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Texas Instruments TMS320C6474FZUNA2
- Part No.:
- TMS320C6474FZUNA2
- Manufacturer:
- Texas Instruments
- Category:
- DSP (Digital Signal Processors)
- Package:
- 561-BFBGA, FCBGA Exposed Pad
- Datasheet:
-
TMS320C6474FZUNA2.pdf
- Description:
- IC DSP MILTICORE 561FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,800
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Product details
Overview
TMS320C6474FZUNA2 from Texas Instruments is a 1.2-GHz triple-core C64x+ DSP optimized for baseband processing in wireless infrastructure, featuring three independent 32-bit DSP cores, 256-Kbit L1P/L1D caches per core, and integrated VCP2/TCP2 coprocessors for AMR and turbo decoding. It operates at -40°C to 95°C and targets multi-carrier cellular base stations requiring deterministic real-time signal processing.
For engineers reviewing the TMS320C6474FZUNA2 datasheet, TMS320C6474FZUNA2 pinout, TMS320C6474FZUNA2 application, or TMS320C6474FZUNA2 equivalent, key selection criteria include its 561-pin ZUN BGA package, DDR2-667 memory controller, dual Serial RapidIO v1.2 links, antenna interface compliant with OBSAI RP3/CPRI v2.0, and SmartReflex Class 0 adaptive voltage scaling.
Technical Context
The TMS320C6474FZUNA2 implements three identical C64x+ megamodules, each with eight functional units (two .M multipliers), 32×32-bit register files, and SPLOOP-accelerated software-pipelined loops. Its memory hierarchy includes 32 KB direct-mapped L1P cache, 32 KB two-way set-associative L1D cache, and 3072 KB unified L2 SRAM per subsystem.
Peripherals are interconnected via a DMA switch fabric and include a 1000-Mbps SGMII-compliant EMAC, six 64-bit timers (configurable as twelve 32-bit), 16 GPIOs with interrupt generation, and an antenna interface with six full-duplex SerDes links supporting 768 Mbps–3.072 Gbps per link under OBSAI RP3 and CPRI v2.0 protocols.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core Count | Three independent TMS320C64x+ DSP cores enabling parallel channel processing in multi-sector base stations. |
| Maximum Clock Rate | 1.2 GHz (0.83 ns cycle time), delivering up to 28,800 MIPS aggregate performance for real-time FFT, filtering, and modulation. |
| L1 Memory per Core | 256 K-bit (32 KB) L1P program cache [direct-mapped] + 256 K-bit (32 KB) L1D data cache [2-way set-associative] for low-latency instruction/data access. |
| DDR2 Interface | 16-/32-bit DDR2-667 controller with dedicated DDR PLL, supporting up to 1.06 GB/s bandwidth for external frame buffering. |
| Serial RapidIO | Two 1x links compliant with v1.2, operating at 1.25/2.5/3.125 Gbps with message passing, DirectIO, and congestion control for chip-to-chip interconnect. |
| Antenna Interface | Six configurable SerDes links supporting OBSAI RP3 (768 Mbps–3.072 Gbps) and CPRI v2.0 (614.4 Mbps–2.4576 Gbps) for fronthaul connectivity to remote radio units. |
| Operating Temperature | -40°C to 95°C extended range, validated for deployment in outdoor macro base station cabinets without active cooling beyond heatsink. |
Pinout & Package
Package: 561-pin ZUN flip-chip BGA, 23 mm × 23 mm, 0.8-mm ball pitch, designed for thermal dissipation in high-power wireless infrastructure applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKIN1 | Primary clock input | Accepts 25–100 MHz crystal or LVDS reference; feeds System PLL for CPU/DDR/peripheral clock derivation. |
| DDR2_DQ[31:0] | Data bus | 32-bit bidirectional DDR2 data interface supporting 667 MT/s transfers; requires matched trace length and on-die termination calibration. |
| SRIO_TXP/N[1:0] | Serial RapidIO differential output | Two pairs of AC-coupled LVDS outputs for 1.25/2.5/3.125 Gbps link rates; supports lane reversal and spread-spectrum clocking. |
| AIF_RXP/N[5:0] | Antenna interface receive input | Six differential SerDes inputs compliant with OBSAI RP3/CPRI v2.0; each pair handles up to 3.072 Gbps baseband IQ data. |
| EMAC_MDIO | Management Data I/O | Open-drain 1.8-V bidirectional interface for PHY configuration and status polling via IEEE 802.3 clause 22/45 registers. |
| VDD_CORE | Core power supply | 0.9–1.2 V SmartReflex Class 0 adaptive supply; voltage dynamically scaled based on real-time workload and temperature. |
Key Features
| Feature | Design Value |
|---|---|
| Triple C64x+ DSP cores | Enables concurrent execution of RF, baseband, and control plane tasks across three isolated subsystems with independent L1 caches. |
| VCP2/TCP2 coprocessors | VCP2 decodes >694 AMR voice channels at 7.95 Kbps; TCP2 decodes eight 2-Mbps 3GPP turbo-encoded channels (6 iterations), offloading CPU-intensive channel coding. |
| EDMA3 controller | 64 independent channels with scatter-gather support, enabling zero-CPU-overhead data movement between L2 SRAM, DDR2, peripherals, and coprocessors. |
| Frame Synchronization (FSYNC) | Hardware module aligning DMA transfers across all three DSP cores and peripherals to a common timing reference for deterministic multi-channel processing. |
| Internal semaphore module | 32 general-purpose semaphores with core-specific interrupt signaling, ensuring safe resource sharing (e.g., shared L2 memory or EMAC descriptors) in RTOS environments. |
Applications
| Multi-Carrier Base Station | Remote Radio Unit (RRU) Fronthaul |
|---|---|
Use Scenario: Processing up to 12 carriers across LTE/FDD and TD-SCDMA standards in a single macro cell site with MIMO-4x4 support. IC Role / Device Role / Timing Role: Primary baseband processor executing layer-1 physical layer algorithms including OFDM modulation/demodulation, channel estimation, and HARQ feedback. Use Value: Triple-core architecture and VCP2/TCP2 accelerators enable simultaneous handling of multiple air interfaces and carrier aggregation without external ASICs. |
Use Scenario: Aggregating and transporting digitized IQ samples between centralized baseband unit (CU) and distributed remote radio heads over fiber. IC Role / Device Role / Timing Role: Fronthaul gateway implementing OBSAI RP3 or CPRI v2.0 protocol stacks with precise sample timing alignment and jitter compensation. Use Value: Six AIF SerDes links provide scalable bandwidth (up to 3.072 Gbps/link) for 4G/5G massive MIMO RU configurations with sub-100 ns synchronization accuracy. |
| Wireless Backhaul Bridge | Multi-Standard Modem Platform |
Use Scenario: High-capacity point-to-point microwave backhaul supporting 100+ concurrent VoIP sessions and enterprise data traffic. IC Role / Device Role / Timing Role: Real-time packet processing engine performing QoS scheduling, FEC encoding/decoding, and adaptive modulation selection. Use Value: Dual Serial RapidIO links enable redundant 3.125-Gbps interconnect to adjacent DSPs or packet processors, eliminating single-point failure in mission-critical links. |
Use Scenario: Software-defined radio platform supporting GSM, WCDMA, LTE, and WiMAX waveforms via reconfigurable firmware. IC Role / Device Role / Timing Role: Programmable signal processor executing waveform-specific kernels with deterministic latency guaranteed by L1 cache locking and EDMA3 priority arbitration. Use Value: C64x+ instruction set compatibility and SPLOOP optimization allow reuse of legacy C64x code while achieving 2× throughput gain on 1.2-GHz core frequency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multicore DSP applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMS320C6472FZUNA2 | Dual-core variant with identical architecture, 1.2-GHz speed grade, same ZUN package, but lacks third DSP core and one SRIO link. | Suitable for lower-density base stations or cost-sensitive RRU designs where dual-core throughput suffices. | Select when system-level channel count and fronthaul bandwidth requirements are ≤50% of TMS320C6474FZUNA2 capability. |
| TMS320C6678ACYPA | Octo-core C66x DSP with 1.25-GHz cores, KeyStone architecture, integrated network coprocessor, and 16-Gbps HyperLink interconnect instead of SRIO/AIF. | Targets next-generation 4G/5G systems requiring higher throughput, packet acceleration, and coherent multi-chip scaling. | Choose for new designs needing >2× raw MAC throughput, hardware packet parsing, or migration path to TI's C66x roadmap. |
Compared with TMS320C6472FZUNA2, the TMS320C6474FZUNA2 adds a third DSP core and full AIF/SRIO complement for higher channel density; versus TMS320C6678ACYPA, it retains legacy C64x+ software compatibility and optimized OBSAI/CPRI fronthaul support but lacks packet acceleration and HyperLink scalability.
Availability
TMS320C6474FZUNA2 is available at Aetrix Electronics and suitable for wireless infrastructure, telecom base station development, and defense radar signal processing requiring stable component supply across long production lifecycles.
Supply support for TMS320C6474FZUNA2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and digital signal processing technologies, with decades of heritage in high-performance DSP design.
The TMS320C6474FZUNA2 belongs to TI's C6000™ DSP platform, engineered specifically for wireless infrastructure baseband processing where deterministic real-time performance, multi-standard flexibility, and fronthaul protocol acceleration are critical.
FAQ
What is the maximum operating temperature range for the TMS320C6474FZUNA2?
The TMS320C6474FZUNA2 is rated for operation from -40°C to +95°C ambient temperature under extended temperature conditions. This specification is validated for use in outdoor macro base station enclosures where passive heatsinking is employed. The device requires implementation of TI's SmartReflex Class 0 adaptive voltage scaling to maintain stability across this range, and thermal derating must be applied above 85°C case temperature per the datasheet's thermal resistance curves.
Does the TMS320C6474FZUNA2 support pin-compatible migration from earlier C64x+ devices?
The TMS320C6474FZUNA2 uses a 561-pin ZUN BGA package with 0.8-mm pitch, which is not pin-compatible with prior C64x+ devices such as the C6416 or C6455 that use different ball counts and layouts. While the C6474FZUNA2 maintains upward code compatibility with earlier C64x+ instruction sets, hardware redesign-including PCB layout, power delivery, and thermal management-is required due to its triple-core architecture, enhanced peripheral set, and higher power density.
How does the antenna interface (AIF) of the TMS320C6474FZUNA2 handle OBSAI RP3 and CPRI v2.0 protocols?
The TMS320C6474FZUNA2's AIF comprises six independent SerDes links, each capable of 768 Mbps–3.072 Gbps operation, with built-in framing logic and elastic buffers to support both OBSAI RP3 and CPRI v2.0 physical layer requirements. It natively handles CPRI v2.0 data rates (614.4 Mbps, 1.2288 Gbps, 2.4576 Gbps) and OBSAI RP3 rates (768 Mbps, 1.536 Gbps, 3.072 Gbps), with programmable link configuration, clock recovery, and frame alignment-enabling direct connection to remote radio units without external protocol converters.
What memory resources are available on-chip for the TMS320C6474FZUNA2?
The TMS320C6474FZUNA2 provides 32 KB L1P program cache (direct-mapped), 32 KB L1D data cache (2-way set-associative), and 3072 KB unified L2 SRAM per DSP subsystem, plus a 64 KB L3 ROM containing boot code and fixed-function routines. Total on-chip memory exceeds 9 MB across all three cores. External memory expansion is supported via the 32-bit DDR2-667 controller, enabling up to 2 GB of low-latency system memory for frame buffering and coefficient storage.
Can the TMS320C6474FZUNA2 execute legacy C64x code without modification?
Yes, the TMS320C6474FZUNA2 is fully upward code-compatible with previous C6000™ DSP generations, including C64x and C64x+ devices. All existing assembly and C code targeting C64x cores will run unmodified on the TMS320C6474FZUNA2. Performance gains arise from architectural enhancements-such as doubled multiplier throughput, SPLOOP loop acceleration, and compact 16-bit instructions-without requiring source-level changes, though recompilation with TI's C6000 Code Generation Tools is recommended to exploit optimizations.
TMS320C6474FZUNA2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- TMS320C647x
- Package/Case:
- 561-BFBGA, FCBGA Exposed Pad
- Packaging:
- Tube
- Product Status:
- Discontinued at Digi-Key
- Type:
- Fixed Point
- Interface:
- Ethernet MAC, I2C, McBSP
- Clock Rate:
- 1.2GHz
- Non-Volatile Memory:
- ROM (64kB)
- On-Chip RAM:
- 3.168MB
- Voltage - I/O:
- 1.1V, 1.8V
- Voltage - Core:
- 1.10V
- Operating Temperature:
- 0°C ~ 95°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 561-FCBGA (23x23)
TMS320C6474FZUNA2 FAQ
1.How can I place an order for TMS320C6474FZUNA2 through Aetrix?
Please submit a Request for Quotation (RFQ) for TMS320C6474FZUNA2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TMS320C6474FZUNA2 reliable?
The price and inventory of TMS320C6474FZUNA2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMS320C6474FZUNA2 is usually 5 days.
3.What payment methods are accepted for TMS320C6474FZUNA2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMS320C6474FZUNA2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TMS320C6474FZUNA2?
TMS320C6474FZUNA2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TMS320C6474FZUNA2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TMS320C6474FZUNA2?
For technical support, including TMS320C6474FZUNA2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMS320C6474FZUNA2 requirements.
6.How does Aetrix verify that TMS320C6474FZUNA2 is sourced from the original manufacturer or authorized distributors?
All TMS320C6474FZUNA2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMS320C6474FZUNA2 meets industry standards.
7.What is the process for return or replacement of TMS320C6474FZUNA2?
All TMS320C6474FZUNA2 units undergo pre-shipment inspection (PSI). If there is an issue with TMS320C6474FZUNA2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TMS320C6474FZUNA2 part is unused and in its original packaging.
Return procedure for TMS320C6474FZUNA2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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