR and turbo decoding.
For engineers reviewing the TMS320C6474FCUN2 datasheet, TMS320C6474FCUN2 pinout, TMS320C6474FCUN2 application, or TMS320C6474FCUN2 equivalent, this page delivers verified core frequency (1.2 GHz), memory hierarchy (L1P/L1D/L2/L3), antenna interface compliance (OBSAI RP3/CPRI v2.0), Serial RapidIO v1.2 link rates (1.25–3.125 Gbps), and thermal operating range (–40°C to 95°C extended).
Technical Context
The TMS320C6474FCUN2 implements a third-generation VelociTI™ VLIW architecture with eight functional units per core, supporting eight 16-bit × 16-bit MACs/cycle at 1.2 GHz (9600 MMACs/μs), SPLOOP instruction buffering for software-pipelined loops, and compact 16-bit instructions for code density. Its memory subsystem includes configurable L1P (direct-mapped) and L1D (2-way set-associative) caches, plus 3072 KB of on-chip L2 unified SRAM/Cache shared across cores.
Peripherals are interconnected via a DMA switch fabric and include dual 1x Serial RapidIO v1.2 links (1.25/2.5/3.125 Gbps), a 16-/32-bit DDR2-667 controller with dedicated DDR PLL, EMAC with SGMII v1.8 support, and an antenna interface with six full-duplex SerDes lanes compliant to OBSAI RP3 (up to 3.072 Gbps/link) and CPRI v2.0 (up to 2.4576 Gbps/link).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core Count | Three independent TMS320C64x+ DSP cores, enabling parallel signal processing across baseband, control, and packet-processing domains. |
| Max Clock Rate | 1.2 GHz (0.83 ns cycle time), delivering 28,800 MIPS total raw performance - sufficient for multi-carrier WCDMA/LTE baseband stacks. |
| L1 Memory | 32 KB L1P program cache (direct-mapped) + 32 KB L1D data cache (2-way set-associative) per core - optimized for deterministic real-time execution. |
| L2 Memory | 3072 KB unified SRAM/Cache - provides low-latency shared memory for inter-core communication and large FFT buffers. |
| Antenna Interface | Six configurable SerDes links supporting OBSAI RP3 (768 Mbps–3.072 Gbps) and CPRI v2.0 (614.4 Mbps–2.4576 Gbps) - enables direct fronthaul connectivity to remote radio heads. |
| Serial RapidIO | Two 1x v1.2-compliant links with 1.25/2.5/3.125 Gbps rates, message passing, DirectIO, and congestion control - used for chip-to-chip interconnect in distributed baseband units. |
| Operating Temperature | –40°C to 95°C (extended temperature grade), requiring heatsink implementation per TI thermal guidelines for sustained 1.2-GHz operation. |
Pinout & Package
561-pin flip-chip BGA (CUN package), 23 mm × 23 mm body, 0.8 mm ball pitch, RoHS-compliant. Package supports 1.8-V I/Os and 1.1-V core voltage with SmartReflex™ Class 0 adaptive voltage scaling.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKIN1 / CLKIN2 | Primary/secondary clock input | Accepts external reference clocks (e.g., 100 MHz) for system PLL; boot-time selectable source for CPU and DDR clocks. |
| DDR2_DQ[31:0] / DDR2_A[14:0] / DDR2_BA[2:0] | DDR2 SDRAM data/address/bank signals | 32-bit bidirectional data bus, 15-bit address, 3-bit bank select - interfaces directly to DDR2-667 SDRAM without glue logic. |
| SRIO_TX[1:0]_N/P / SRIO_RX[1:0]_N/P | Serial RapidIO differential lanes | Four differential pairs (two per link) supporting 1.25–3.125 Gbps; requires AC-coupling and controlled-impedance PCB routing. |
| AIF_TX[5:0]_N/P / AIF_RX[5:0]_N/P | Antenna interface SerDes lanes | Six full-duplex differential lanes for OBSAI/CPRI fronthaul; each lane operates up to 3.072 Gbps with embedded clock recovery. |
| EMAC_MDIO / EMAC_MDC / EMAC_TXD[7:0] / EMAC_RXD[7:0] | Ethernet MAC physical layer interface | SGMII-compliant 1000BASE-X PHY interface with MDIO management - connects to external SGMII PHY for backhaul Ethernet. |
Key Features
| Feature | Design Value |
|---|---|
| VCP2 Coprocessor | Decodes >694 AMR voice channels (7.95 Kbps, K=9, R=1/3) at CPU/3 clock rate - offloads baseband channel coding from main DSP cores. |
| TCP2 Coprocessor | Handles up to eight 2-Mbps 3GPP turbo-encoded channels (6 iterations) at CPU/3 clock rate - accelerates forward error correction in HSPA/LTE modems. |
| EDMA3 Controller | 64 independent channels with QDMA, linking L2 memory, peripherals, and coprocessors without CPU intervention - enables zero-copy data movement for fronthaul pipelines. |
| Frame Sync Module | Hardware synchronization of DMA transfers across cores and peripherals using external timing signals - ensures deterministic latency alignment in TDD systems. |
| SmartReflex Class 0 | Adaptive core voltage scaling (0.9–1.2 V) based on real-time activity - reduces dynamic power by up to 30% during partial-load operation in base station radios. |
Applications
| Wireless Base Station Radio Unit | Multi-Carrier WCDMA/LTE Fronthaul Gateway |
|---|---|
Use Scenario: Remote radio head (RRH) interfacing with centralized baseband unit (CU) over CPRI/OBSAI links. IC Role / Device Role / Timing Role: Primary baseband processor executing digital up/down conversion, CFR, and MIMO precoding while managing fronthaul SerDes lanes. Use Value: Six AIF SerDes lanes support simultaneous CPRI v2.0 links at 2.4576 Gbps each - enabling four-sector LTE-A 4×4 MIMO RRHs with sub-100 ns timing alignment. |
Use Scenario: Aggregation node converting between proprietary OBSAI RP3 and standardized CPRI v2.0 protocols. IC Role / Device Role / Timing Role: Protocol translation engine with frame synchronization hardware ensuring bit-accurate, jitter-free conversion between fronthaul standards. Use Value: FSYNC module aligns DMA transfers to external 10 MHz/1 PPS references - guarantees <±25 ns phase error across protocol boundaries for TDD coexistence. |
| Distributed Baseband Processing Unit | High-Density Small Cell Controller |
Use Scenario: Rack-mounted baseband unit distributing processing load across multiple TMS320C6474FCUN2 devices via Serial RapidIO. IC Role / Device Role / Timing Role: Node-level DSP executing OFDM modulation/demodulation, HARQ combining, and scheduler functions with inter-device message passing. Use Value: Dual SRIO v1.2 links provide 6.25 Gbps aggregate bandwidth - sustaining 12×100-MHz LTE carriers with <5 μs inter-node latency for coordinated multipoint (CoMP). |
Use Scenario: Indoor pico/femtocell handling up to 64 concurrent UEs with full protocol stack (PHY/MAC/RRC). IC Role / Device Role / Timing Role: Integrated baseband SoC running real-time L1/L2 processing, TCP2/VCP2 offload, and EMAC-based backhaul. Use Value: 3072 KB L2 SRAM eliminates external memory bottlenecks - enabling full 20-MHz LTE carrier processing in single-chip configuration with <1 ms subframe latency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multicore DSP applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMS320C6472FCUN2 | Dual-core variant (2 × C64x+), same 561-pin CUN package, identical peripheral set except one fewer SRIO link and no antenna interface. | Targeted at mid-tier macrocells or control-plane processing where fronthaul SerDes is unnecessary. | Select when fronthaul connectivity is not required and cost-per-MIPS optimization is critical. |
| TMS320C6678ACYPA | Octo-core C66x DSP (1.25 GHz/core), KeyStone architecture, 4 MB L2, integrated PCIe/SRIO/EMIF, but no VCP2/TCP2 or AIF. | Designed for general-purpose packet processing, radar, and software-defined radio - lacks telecom-specific accelerators. | Choose for non-telecom workloads requiring higher core count and PCI Express host interface, accepting trade-off in baseband acceleration. |
Compared with TMS320C6474FCUN2, the TMS320C6472FCUN2 reduces fronthaul capability but lowers power and cost for control-plane tasks, while the TMS320C6678ACYPA offers greater general-purpose throughput and interconnect flexibility at the expense of telecom-specific hardware acceleration and SerDes integration.
Availability
TMS320C6474FCUN2 is available at Aetrix Electronics and suitable for wireless infrastructure, telecom fronthaul gateways, and distributed baseband processing requiring stable component supply, long-lifecycle support, and traceable sourcing for industrial deployment.
Supply support for TMS320C6474FCUN2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and digital signal processing technologies, with decades of leadership in DSP innovation and telecom infrastructure silicon.
The TMS320C6474FCUN2 belongs to TI's C6000™ DSP platform, designed specifically for high-performance, low-latency wireless baseband processing in 3G/4G infrastructure equipment requiring integrated fronthaul, channel coding, and multicore deterministic execution.
FAQ
What is the maximum operating temperature specification for the TMS320C6474FCUN2?
The TMS320C6474FCUN2 is rated for extended temperature operation from –40°C to 95°C. This rating applies specifically to the 1.2-GHz device variant and requires implementation of a heatsink and SmartReflex™ Class 0 adaptive voltage scaling to maintain thermal integrity under sustained 1.2-GHz load conditions as specified in TI's SPRS552H datasheet.
Does the TMS320C6474FCUN2 support both OBSAI RP3 and CPRI v2.0 protocols natively?
Yes, the TMS320C6474FCUN2 antenna interface (AIF) supports both OBSAI RP3 v1.0 and CPRI v2.0 natively through its six configurable SerDes lanes. Each lane operates at programmable rates up to 3.072 Gbps (OBSAI) or 2.4576 Gbps (CPRI), with clock recovery and framing logic implemented in hardware - no FPGA bridging required for protocol compliance.
How many Serial RapidIO lanes does the TMS320C6474FCUN2 provide, and what are their supported link rates?
The TMS320C6474FCUN2 integrates two independent 1x Serial RapidIO v1.2-compliant links, each supporting selectable link rates of 1.25 Gbps, 2.5 Gbps, or 3.125 Gbps. Both links implement message passing, DirectIO, error management extensions, and congestion control - enabling high-bandwidth, low-latency chip-to-chip interconnect in distributed baseband architectures.
What is the total on-chip memory capacity of the TMS320C6474FCUN2, and how is it organized?
The TMS320C6474FCUN2 provides 3200 KB of on-chip memory: 32 KB L1P cache (direct-mapped) + 32 KB L1D cache (2-way set-associative) per core (96 KB total), 3072 KB unified L2 SRAM/Cache, and 64 KB L3 ROM. This hierarchical structure enables deterministic real-time execution while supporting large FFTs, channel estimation buffers, and shared inter-core data structures.
Is the TMS320C6474FCUN2 pin-compatible with other C6474 package variants such as GUN or ZUN?
Yes, the TMS320C6474FCUN2 shares identical pinout and package footprint with the GUN and ZUN variants - all use the 561-pin CUN/GUN/ZUN BGA package with 0.8-mm ball pitch. This allows direct PCB reuse across commercial (CUN), extended temperature (GUN), and automotive-grade (ZUN) versions, provided thermal and voltage design margins are validated per variant specifications.
TMS320C6474FCUN2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- TMS320C647x
- Package/Case:
- 561-BFBGA, FCCSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Type:
- Fixed Point
- Interface:
- Ethernet MAC, I2C, McBSP
- Clock Rate:
- 1.2GHz
- Non-Volatile Memory:
- ROM (64kB)
- On-Chip RAM:
- 3.168MB
- Voltage - I/O:
- 1.1V, 1.8V
- Voltage - Core:
- 1.10V
- Operating Temperature:
- 0°C ~ 95°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 561-FC/CSP (23x23)
TMS320C6474FCUN2 FAQ
1.How can I place an order for TMS320C6474FCUN2 through Aetrix?
Please submit a Request for Quotation (RFQ) for TMS320C6474FCUN2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TMS320C6474FCUN2 reliable?
The price and inventory of TMS320C6474FCUN2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMS320C6474FCUN2 is usually 5 days.
3.What payment methods are accepted for TMS320C6474FCUN2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMS320C6474FCUN2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TMS320C6474FCUN2?
TMS320C6474FCUN2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TMS320C6474FCUN2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TMS320C6474FCUN2?
For technical support, including TMS320C6474FCUN2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMS320C6474FCUN2 requirements.
6.How does Aetrix verify that TMS320C6474FCUN2 is sourced from the original manufacturer or authorized distributors?
All TMS320C6474FCUN2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMS320C6474FCUN2 meets industry standards.
7.What is the process for return or replacement of TMS320C6474FCUN2?
All TMS320C6474FCUN2 units undergo pre-shipment inspection (PSI). If there is an issue with TMS320C6474FCUN2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TMS320C6474FCUN2 part is unused and in its original packaging.
Return procedure for TMS320C6474FCUN2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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