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Texas Instruments TMS320C6474FGUNA
- Part No.:
- TMS320C6474FGUNA
- Manufacturer:
- Texas Instruments
- Category:
- DSP (Digital Signal Processors)
- Package:
- 561-BFBGA
- Datasheet:
-
TMS320C6474FGUNA.pdf
- Description:
- IC DSP FIXED POINT 561FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,715
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Product details
Overview
TMS320C6474FGUNA from Texas Instruments is a high-performance, triple-core C64x+ DSP optimized for telecom infrastructure and wireless baseband processing. It operates at 1.2 GHz (0.83-ns cycle time), integrates three independent 32-bit DSP cores, 3072 KB on-chip L2 SRAM, dual Serial RapidIO v1.2 links (up to 3.125 Gbps), and dedicated VCP2/TCP2 coprocessors for real-time AMR and turbo decoding - deployed in macrocell BTS and MIMO-OFDM baseband subsystems.
For engineers reviewing the TMS320C6474FGUNA datasheet, TMS320C6474FGUNA pinout, TMS320C6474FGUNA application, or TMS320C6474FGUNA equivalent, this page delivers verified core frequency, memory architecture, SRIO/antenna interface timing, thermal limits, and validated drop-in alternatives - all aligned with SPRS552H revision April 2011 production data.
Technical Context
The TMS320C6474FGUNA implements a third-generation VelociTI™ VLIW architecture with eight functional units per core, supporting eight 16-bit × 16-bit MACs/cycle at 1.2 GHz (9600 MMACs/μs). Its memory hierarchy includes 32 KB L1P (direct-mapped), 32 KB L1D (2-way set-associative), and 3072 KB unified L2 SRAM - all configurable as cache or RAM with hardware memory protection and bandwidth management.
Peripherals are interconnected via a DMA switch fabric and include two 1.8-V McBSPs (100 Mbps), six 64-bit timers (configurable as twelve 32-bit), 16 GPIOs, IEEE 802.3-compliant 1000-Mbps EMAC with SGMII, and an OBSAI RP3/CPRI-compliant antenna interface with six full-duplex SerDes lanes operating up to 3.072 Gbps per link.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core Count | Three independent TMS320C64x+ DSP cores - enables parallel execution of baseband, control, and signal processing tasks without inter-core contention. |
| Max Clock Rate | 1.2 GHz - delivers 28,800 MIPS aggregate performance; requires SmartReflex Class 0 adaptive voltage (0.9–1.2 V core) and heatsink. |
| L2 Memory Size | 3072 KB unified SRAM/cache - provides low-latency, deterministic access for real-time FFT, channel estimation, and MIMO matrix operations. |
| Serial RapidIO | Two 1× links, v1.2 compliant, 1.25/2.5/3.125 Gbps - supports chip-to-chip interconnect with message passing, DirectIO, and congestion control in multi-DSP systems. |
| Antenna Interface | Six configurable SerDes lanes, OBSAI RP3 & CPRI v2.0 compliant, up to 3.072 Gbps/link - directly interfaces with remote radio heads in LTE/FDD/TDD base stations. |
| VCP2/TCP2 Throughput | VCP2 decodes >694 AMR 7.95-Kbps channels; TCP2 handles eight 2-Mbps 3GPP turbo channels (6 iterations) - offloads critical PHY-layer decoding from CPU. |
| Package | 561-pin BGA (GUN suffix), 23 mm × 23 mm, 0.8-mm ball pitch - requires controlled thermal design per TI's extended temperature (-40°C to 95°C) specification. |
Pinout & Package
561-pin Flip-Chip BGA (FCBGA), GUN package, 0.8-mm ball pitch, 23 mm × 23 mm body size. Thermal pad exposed on underside; requires solder paste stencil optimization and underfill for reliability in telecom base station environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKIN1 | Primary clock input | Accepts 25–100 MHz crystal or LVDS reference; feeds System PLL (PLL1) for CPU/core clock generation. |
| DDRREFCLK(N|P) | DDR2 reference clock pair | Differential LVDS input for DDR2 memory controller; must be phase-aligned with DDR2 DQS signals for timing closure. |
| SRIO_TX[0:1]/RX[0:1] | Serial RapidIO differential I/O | Four pairs (2 lanes × TX/RX); support AC-coupled 100-Ω termination; require impedance-controlled PCB routing ≤5 mil width/6 mil spacing. |
| AIF_TX[0:5]/RX[0:5] | Antenna interface SerDes lanes | Six full-duplex differential pairs; operate at 768 Mbps–3.072 Gbps; demand strict jitter budget (<1.5 ps RMS) and matched trace lengths. |
| EMAC_MDIO / EMAC_MDC | PHY management interface | Open-drain I²C-like bus for configuring external Ethernet PHY; requires 2.2-kΩ pull-up to 1.8 V. |
| GPIO[0:15] | General-purpose I/O | 16 pins with programmable interrupt/event generation; support 1.8-V or 1.1-V I/O voltage; usable for board-level status signaling or FPGA handshake. |
Key Features
| Feature | Design Value |
|---|---|
| Triple C64x+ DSP cores | Enables concurrent execution of Layer 1 (PHY), Layer 2 (MAC), and system control software - eliminating need for external ASICs in mid-tier base stations. |
| EDMA3 controller (64 channels) | Hardware-accelerated memory moves with scatter-gather support - sustains 100% DMA bandwidth for simultaneous AIF, SRIO, and DDR2 traffic without CPU intervention. |
| SmartReflex Class 0 | Dynamic voltage scaling (0.9–1.2 V core) synchronized with CPU load - reduces active power by up to 40% versus fixed-voltage operation in bursty traffic scenarios. |
| Frame Synchronization (FSYNC) | Hardware-triggered DMA synchronization across cores and peripherals - ensures deterministic timing alignment for TDD frame boundaries and CPRI sample clocks. |
| IEEE-1149.1/1149.6 JTAG | Full boundary-scan support including AC-coupled differential signals (SRIO/AIF) - enables production test and debug of high-speed SerDes interconnects. |
Applications
| Macrocell Base Station (LTE FDD) | Small Cell Remote Radio Head (RRH) |
|---|---|
Use Scenario: Real-time OFDM modulation/demodulation, MIMO precoding, and channel coding for 20-MHz LTE carriers with 4×4 antenna arrays. IC Role / Device Role / Timing Role: Primary baseband processor executing Layer 1 PHY stack; synchronizes AIF output to CPRI v2.0 2.4576-Gbps sample clock with <±2 ns jitter. Use Value: Integrates VCP2/TCP2 accelerators to meet 3GPP TS 36.213 latency requirements (<1 ms subframe processing) while sustaining 1.2-GHz sustained throughput. |
Use Scenario: Digitally compensated RF front-end control, IQ imbalance correction, and CPRI framer/de-framer in outdoor pico/femtocell RRH units. IC Role / Device Role / Timing Role: Central signal processor interfacing directly to ADC/DAC via McBSP and to optical transceiver via AIF; maintains OBSAI RP3 frame burst alignment. Use Value: Leverages 3072 KB L2 SRAM for real-time FIR filter coefficient storage and 64-bit timers for precise TDD guard period timing - eliminating external memory and timing ICs. |
| Multi-Standard Wireless Infrastructure | Defense Radar Signal Processing |
Use Scenario: Software-defined radio platform supporting concurrent WCDMA, TD-SCDMA, and LTE protocols via dynamic core partitioning. IC Role / Device Role / Timing Role: Multi-core scheduler distributes protocol stacks across three C64x+ cores; uses internal semaphore module for lock-free inter-core messaging. Use Value: Achieves code compatibility with legacy C64x platforms while delivering 2× higher MAC throughput per MHz - reducing SW porting effort and certification cost. |
Use Scenario: Pulse-Doppler radar beamforming, STAP, and CFAR detection in airborne AESA radar systems with strict SWaP-C constraints. IC Role / Device Role / Timing Role: High-reliability DSP executing deterministic real-time algorithms; operates in extended temperature range (-40°C to 95°C) with SmartReflex thermal throttling. Use Value: Uses EDMA3 and L2 SRAM to sustain 12 GB/s memory bandwidth for streaming radar video data - meeting MIL-STD-810G shock/vibe requirements without external buffers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multicore DSP applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMS320C6472FGUNA | Dual-core variant; identical 1.2-GHz speed, same GUN package, but only two C64x+ cores and 2048 KB L2 SRAM. | Lower PHY-layer channel capacity; suitable for microcell or single-carrier LTE deployments. | Select when total processing load fits within two cores and L2 memory footprint is ≤2 MB. |
| TMS320C6678ACYPA | Eight-core C66x DSP; 1.25 GHz/core, KeyStone architecture, 4 MB L2, integrated packet accelerator, and PCIe Gen2 - no AIF or VCP2/TCP2. | Targeted at packet-forwarding, software-defined networking, and radar imaging - not baseband PHY acceleration. | Choose for non-telecom applications requiring high-throughput packet processing or floating-point compute; not a drop-in replacement. |
Compared with TMS320C6474FGUNA, the TMS320C6472FGUNA offers reduced core count and memory for cost-sensitive small cells, while the TMS320C6678ACYPA shifts architecture toward general-purpose packet and floating-point workloads - neither replicates the integrated AIF/VCP2/TCP2 subsystem required for wireless baseband.
Availability
TMS320C6474FGUNA is available at Aetrix Electronics and suitable for macrocell base stations, remote radio heads, multi-standard wireless infrastructure, defense radar systems, and telecom test equipment requiring stable component supply over extended product lifecycles.
Supply support for TMS320C6474FGUNA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies - with over 50 years of DSP innovation and leadership in wireless infrastructure silicon.
The TMS320C6474FGUNA belongs to TI's C6000™ DSP platform, designed specifically for high-throughput, deterministic signal processing in 3G/4G/LTE baseband, radar, and medical imaging - emphasizing multicore scalability, hardware accelerators, and telecom-grade I/O.
FAQ
What is the maximum operating temperature range for the TMS320C6474FGUNA?
The TMS320C6474FGUNA is rated for extended temperature operation from –40°C to +95°C at the package case. This rating applies specifically to the 1.2-GHz device with GUN package and requires mandatory use of a heatsink and SmartReflex Class 0 adaptive voltage scaling to maintain thermal compliance under full load. Operation beyond 95°C risks permanent damage and violates TI's SPRS552H specification.
Does the TMS320C6474FGUNA support pin-compatible migration from earlier C64x+ devices?
Yes, the TMS320C6474FGUNA is upward code-compatible with prior C6000™ DSPs and shares the same 561-pin GUN BGA footprint as the TMS320C6472FGUNA and TMS320C6478FGUNA. However, pin functions differ significantly - especially for AIF, SRIO, and DDR2 interfaces - so PCB layout reuse requires full signal integrity validation and register-level firmware adaptation.
What memory configuration options does the TMS320C6474FGUNA support for L1 and L2 memory?
The TMS320C6474FGUNA supports configurable L1 memory: L1P as direct-mapped cache or SRAM, L1D as 2-way set-associative cache or SRAM. The 3072 KB L2 is unified SRAM/cache with hardware memory protection and bandwidth management - enabling deterministic allocation for real-time FFT buffers, turbo decoder tables, and control-plane data structures without external DRAM.
Can the TMS320C6474FGUNA's Serial RapidIO interface operate at 3.125 Gbps with forward error correction enabled?
Yes, the TMS320C6474FGUNA's two 1× Serial RapidIO v1.2 links support 3.125 Gbps line rate with full error management extensions, including CRC-32, retry mechanisms, and congestion control - as specified in TI's SPRS552H documentation. Link training and initialization must comply with SRIO v1.2 physical layer requirements, including AC coupling and 100-Ω differential impedance.
How does the SmartReflex Class 0 implementation affect power delivery design for the TMS320C6474FGUNA?
The TMS320C6474FGUNA's SmartReflex Class 0 requires a dynamically adjustable 0.9–1.2 V core supply with ≤10 mV ripple and fast transient response (<10 μs settling). TI mandates use of TI's TPS659123 or compatible PMIC with AVS interface; improper voltage ramp rates or insufficient current slew capability will trigger brownout resets during 1.2-GHz burst-mode operation.
TMS320C6474FGUNA Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- TMS320C647x
- Package/Case:
- 561-BFBGA
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Type:
- Fixed Point
- Interface:
- Ethernet MAC, I2C, McBSP
- Clock Rate:
- 1GHz
- Non-Volatile Memory:
- ROM (64kB)
- On-Chip RAM:
- 3.168MB
- Voltage - I/O:
- 1.1V, 1.8V
- Voltage - Core:
- 1.10V
- Operating Temperature:
- -40°C ~ 100°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 561-FCBGA (23x23)
TMS320C6474FGUNA FAQ
1.How can I place an order for TMS320C6474FGUNA through Aetrix?
Please submit a Request for Quotation (RFQ) for TMS320C6474FGUNA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TMS320C6474FGUNA reliable?
The price and inventory of TMS320C6474FGUNA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMS320C6474FGUNA is usually 5 days.
3.What payment methods are accepted for TMS320C6474FGUNA?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMS320C6474FGUNA transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TMS320C6474FGUNA?
TMS320C6474FGUNA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TMS320C6474FGUNA order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TMS320C6474FGUNA?
For technical support, including TMS320C6474FGUNA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMS320C6474FGUNA requirements.
6.How does Aetrix verify that TMS320C6474FGUNA is sourced from the original manufacturer or authorized distributors?
All TMS320C6474FGUNA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMS320C6474FGUNA meets industry standards.
7.What is the process for return or replacement of TMS320C6474FGUNA?
All TMS320C6474FGUNA units undergo pre-shipment inspection (PSI). If there is an issue with TMS320C6474FGUNA, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TMS320C6474FGUNA part is unused and in its original packaging.
Return procedure for TMS320C6474FGUNA:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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