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Texas Instruments TMS320C6474FZUNA
- Part No.:
- TMS320C6474FZUNA
- Manufacturer:
- Texas Instruments
- Category:
- DSP (Digital Signal Processors)
- Package:
- 561-BFBGA, FCBGA Exposed Pad
- Datasheet:
-
TMS320C6474FZUNA.pdf
- Description:
- IC DSP FIXED POINT 561FCBGA
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
TMS320C6474FZUNA from Texas Instruments is a 1.2-GHz triple-core C64x+ DSP optimized for baseband processing in wireless infrastructure, delivering 28,800 MIPS aggregate performance, 32 KB L1P direct-mapped cache and 32 KB L1D two-way set-associative cache per core, and integrated VCP2/TCP2 coprocessors for real-time AMR and turbo decoding in 3GPP-compliant systems.
For engineers reviewing the TMS320C6474FZUNA datasheet, TMS320C6474FZUNA pinout, TMS320C6474FZUNA application, or TMS320C6474FZUNA equivalent, key selection criteria include its 561-pin ZUN BGA package, DDR2-667 memory controller, dual Serial RapidIO v1.2 links, antenna interface supporting OBSAI RP3/CPRI, and SmartReflex Class 0 adaptive voltage scaling (0.9–1.2 V core).
Technical Context
The TMS320C6474FZUNA implements three independent C64x+ megamodules, each with eight functional units (.M/.L/.D/.S), dual 32-bit register files, and SPLOOP instruction buffering for software-pipelined loops. Its memory hierarchy includes 32 KB L1P (direct-mapped), 32 KB L1D (2-way set-associative), and 64 KB L3 ROM per subsystem.
Peripherals are interconnected via a DMA switch fabric and include a 1000-Mbps SGMII-compliant EMAC, six 64-bit timers (configurable as twelve 32-bit), 16 GPIOs with interrupt generation, I2C, two McBSPs, frame sync (FSYNC), and an antenna interface with six full-duplex SerDes lanes operating up to 3.072 Gbps per link under OBSAI RP3 or CPRI v2.0.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core Count | Three independent TMS320C64x+ DSP cores, enabling parallel execution of baseband, control, and signal processing tasks. |
| Max Clock Rate | 1.2 GHz (0.83 ns cycle time), supporting 9600 16-bit MMACs per microsecond per core. |
| L1 Memory | 32 KB L1P program cache (direct-mapped) + 32 KB L1D data cache (2-way set-associative) per core. |
| Memory Controller | 16-/32-bit DDR2-667 interface with dedicated DDR PLL, enabling 1.06 GB/s peak bandwidth to external SDRAM. |
| Serial Interfaces | Two 1× Serial RapidIO v1.2 links (1.25/2.5/3.125 Gbps) + six-lane antenna interface compliant with OBSAI RP3 and CPRI v2.0. |
| Accelerators | Dedicated VCP2 (694× 7.95-Kbps AMR channels) and TCP2 (eight 2-Mbps 3GPP turbo channels, 6 iterations) operating at CPU/3 clock rate. |
| Package & Thermal | 561-pin ZUN BGA (23 mm × 23 mm, 0.8-mm pitch), rated for extended temperature range –40°C to 95°C. |
Pinout & Package
561-pin ZUN BGA package (23 mm × 23 mm, 0.8-mm ball pitch), flip-chip construction with thermal pad; requires heatsink for operation within –40°C to 95°C extended temperature range.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DDR2_CLK/N | DDR2 memory clock differential pair | Drives DDR2 SDRAM timing; supports 333 MHz (667 Mbps) operation with dedicated DDR PLL. |
| SRIO_TX[0:1]/RX[0:1] | Serial RapidIO differential transmit/receive lanes | Enables chip-to-chip interconnect at 1.25/2.5/3.125 Gbps; supports Message Passing and DirectIO protocols. |
| AIF_TX[0:5]/RX[0:5] | Antenna interface SerDes differential pairs | Six full-duplex links for OBSAI RP3/CPRI baseband transport; configurable link rates up to 3.072 Gbps. |
| EMAC_MDIO/MDC | Management Data I/O interface | Configures and monitors Ethernet PHY status via IEEE 802.3-compliant MDIO bus. |
| GPIO[0:15] | General-purpose input/output | 16 pins with programmable interrupt/event generation; used for board-level control, status signaling, and boot configuration. |
Key Features
| Feature | Design Value |
|---|---|
| Triple C64x+ DSP cores | 28,800 MIPS total throughput enables concurrent execution of Layer 1, Layer 2, and system management tasks in macrocell BTS. |
| VCP2/TCP2 coprocessors | Offloads >690 AMR voice channels or eight 2-Mbps 3GPP turbo streams, reducing CPU load and latency in real-time decoding. |
| SmartReflex Class 0 | Dynamic core voltage scaling (0.9–1.2 V) synchronized with workload, lowering active power without sacrificing 1.2-GHz performance. |
| EDMA3 controller | 64 independent channels with QDMA support enable zero-CPU-overhead data movement between L2 SRAM, peripherals, and DDR2 memory. |
| Frame synchronization (FSYNC) | Hardware-aligned DMA triggering across all three cores ensures deterministic timing for multi-core TDMA/FDD frame processing. |
Applications
| Wireless Base Station Transceiver | Multi-Standard Radio Unit |
|---|---|
Use Scenario: Processing uplink/downlink signals in LTE-FDD and HSPA+ macrocell base stations with MIMO support. IC Role / Device Role / Timing Role: Primary baseband processor executing channel coding, modulation, FFT/IFFT, and RACH detection across three synchronized cores. Use Value: Integrated VCP2/TCP2 and FSYNC eliminate inter-core handshaking delays, enabling sub-100-μs frame alignment for strict 3GPP timing compliance. |
Use Scenario: Serving as the unified digital front-end in O-RAN compliant radios supporting NR, LTE, and TDD-LTE on shared hardware. IC Role / Device Role / Timing Role: Real-time waveform generation and demodulation engine with AIF interfacing to RFICs via CPRI v2.0 at 2.4576 Gbps. Use Value: Six-lane AIF and dual SRIO links allow simultaneous fronthaul (CPRI) and midhaul (SRIO) connectivity without external switches or bridges. |
| CDMA2000 Baseband Platform | Medical Ultrasound Beamformer |
Use Scenario: Implementing EV-DO Rev. A physical layer in carrier-grade picocell and femtocell infrastructure. IC Role / Device Role / Timing Role: Dedicated TCP2 accelerator handles turbo decoding while C64x+ cores manage RLP, MAC, and QoS scheduling. Use Value: TCP2's programmable interleaver and max-log-map algorithm support variable frame lengths and stopping criteria required by CDMA2000 standards. |
Use Scenario: Performing real-time dynamic receive beamforming and harmonic imaging in portable ultrasound systems. IC Role / Device Role / Timing Role: High-throughput DSP engine executing FIR filtering, phase rotation, and envelope detection on 128-channel echo data streams. Use Value: 1.2-GHz clock rate and eight functional units per core deliver >20 GFLOPS sustained compute for 100-MHz sampling-rate beam synthesis. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multicore DSP applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMS320C6472FZUNA | Single-core variant; identical ZUN package, 1.2-GHz rating, and peripheral set but no VCP2/TCP2 accelerators. | Suitable for control-plane or non-baseband signal processing where coprocessor offload is unnecessary. | Select when cost-sensitive designs require full pin compatibility but do not need hardware-accelerated channel decoding. |
| TMS320C6678ACYPA | Eight-core C66x architecture; 1.25-GHz per core, KeyStone I interconnect, no AIF or VCP2/TCP2, but adds C66-specific floating-point and FFT accelerators. | Targeted at radar, imaging, and high-throughput packet processing rather than cellular baseband. | Choose for floating-point-intensive workloads or when migrating to KeyStone architecture with scalable inter-core communication. |
Compared with TMS320C6474FZUNA, the TMS320C6472FZUNA reduces silicon area and power by removing redundant cores and accelerators while retaining identical packaging and DDR2/SRIO interfaces; the TMS320C6678ACYPA shifts focus to general-purpose floating-point compute and packet acceleration, sacrificing cellular-specific hardware for broader algorithmic flexibility.
Availability
TMS320C6474FZUNA is available at Aetrix Electronics and suitable for wireless infrastructure, telecom equipment manufacturing, and medical imaging systems requiring stable component supply over extended product lifecycles.
Supply support for TMS320C6474FZUNA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, specializing in analog, embedded processing, and digital signal processing technologies for industrial, automotive, and communications markets.
The TMS320C6474FZUNA belongs to TI's C6000™ DSP platform and was designed specifically for high-density, low-latency baseband processing in 3G/4G wireless infrastructure, emphasizing multicore determinism, hardware-accelerated channel coding, and fronthaul-ready serial interfaces.
FAQ
What is the operating temperature range for the TMS320C6474FZUNA?
The TMS320C6474FZUNA is rated for extended temperature operation from –40°C to 95°C. This specification applies to the 1.2-GHz device variant with ZUN package, and requires implementation of a heatsink and SmartReflex Class 0 adaptive voltage scaling to maintain thermal integrity under full-load conditions. The TMS320C6474FZUNA datasheet confirms this range in Section 6.2, Recommended Operating Conditions.
Does the TMS320C6474FZUNA support DDR2 memory, and what speeds are achievable?
Yes, the TMS320C6474FZUNA integrates a 16-/32-bit DDR2-667 memory controller with dedicated DDR PLL, supporting data rates up to 667 Mbps (333 MHz clock). It achieves a peak theoretical bandwidth of 1.06 GB/s in 32-bit mode and is compatible with standard JEDEC DDR2-667 SDRAM components. This capability is documented in Section 7.10 of the TMS320C6474FZUNA datasheet.
How many Serial RapidIO lanes does the TMS320C6474FZUNA provide, and what protocols are supported?
The TMS320C6474FZUNA provides two independent 1× Serial RapidIO v1.2-compliant links, each supporting 1.25 Gbps, 2.5 Gbps, or 3.125 Gbps line rates. These links implement Message Passing, DirectIO, error management extensions, and congestion control - enabling deterministic chip-to-chip communication in multi-DSP wireless baseband systems. This is specified in Section 7.18 of the TMS320C6474FZUNA technical reference.
What is the role of the antenna interface (AIF) in the TMS320C6474FZUNA, and which standards does it support?
The antenna interface (AIF) in the TMS320C6474FZUNA comprises six configurable full-duplex SerDes lanes for high-speed baseband data transport between the DSP and remote radio heads. It natively supports OBSAI RP3 v1.0 (768 Mbps to 3.072 Gbps) and CPRI v2.0 (614.4 Mbps to 2.4576 Gbps), enabling fronthaul connectivity in LTE and WCDMA systems. This functionality is detailed in Section 1.2.2 and Section 7.22 of the TMS320C6474FZUNA datasheet.
Can the TMS320C6474FZUNA execute code from internal memory only, or does it require external boot sources?
The TMS320C6474FZUNA supports multiple boot modes including EMIF (external memory interface), I2C, and SPI, and can execute code from internal L2 SRAM (3072 KB) or L3 ROM (64 KB) after initial loading. Its boot sequence is configurable via GPIO pins and supports secure boot options. Full boot architecture details, including memory mapping and initialization flow, are provided in Section 2.4 of the TMS320C6474FZUNA device overview document.
TMS320C6474FZUNA Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- TMS320C647x
- Package/Case:
- 561-BFBGA, FCBGA Exposed Pad
- Packaging:
- Tube
- Product Status:
- Obsolete
- Type:
- Fixed Point
- Interface:
- Ethernet MAC, I2C, McBSP
- Clock Rate:
- 1GHz
- Non-Volatile Memory:
- ROM (64kB)
- On-Chip RAM:
- 3.168MB
- Voltage - I/O:
- 1.1V, 1.8V
- Voltage - Core:
- 1.10V
- Operating Temperature:
- -40°C ~ 100°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 561-FCBGA (23x23)
TMS320C6474FZUNA FAQ
1.How can I place an order for TMS320C6474FZUNA through Aetrix?
Please submit a Request for Quotation (RFQ) for TMS320C6474FZUNA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TMS320C6474FZUNA reliable?
The price and inventory of TMS320C6474FZUNA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMS320C6474FZUNA is usually 5 days.
3.What payment methods are accepted for TMS320C6474FZUNA?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMS320C6474FZUNA transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TMS320C6474FZUNA?
TMS320C6474FZUNA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TMS320C6474FZUNA order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TMS320C6474FZUNA?
For technical support, including TMS320C6474FZUNA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMS320C6474FZUNA requirements.
6.How does Aetrix verify that TMS320C6474FZUNA is sourced from the original manufacturer or authorized distributors?
All TMS320C6474FZUNA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMS320C6474FZUNA meets industry standards.
7.What is the process for return or replacement of TMS320C6474FZUNA?
All TMS320C6474FZUNA units undergo pre-shipment inspection (PSI). If there is an issue with TMS320C6474FZUNA, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TMS320C6474FZUNA part is unused and in its original packaging.
Return procedure for TMS320C6474FZUNA:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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