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Texas Instruments TMS320C6474FCUNA2
- Part No.:
- TMS320C6474FCUNA2
- Manufacturer:
- Texas Instruments
- Category:
- DSP (Digital Signal Processors)
- Package:
- 561-BFBGA, FCCSPBGA
- Datasheet:
-
TMS320C6474FCUNA2.pdf
- Description:
- IC DSP MULTICORE 561CSP
- Quantity:
- Payment:
- Shipping:
Inventory:1,176
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Product details
Overview
TMS320C6474FCUNA2 from Texas Instruments is a 1.2-GHz triple-core C64x+ DSP optimized for telecom infrastructure baseband processing, supporting up to 28,800 MIPS aggregate performance, 32 KB L1P direct-mapped cache, 32 KB L1D two-way set-associative cache, and integrated VCP2/TCP2 coprocessors for real-time AMR and turbo decoding in wireless base stations.
For engineers reviewing the TMS320C6474FCUNA2 datasheet, TMS320C6474FCUNA2 pinout, TMS320C6474FCUNA2 application, or TMS320C6474FCUNA2 equivalent, key selection criteria include its 561-pin CUN BGA package, -40°C to 95°C extended temperature rating, DDR2-667 memory controller, dual Serial RapidIO v1.2 links, and antenna interface compliant with OBSAI RP3 and CPRI v2.0 standards.
Technical Context
The TMS320C6474FCUNA2 implements three independent C64x+ DSP cores on a single die, each with eight functional units (two multipliers), dual 32-register files, and SPLOOP instruction buffering for software-pipelined loops. Its memory subsystem includes 32 KB L1P (direct-mapped), 32 KB L1D (2-way set-associative), and 64 KB L3 ROM, all operating at full CPU clock rate.
Peripherally, it integrates a 16-/32-bit DDR2-667 controller with dedicated DDR PLL, two 1x Serial RapidIO v1.2 links (1.25/2.5/3.125 Gbps), an antenna interface with six configurable high-speed serial links (up to 3.072 Gbps per link), and dual McBSPs supporting 100 Mbps operation - all managed via EDMA3 with 64 independent channels.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Clock Rate | 1.2 GHz - enables 0.83 ns instruction cycle time and 9600 16-bit MMACs per microsecond per core |
| Core Count | 3 × C64x+ DSP cores - provides parallel execution of baseband, control, and signal processing tasks |
| L1 Memory | 32 KB L1P (direct-mapped cache) + 32 KB L1D (2-way set-associative cache) - reduces latency for program fetch and data access |
| Memory Controller | 16-/32-bit DDR2-667 - supports up to 1066 MB/s bandwidth for external frame buffer and packet memory |
| Serial Interface | Two 1x Serial RapidIO v1.2 links - enables chip-to-chip interconnect at 1.25/2.5/3.125 Gbps with message passing and congestion control |
| Antenna Interface | 6-link AIF compliant with OBSAI RP3 and CPRI v2.0 - handles fronthaul traffic at 614.4 Mbps to 3.072 Gbps per link |
| Operating Temperature | -40°C to 95°C - qualified for extended-temperature base station deployment without derating |
| Package | 561-pin CUN BGA, 0.8-mm pitch, 23 mm × 23 mm - requires heatsink and SmartReflex Class 0 adaptive voltage (0.9–1.2 V core) |
Pinout & Package
561-pin Flip-Chip Ball Grid Array (CUN package), 0.8-mm ball pitch, 23 mm × 23 mm footprint, designed for thermal management with mandatory heatsink mounting per TI specification SPRS552H.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKIN1 | Primary oscillator input | Accepts 25–100 MHz crystal or LVDS clock; feeds system PLL for CPU/DDR clock generation |
| DDRREFCLK_N/P | DDR2 reference clock differential pair | Provides 333 MHz reference for DDR2-667 controller timing compliance |
| SRIOLINK0_TX+/TX- | Serial RapidIO Lane 0 transmit differential pair | Carries 1.25/2.5/3.125 Gbps encoded traffic; requires AC-coupling and 100-Ω differential termination |
| AIF_RX0_P/N | Antenna interface Link 0 receive differential pair | Supports OBSAI RP3/CPRI v2.0 physical layer; operates at 768 Mbps to 3.072 Gbps |
| EMAC_MDIO | Management Data I/O | Single-wire bidirectional interface for PHY configuration and status polling per IEEE 802.3 clause 22 |
| GPIO[0:15] | General-purpose I/O | 16 pins configurable as inputs with interrupt capability or outputs; level-shifted for 1.1-V/1.8-V I/O domains |
Key Features
| Feature | Design Value |
|---|---|
| Triple C64x+ DSP cores | Delivers 28,800 MIPS total throughput with hardware-supported loop optimization (SPLOOP) and compact 16-bit instructions |
| VCP2/TCP2 coprocessors | Offloads channel decoding: VCP2 processes >694 AMR voice channels; TCP2 decodes up to eight 2-Mbps 3GPP turbo streams (6 iterations) |
| Dual Serial RapidIO v1.2 | Enables deterministic, low-latency inter-DSP communication with error management and direct I/O support across backplanes |
| OBSAI RP3 / CPRI v2.0 AIF | Provides standardized fronthaul connectivity for remote radio heads with protocol-aware serialization and clock recovery |
| SmartReflex Class 0 | Adaptive core voltage scaling (0.9–1.2 V) dynamically tracks process/temperature/voltage variations to minimize power at target performance |
| EDMA3 with 64 channels | Enables zero-CPU-overhead data movement between L2 SRAM, peripherals, and DDR2 memory with scatter-gather and chaining support |
Applications
| Wireless Base Station Baseband Unit | Multi-Radio Distributed Antenna System |
|---|---|
Use Scenario: Real-time processing of LTE/UMTS/WCDMA physical layer signals in macrocell BTS cabinets with multiple carrier aggregation. IC Role / Device Role / Timing Role: Primary baseband processor executing FFT, channel estimation, MIMO detection, and turbo/Viterbi decoding across three synchronized cores. Use Value: Achieves 28,800 MIPS aggregate compute with on-die VCP2/TCP2 acceleration, eliminating need for discrete decoder ASICs and reducing board area by 35%. | Use Scenario: Centralized digital unit (CU) in C-RAN architecture connecting to multiple remote radio heads (RRHs) over fiber. IC Role / Device Role / Timing Role: Fronthaul gateway managing OBSAI RP3/CPRI v2.0 data streams from six antenna links while performing real-time IQ sample processing. Use Value: Native AIF with six 3.072-Gbps links eliminates external SerDes, enabling direct optical interface with <100 ns latency and deterministic jitter <1 ps RMS. |
| High-Density Media Gateway | Defense Radar Signal Processor |
Use Scenario: Voice transcoding and packet processing in VoIP gateways handling >10,000 concurrent calls with echo cancellation and jitter buffering. IC Role / Device Role / Timing Role: Multicore DSP executing AMR-WB encoding, G.729 compression, and SIP signaling stack with hardware-accelerated crypto offload. Use Value: VCP2 supports >694 AMR voice channels at 7.95 Kbps, enabling 3× call density versus single-core alternatives without external memory bottlenecks. | Use Scenario: Pulse-Doppler radar beamforming and CFAR detection in airborne electronic warfare systems requiring deterministic real-time response. IC Role / Device Role / Timing Role: Time-critical signal processor running FFT-based STAP, space-time adaptive filtering, and track-before-detect algorithms with guaranteed worst-case latency. Use Value: L1P/L1D cache hierarchy and EDMA3 with priority arbitration ensure sub-500 ns interrupt response and zero-cycle context switch for critical ISR execution. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multicore DSP applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMS320C6472FCUNA2 | Dual-core variant; identical C64x+ architecture, same 561-pin CUN package, but lacks third core and one SRIO link | Suitable for lower-channel-count base stations or cost-sensitive media gateways where 19,200 MIPS suffices | Select when full 28,800 MIPS is unnecessary and BOM cost reduction is prioritized over future scalability |
| TMS320C6678ACYPA | Eight-core C66x DSP with 1.25 GHz clock; 684-pin BGA; supports KeyStone I architecture, not C64x+ binary compatible | Targets next-generation 4G/5G massive MIMO and beamforming with higher per-core throughput and enhanced floating-point support | Choose for new designs requiring IEEE 754-compliant FP64/FP32, PCIe Gen2, or hyperlink interconnect instead of SRIO/AIF |
Compared with TMS320C6472FCUNA2, the TMS320C6474FCUNA2 delivers 50% more raw MIPS and full OBSAI/CPRI fronthaul capability; versus TMS320C6678ACYPA, it offers proven C64x+ toolchain compatibility and lower power-per-MIPS for legacy 3GPP deployments but lacks native floating-point and PCIe.
Availability
TMS320C6474FCUNA2 is available at Aetrix Electronics and suitable for wireless infrastructure baseband units, distributed antenna systems, media gateways, and defense radar signal processors requiring stable component supply across long product lifecycles.
Supply support for TMS320C6474FCUNA2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, specializing in analog, embedded processing, and digital signal processing technologies for industrial, automotive, and communications markets.
The TMS320C6474FCUNA2 belongs to TI's C6000™ DSP platform, specifically engineered for high-throughput, low-latency baseband processing in wireless infrastructure equipment with integrated fronthaul and backhaul interfaces.
FAQ
What is the maximum operating temperature range for the TMS320C6474FCUNA2?
The TMS320C6474FCUNA2 is rated for extended temperature operation from –40°C to 95°C, validated per TI SPRS552H specification. This range requires mandatory use of a heatsink and implementation of SmartReflex Class 0 adaptive voltage scaling to maintain core voltage between 0.9 V and 1.2 V under thermal load. Operation beyond 95°C case temperature is not supported and may trigger thermal shutdown.
Does the TMS320C6474FCUNA2 support pin-compatible migration from earlier C64x+ devices?
No, the TMS320C6474FCUNA2 is not pin-compatible with prior C64x+ devices due to its 561-pin CUN BGA package, which differs in ball count, pitch (0.8 mm), and signal assignment from legacy C6416/C6455 packages. While code is upward-compatible within the C6000™ platform, PCB redesign is required. Migration paths exist to TMS320C6472FCUNA2 (dual-core, same package) or TMS320C6678ACYPA (different footprint, architecture).
How does the antenna interface (AIF) on the TMS320C6474FCUNA2 handle OBSAI RP3 and CPRI v2.0 protocols?
The TMS320C6474FCUNA2 AIF implements six fully configurable high-speed serial links, each supporting OBSAI RP3 (768 Mbps, 1.536 Gbps, 3.072 Gbps) and CPRI v2.0 (614.4 Mbps, 1.2288 Gbps, 2.4576 Gbps) line rates. Each link includes independent differential RX/TX pairs with embedded clock recovery, framing logic, and protocol-specific scrambling - all managed by dedicated AIF registers without CPU intervention.
What memory bandwidth does the DDR2-667 controller on the TMS320C6474FCUNA2 provide?
The TMS320C6474FCUNA2's 16-/32-bit DDR2-667 memory controller delivers up to 1066 MB/s peak bandwidth using a 333 MHz clock (DDR2-667). It supports 16-bit or 32-bit data bus widths, programmable burst lengths (4/8), and CAS latencies (3–6), with dedicated DDR PLL ensuring timing compliance. Bandwidth is shared across three cores via the on-chip data switch fabric, with configurable arbitration to prioritize latency-critical transfers.
Can the TMS320C6474FCUNA2 execute legacy C64x code without modification?
Yes, the TMS320C6474FCUNA2 is upward code-compatible with earlier C64x devices per TI documentation. All C64x instructions execute identically, and the C64x+ enhancements (SPLOOP, compact instructions, complex multiply) are optional extensions. Existing C64x object code runs unmodified, though recompilation with C64x+ compiler tools unlocks performance gains from new instructions and memory optimizations.
TMS320C6474FCUNA2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- TMS320C647x
- Package/Case:
- 561-BFBGA, FCCSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Type:
- Fixed Point
- Interface:
- Ethernet MAC, I2C, McBSP
- Clock Rate:
- 1.2GHz
- Non-Volatile Memory:
- ROM (64kB)
- On-Chip RAM:
- 3.168MB
- Voltage - I/O:
- 1.1V, 1.8V
- Voltage - Core:
- 1.10V
- Operating Temperature:
- -40°C ~ 95°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 561-FC/CSP (23x23)
TMS320C6474FCUNA2 FAQ
1.How can I place an order for TMS320C6474FCUNA2 through Aetrix?
Please submit a Request for Quotation (RFQ) for TMS320C6474FCUNA2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TMS320C6474FCUNA2 reliable?
The price and inventory of TMS320C6474FCUNA2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMS320C6474FCUNA2 is usually 5 days.
3.What payment methods are accepted for TMS320C6474FCUNA2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMS320C6474FCUNA2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TMS320C6474FCUNA2?
TMS320C6474FCUNA2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TMS320C6474FCUNA2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TMS320C6474FCUNA2?
For technical support, including TMS320C6474FCUNA2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMS320C6474FCUNA2 requirements.
6.How does Aetrix verify that TMS320C6474FCUNA2 is sourced from the original manufacturer or authorized distributors?
All TMS320C6474FCUNA2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMS320C6474FCUNA2 meets industry standards.
7.What is the process for return or replacement of TMS320C6474FCUNA2?
All TMS320C6474FCUNA2 units undergo pre-shipment inspection (PSI). If there is an issue with TMS320C6474FCUNA2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TMS320C6474FCUNA2 part is unused and in its original packaging.
Return procedure for TMS320C6474FCUNA2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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