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Texas Instruments TMS320C6474FCUNA
- Part No.:
- TMS320C6474FCUNA
- Manufacturer:
- Texas Instruments
- Category:
- DSP (Digital Signal Processors)
- Package:
- 561-BFBGA, FCCSPBGA
- Datasheet:
-
TMS320C6474FCUNA.pdf
- Description:
- IC DSP MULTICORE 561CSP
- Quantity:
- Payment:
- Shipping:
Inventory:3,841
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Product details
Overview
TMS320C6474FCUNA from Texas Instruments is a 1.2-GHz triple-core C64x+ DSP optimized for baseband processing in wireless infrastructure, delivering 28,800 MIPS aggregate performance, 32 KB L1P direct-mapped cache, 32 KB L1D two-way set-associative cache, and integrated VCP2/TCP2 coprocessors for real-time AMR and turbo decoding in multi-carrier 3GPP systems.
For engineers reviewing the TMS320C6474FCUNA datasheet, TMS320C6474FCUNA pinout, TMS320C6474FCUNA application, or TMS320C6474FCUNA equivalent, key selection criteria include its 561-pin CUN BGA package, DDR2-667 memory controller, dual Serial RapidIO v1.2 links, antenna interface supporting OBSAI RP3/CPRI, and SmartReflex Class 0 adaptive voltage scaling (0.9–1.2 V core).
Technical Context
The TMS320C6474FCUNA implements three independent C64x+ megamodules, each with eight functional units (two .M multipliers), 32-bit register files, and SPLOOP instruction buffering for software-pipelined loops. Its memory subsystem includes 3.2 MB on-chip L2 unified SRAM/cache and 64 KB L3 ROM, managed via dedicated L1/L2 memory controllers with bandwidth allocation and protection.
Peripherals are interconnected via a DMA switch fabric and configured through a 32-bit peripheral CFG port. The device integrates dual 1.25–3.125 Gbps Serial RapidIO links with message passing and DirectIO support, a 1000-Mbps Ethernet MAC compliant with IEEE 802.3 and SGMII v1.8, and an antenna interface with six configurable full-duplex SerDes links supporting 768 Mbps to 3.072 Gbps per link under OBSAI RP3 and CPRI v2.0.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core Count | Three independent TMS320C64x+ DSP cores, enabling parallel execution of baseband, control, and signal processing tasks across separate subsystems. |
| Max Clock Rate | 1.2 GHz (0.83 ns cycle time), enabling 9600 16-bit MMACs per microsecond per core for high-throughput channel coding. |
| L1 Memory | 32 KB L1P program cache (direct-mapped) + 32 KB L1D data cache (2-way set-associative), reducing instruction/data fetch latency in real-time loops. |
| DDR2 Interface | 16-/32-bit DDR2-667 controller with dedicated DDR PLL, supporting up to 1.06 GB/s sustained memory bandwidth for large frame buffers. |
| Accelerators | VCP2 coprocessor decodes >694 AMR voice channels; TCP2 handles up to eight 2-Mbps 3GPP turbo channels (6 iterations), offloading CPU-intensive decoding. |
| High-Speed I/O | Dual 1× Serial RapidIO v1.2 links (1.25/2.5/3.125 Gbps); six 64-bit timers; 16 GPIO; I²C; two McBSPs; EMAC with MDIO and SGMII PHY interface. |
| Package | 561-pin CUN BGA, 23 mm × 23 mm, 0.8-mm ball pitch, designed for thermal management in dense telecom blade applications with heatsink requirement. |
Pinout & Package
561-pin Flip-Chip Ball Grid Array (CUN package), 23 mm × 23 mm footprint, 0.8-mm ball pitch, requiring heatsink for operation within -40°C to 95°C extended temperature range. Pinout validated per TI SPRS552H Figure 1-1 (CUN/GUN/ZUN bottom view) and Section 2.5 "Pin Assignments".
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKIN1 | Primary clock input | Accepts external reference (e.g., 100 MHz) fed to System PLL for CPU/DDR clock generation; supports bypass mode for direct clocking. |
| DDRREFCLK(N|P) | DDR2 reference clock differential pair | Provides timing reference to DDR2 SDRAM; must be routed as controlled-impedance differential pair for stable 333 MHz operation. |
| SRIOLINK0_TX+/TX- | Serial RapidIO Link 0 transmit differential pair | Carries 1.25–3.125 Gbps serialized data to peer device; requires AC-coupling capacitors and 100-Ω differential termination. |
| AIF_RX0+/RX- | Antenna Interface Link 0 receive differential pair | Receives OBSAI RP3/CPRI-compliant baseband IQ data at up to 3.072 Gbps; supports clock recovery and frame alignment. |
| EMAC_MDIO | Management Data I/O | Single-wire bidirectional interface to configure and monitor Ethernet PHY status (e.g., link up/down, speed, duplex) without CPU intervention. |
| GPIO[0:15] | General-purpose I/O | Configurable as inputs with interrupt/event generation or outputs; used for board-level control signals, reset sequencing, or status indication. |
Key Features
| Feature | Design Value |
|---|---|
| Triple C64x+ DSP cores | Enables hardware partitioning of control plane (core 0), user plane (core 1), and accelerator coordination (core 2) in LTE/3G base stations. |
| VCP2/TCP2 coprocessors | Offloads >95% of Viterbi and turbo decoding cycles, freeing CPU resources for higher-layer protocol stack execution. |
| EDMA3 controller (64 channels) | Provides zero-CPU-overhead data movement between L2 memory, peripherals, and accelerators, critical for deterministic real-time throughput. |
| SmartReflex Class 0 | Adaptively scales core voltage (0.9–1.2 V) based on workload and temperature, reducing dynamic power by up to 40% versus fixed-voltage operation. |
| OBSAI RP3 / CPRI v2.0 AIF | Eliminates need for external SerDes or framer ICs in remote radio head (RRH) designs, simplifying board layout and lowering BOM cost. |
Applications
| Wireless Base Station Baseband Processing | Multi-Carrier 3GPP Node B |
|---|---|
Use Scenario: Real-time processing of up to 12 carriers in WCDMA FDD systems with simultaneous AMR voice and HSDPA data traffic. IC Role / Device Role / Timing Role: Primary baseband processor executing physical layer algorithms (channel coding, modulation, FFT), synchronized via frame sync interface to RF front-end. Use Value: Triple-core architecture and VCP2/TCP2 enable full 3GPP Release 7 compliance with <100 μs latency for HARQ retransmission decisions. | Use Scenario: Centralized baseband unit (BBU) in distributed RAN architecture, aggregating data from multiple RRHs over CPRI links. IC Role / Device Role / Timing Role: High-throughput packet processor handling I/Q sample transport, CPRI framing, and Layer 1 acceleration for up to 6 sectors. Use Value: Dual Serial RapidIO links provide 6.25 Gbps inter-processor bandwidth for load-balanced multi-DSP clustering without external switches. |
| Remote Radio Head (RRH) Control | Software-Defined Radio Transceiver |
Use Scenario: Compact RRH unit mounted on cell tower, performing digital predistortion (DPD), crest factor reduction (CFR), and CPRI interface bridging. IC Role / Device Role / Timing Role: Real-time signal conditioning engine with deterministic timer-triggered DPD coefficient updates every 100 μs. Use Value: Six 64-bit timers and GPIO with event capture enable sub-microsecond timing precision for RF calibration and feedback loop closure. | Use Scenario: Reconfigurable wideband transceiver supporting LTE, WiMAX, and TD-SCDMA in military comms or test equipment. IC Role / Device Role / Timing Role: Programmable waveform processor executing OFDM symbol generation, MIMO detection, and adaptive modulation in real time. Use Value: 3.2 MB on-chip L2 SRAM allows storage of multiple waveform libraries and channel impulse response buffers without external DRAM latency penalty. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multicore DSP applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMS320C6472FCUNA | Dual-core variant (2 × C64x+), 1 GHz max clock, no antenna interface, reduced L2 memory (2.4 MB), same CUN package. | Suitable for lower-channel-count macrocells or control-plane-only deployments where AIF and third core are unnecessary. | Select when system throughput requirements are ≤60% of TMS320C6474FCUNA and CPRI/OBSAI connectivity is not required. |
| TMS320C6678ACYPA | Octal-core C66x DSP (1.25 GHz), KeyStone architecture, 4 MB L2, integrated SRIO switch, no VCP2/TCP2, 841-pin ZZE package. | Targets next-gen LTE-Advanced and massive MIMO with higher core count and packet-processing acceleration, but lacks dedicated channel-decoding hardware. | Choose for forward-looking designs requiring scalable multi-DSP clusters and software-defined PHY layers, accepting trade-off in fixed-function accelerator support. |
Compared with TMS320C6474FCUNA, the TMS320C6472FCUNA reduces cost and power by removing one core and the antenna interface while retaining identical toolchain compatibility; the TMS320C6678ACYPA shifts toward general-purpose packet processing and floating-point compute at the expense of legacy 3GPP channel decoder integration.
Availability
TMS320C6474FCUNA is available at Aetrix Electronics and suitable for wireless infrastructure, telecom baseband processing, and remote radio head designs requiring stable component supply, long-term lifecycle support, and traceable sourcing for production programs.
Supply support for TMS320C6474FCUNA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of leadership in DSP innovation and wireless infrastructure silicon.
The TMS320C6474FCUNA belongs to TI's C6000™ DSP platform, designed specifically for high-throughput, low-latency baseband processing in 3G/4G wireless infrastructure equipment including Node Bs, RRHs, and BBU systems.
FAQ
What is the maximum operating temperature range for the TMS320C6474FCUNA?
The TMS320C6474FCUNA is rated for extended temperature operation from –40°C to 95°C. This specification applies to the 1.2-GHz device variant and requires implementation of a heatsink to maintain junction temperature within limits under full load. The datasheet explicitly states that a heatsink is mandatory to ensure the device remains within this thermal envelope during sustained 1.2-GHz operation.
Does the TMS320C6474FCUNA support both OBSAI and CPRI protocols on its antenna interface?
Yes, the TMS320C6474FCUNA antenna interface (AIF) natively supports both OBSAI RP3 v1.0 and CPRI v2.0 protocols. It delivers configurable link rates of 768 Mbps, 1.536 Gbps, and 3.072 Gbps for OBSAI, and 614.4 Mbps, 1.2288 Gbps, and 2.4576 Gbps for CPRI - all implemented in hardware without firmware overhead. This dual-standard support is confirmed in Section 1.2.2 of the SPRS552H datasheet.
How many independent EDMA3 channels does the TMS320C6474FCUNA provide?
The TMS320C6474FCUNA integrates a full-featured EDMA3 controller with 64 independent channels. These channels support concurrent, zero-CPU-overhead data transfers between internal memory (L1/L2), peripherals (EMAC, McBSP, AIF), and coprocessors (VCP2/TCP2). Each channel has configurable priority, linking, and parameter reload capability, as documented in Section 7.5 of the SPRS552H datasheet.
Is the TMS320C6474FCUNA pin-compatible with other C6474 package variants like GUN or ZUN?
No, the TMS320C6474FCUNA is not pin-compatible with GUN or ZUN variants. While all three share the same 561-pin BGA footprint and 0.8-mm pitch, the CUN package uses a flip-chip construction with different ball map and thermal pad configuration. The datasheet explicitly lists CUN, GUN, and ZUN as distinct package suffixes with separate mechanical drawings (Section 8.2), and pin assignments differ in power delivery and thermal management routing.
What type of memory protection does the TMS320C6474FCUNA implement for L1 and L2 memory?
The TMS320C6474FCUNA implements hardware-enforced memory protection for both L1 and L2 memory via dedicated memory controllers. L1 memory protection includes configurable access permissions (read/write/execute) per page, while L2 protection supports bandwidth management and memory region locking to prevent unauthorized access or starvation. These features are detailed in Sections 5.3 (Memory Protection) and 5.4 (Bandwidth Management) of the SPRS552H datasheet.
TMS320C6474FCUNA Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- TMS320C647x
- Package/Case:
- 561-BFBGA, FCCSPBGA
- Packaging:
- Tray
- Product Status:
- Last Time Buy
- Type:
- Fixed Point
- Interface:
- Ethernet MAC, I2C, McBSP
- Clock Rate:
- 1GHz
- Non-Volatile Memory:
- ROM (64kB)
- On-Chip RAM:
- 3.168MB
- Voltage - I/O:
- 1.1V, 1.8V
- Voltage - Core:
- 1.10V
- Operating Temperature:
- -40°C ~ 100°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 561-FC/CSP (23x23)
TMS320C6474FCUNA FAQ
1.How can I place an order for TMS320C6474FCUNA through Aetrix?
Please submit a Request for Quotation (RFQ) for TMS320C6474FCUNA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TMS320C6474FCUNA reliable?
The price and inventory of TMS320C6474FCUNA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMS320C6474FCUNA is usually 5 days.
3.What payment methods are accepted for TMS320C6474FCUNA?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMS320C6474FCUNA transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TMS320C6474FCUNA?
TMS320C6474FCUNA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TMS320C6474FCUNA order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TMS320C6474FCUNA?
For technical support, including TMS320C6474FCUNA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMS320C6474FCUNA requirements.
6.How does Aetrix verify that TMS320C6474FCUNA is sourced from the original manufacturer or authorized distributors?
All TMS320C6474FCUNA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMS320C6474FCUNA meets industry standards.
7.What is the process for return or replacement of TMS320C6474FCUNA?
All TMS320C6474FCUNA units undergo pre-shipment inspection (PSI). If there is an issue with TMS320C6474FCUNA, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TMS320C6474FCUNA part is unused and in its original packaging.
Return procedure for TMS320C6474FCUNA:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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