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Texas Instruments TMS320C6655GZHA

Part No.:
TMS320C6655GZHA
Manufacturer:
Texas Instruments
Category:
DSP (Digital Signal Processors)
Package:
625-BFBGA, FCBGA
Datasheet:
AetrixTMS320C6655GZHA.pdf
Description:
IC DSP FIX/FLOAT POINT 625FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,590

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Product details

Overview

TMS320C6655GZHA from Texas Instruments is a single-core, 1.25 GHz fixed- and floating-point digital signal processor (DSP) based on the KeyStone multicore architecture. It integrates one C66x DSP CorePac, 1024KB MSM SRAM, 32-bit DDR3-1333 EMIF, dual Viterbi coprocessors, and Turbo decoder coprocessor - enabling real-time baseband processing in wireless infrastructure and medical imaging systems.

For engineers reviewing the TMS320C6655GZHA datasheet, TMS320C6655GZHA pinout, TMS320C6655GZHA application, or TMS320C6655GZHA equivalent, key selection criteria include its 40 GMAC/20 GFLOP per core performance at 1.25 GHz, 625-pin GZH BGA package with 21 mm × 21 mm footprint, HyperLink interconnect for chip-to-chip scalability, and support for RapidIO 2.1, PCIe Gen2, and Gigabit Ethernet SGMII interfaces.

Technical Context

The TMS320C6655GZHA implements TI's KeyStone architecture with a nonblocking TeraNet switch fabric, Multicore Navigator for hardware-accelerated packet-based DMA across 8192 queues, and a Multicore Shared Memory Controller managing 1MB shared SRAM with memory protection. Its C66x core delivers IEEE 754-compliant single/double-precision floating-point operations and 90 new instructions optimized for vector math and signal kernels.

Peripherals include four-lane Serial RapidIO 2.1 (up to 5 GBaud/lane), PCIe Gen2 (1–2 lanes), HyperLink (40 Gbaud full-duplex), SGMII Gigabit Ethernet, 32-bit DDR3-1333 interface with ECC support, and dual McBSPs - all coordinated via centralized power management, boot ROM, and dual PLLs (main + DDR3).

Key Specifications

Parameter Value and Actual Design Meaning
Core Architecture Single C66x DSP CorePac, backward-compatible with C6000 family, 1.25 GHz max frequency (0.8 ns cycle time)
DSP Performance 40 GMAC (fixed-point) and 20 GFLOP (floating-point) @ 1.25 GHz - enables real-time FFT, filtering, and beamforming in radar and comms
On-Chip Memory 32KB L1P + 32KB L1D cache, 1024KB L2 unified memory/cache, 1024KB MSM SRAM with ECC and memory protection unit
External Memory Interface 32-bit DDR3-1333 EMIF supporting up to 4GB addressable space with DRAM ECC - suitable for high-bandwidth data buffering
High-Speed I/O RapidIO 2.1 (4 lanes, 5 GBaud/lane), PCIe Gen2 (1–2 lanes), HyperLink (40 Gbaud), SGMII Ethernet - enables multi-chip system integration
Coprocessors Two VCP2 Viterbi decoders and one TCP3d Turbo decoder - offloads channel decoding in LTE/5G baseband stacks
Package & Temp Range 625-pin GZH flip-chip BGA, 21 mm × 21 mm, 0.8 mm pitch; extended temperature range –40°C to 100°C

Pinout & Package

Package: 625-pin Flip-Chip Plastic BGA (GZH), 21 mm × 21 mm, 0.8 mm pitch, RoHS-compliant.

Pin/Terminal Circuit Role Design Meaning
A22 / B22 DDRCLKP / DDRCLKN Differential DDR reference clock input to DDR3 PLL - critical for timing closure of 1333 MHz DDR interface
AD14 / AE15 PCIECLKP / PCIECLKN Differential PCIe reference clock input - enables Gen2 link training and stable 5 GBaud operation
AD13 / AE14 SRIOSGMIICLKP / SRIOSGMIICLKN Shared differential reference clock for RapidIO and SGMII SerDes - reduces board-level clock sources
C25 / B25 MCMCLKP / MCMCLKN Differential HyperLink reference clock input - required for 40 Gbaud chip-to-chip interconnect synchronization
H1 NMI Nonmaskable interrupt input - used for critical fault signaling (e.g., watchdog timeout, thermal shutdown)
H3 BOOTCOMPLETE Open-drain status output indicating successful execution of second-level bootloader - enables system-level boot sequencing

Key Features

Feature Design Value
Hardware Accelerators Integrated VCP2 (dual) and TCP3d coprocessors - reduce CPU load by >70% in LTE turbo/Viterbi decoding tasks
Packet-Based DMA Engine Multicore Navigator with 8192 hardware queues - enables zero-overhead data movement between peripherals and memory without CPU intervention
Memory Protection Unit MPU covering both MSM SRAM and DDR3_EMIF - enforces secure partitioning for safety-critical applications like avionics
Scalable Interconnect HyperLink (40 Gbaud) + RapidIO 2.1 + PCIe Gen2 - supports modular system expansion across multiple C665x devices or FPGAs
Power Management SmartReflex™ dynamic voltage scaling and Power Sleep Controller (PSC) - lowers active power by up to 35% during low-load intervals

Applications

Power Protection Systems Avionics and Defense

Use Scenario: Real-time fault detection and adaptive relay coordination in smart grid substations.

IC Role / Device Role / Timing Role: Primary DSP executing protection algorithms (e.g., Fourier analysis, impedance calculation) with deterministic sub-10 µs latency.

Use Value: Enables compliance with IEC 61850-10 conformance testing via precise timestamping and synchronized sampling across multiple analog inputs.

Use Scenario: Radar signal processing in airborne electronic warfare suites requiring low-SWaP-C deployment.

IC Role / Device Role / Timing Role: Baseband processor handling pulse-Doppler FFT, CFAR detection, and synthetic aperture beamforming.

Use Value: Delivers 20 GFLOP sustained compute for real-time SAR image reconstruction while meeting DO-254 Level A design assurance requirements.

Currency Inspection Medical Imaging

Use Scenario: High-speed banknote authentication using multispectral imaging and pattern recognition at 1000+ notes/minute.

IC Role / Device Role / Timing Role: Vision co-processor performing real-time convolution, histogram equalization, and neural network inference on FPGA-fed pixel streams.

Use Value: Achieves >99.99% counterfeit detection accuracy with <2 ms end-to-end latency due to dedicated VCP2/TCP3d acceleration.

Use Scenario: Ultrasound beamforming and RF data processing in portable diagnostic systems.

IC Role / Device Role / Timing Role: Digital backend processor executing dynamic receive focusing, harmonic imaging, and Doppler spectral analysis.

Use Value: Supports 128-channel parallel beamforming with 16-bit precision and <50 µs frame latency - critical for real-time elastography.

Equivalent & Alternatives

The following parts are listed as comparable options for similar DSP processing applications.

Alternative Part Technical Difference Application Difference Selection Advice
TMS320C6657GZHA Dual-core C66x at 1.25 GHz; adds second CorePac, 1024KB additional MSM SRAM, and extra PCIe lane Required for asymmetric multiprocessing (AMP) or higher throughput in multi-sector wireless base stations Select when >40 GMAC/20 GFLOP total compute or dual-core software partitioning is needed - same pinout and PCB layout
ADSP-SC589KSWZ-4 Analog Devices SHARC+ dual-core (2× 500 MHz) + ARM Cortex-A5; lacks HyperLink, has lower peak GFLOP (12 GFLOP) Better suited for mixed-signal control + signal processing (e.g., motor drives) but not scalable chip-to-chip interconnect Choose for cost-sensitive industrial automation where ARM+SHARC heterogeneity outweighs raw DSP throughput needs

Compared with TMS320C6655GZHA, the TMS320C6657GZHA offers identical pinout and software compatibility with doubled compute resources, while the ADSP-SC589KSWZ-4 provides ARM/DSP heterogeneity at lower peak performance and no HyperLink scalability - making TMS320C6655GZHA optimal for single-core, high-throughput, chip-scalable DSP workloads.

Availability

TMS320C6655GZHA is available at Aetrix Electronics and suitable for power protection systems, avionics and defense platforms, currency inspection equipment, and medical imaging subsystems requiring stable component supply over extended product lifecycles.

Supply support for TMS320C6655GZHA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 50 years of innovation in DSP and real-time signal processing.

The TMS320C6655GZHA belongs to TI's KeyStone C665x DSP family, designed specifically for high-performance, low-latency signal processing in wireless infrastructure, defense radar, and industrial vision systems requiring deterministic compute and scalable interconnect.

FAQ

What is the maximum operating frequency of the TMS320C6655GZHA?

The TMS320C6655GZHA operates at a maximum core frequency of 1.25 GHz (800 ps cycle time), delivering 40 GMAC and 20 GFLOP performance. This frequency is achieved under recommended operating conditions including proper power supply sequencing, thermal management within –40°C to 100°C ambient, and validated DDR3-1333 interface timing margins. The TMS320C6655GZHA does not support 850 MHz or 1.0 GHz variants - only the 1.25 GHz speed grade is offered in the GZH package.

Does the TMS320C6655GZHA support PCIe Gen2?

Yes, the TMS320C6655GZHA integrates a PCIe Gen2 peripheral supporting 1 or 2 lanes at up to 5 GBaud per lane. It complies with PCI Express Base Specification Revision 2.0 and includes full PHY, data link, and transaction layers. The device requires external AC coupling capacitors and proper reference clock routing (PCIECLKP/PCIECLKN on AD14/AE15) to achieve reliable link training and stable Gen2 operation - no external PCIe switch or bridge IC is needed for endpoint use.

How much on-chip memory does the TMS320C6655GZHA include?

The TMS320C6655GZHA includes 32KB L1 program memory, 32KB L1 data memory, 1024KB L2 unified memory/cache, 1024KB Multicore Shared Memory (MSM SRAM), and 128KB on-chip ROM. All L2 and MSM memories incorporate error detection and correction (ECC), and the MSM SRAM is protected by a dedicated memory protection unit (MPU). No external SRAM is required for basic boot and real-time kernel execution.

What interfaces does the TMS320C6655GZHA provide for external memory expansion?

The TMS320C6655GZHA provides two external memory interfaces: a 32-bit DDR3-1333 EMIF supporting up to 4GB addressable space with ECC DRAM support, and a 16-bit asynchronous EMIF (EMIF16) for NOR/NAND flash, SRAM, or FPGA glue logic. The DDR3 interface uses differential clocks (DDRCLKP/DDRCLKN on A22/B22) and requires strict layout rules for signal integrity at 1333 MHz data rates.

Is the TMS320C6655GZHA pin-compatible with the TMS320C6657GZHA?

Yes, the TMS320C6655GZHA and TMS320C6657GZHA share identical 625-pin GZH BGA packaging, mechanical footprint (21 mm × 21 mm), and pinout - enabling drop-in replacement on the same PCB. Both devices use identical power, clock, reset, and interface signaling. The only functional difference is the presence of a second C66x CorePac and associated resources in the C6657; unused pins remain reserved or NC in the C6655 configuration.

TMS320C6655GZHA Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
TMS320C66x
Package/Case:
625-BFBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Type:
Fixed/Floating Point
Interface:
DDR3, EBI/EMI, Ethernet, McBSP, PCIe, I2C, SPI, UART, UPP
Clock Rate:
1GHz
Non-Volatile Memory:
ROM (128kB)
On-Chip RAM:
2.06MB
Voltage - I/O:
1.0V, 1.5V, 1.8V
Voltage - Core:
1.00V
Operating Temperature:
-40°C ~ 100°C (TC)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
625-FCBGA (21x21)

TMS320C6655GZHA FAQ

1.How can I place an order for TMS320C6655GZHA through Aetrix?

Please submit a Request for Quotation (RFQ) for TMS320C6655GZHA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TMS320C6655GZHA reliable?

The price and inventory of TMS320C6655GZHA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMS320C6655GZHA is usually 5 days.

3.What payment methods are accepted for TMS320C6655GZHA?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMS320C6655GZHA transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TMS320C6655GZHA?

TMS320C6655GZHA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TMS320C6655GZHA order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TMS320C6655GZHA?

For technical support, including TMS320C6655GZHA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMS320C6655GZHA requirements.

6.How does Aetrix verify that TMS320C6655GZHA is sourced from the original manufacturer or authorized distributors?

All TMS320C6655GZHA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMS320C6655GZHA meets industry standards.

7.What is the process for return or replacement of TMS320C6655GZHA?

All TMS320C6655GZHA units undergo pre-shipment inspection (PSI). If there is an issue with TMS320C6655GZHA, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TMS320C6655GZHA part is unused and in its original packaging.

Return procedure for TMS320C6655GZHA:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

TMS320C6655GZHA Tags

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