Texas Instruments TMS320C6655SCZH

Overview

TMS320C6655SCZH from Texas Instruments is a single-core, 1.25 GHz fixed- and floating-point digital signal processor (DSP) based on the KeyStone multicore architecture. It integrates one C66x DSP CorePac, 1024KB MSM SRAM, 32-bit DDR3-1333 EMIF, dual Viterbi coprocessors, and hardware-accelerated Multicore Navigator with 8192 queues - deployed in power protection systems and medical imaging equipment requiring deterministic real-time signal processing.

For engineers reviewing the TMS320C6655SCZH datasheet, TMS320C6655SCZH pinout, TMS320C6655SCZH application, or TMS320C6655SCZH equivalent, key selection criteria include its 40 GMAC/20 GFLOP per core performance at 1.25 GHz, 625-pin CZH BGA package with 21 mm × 21 mm footprint, DDR3-1333 interface with ECC support, HyperLink 40-Gbaud interconnect, and PCIe Gen2 x2 capability - all validated for extended temperature (–40°C to 100°C) industrial operation.

Technical Context

The TMS320C6655SCZH implements TI's KeyStone architecture with a nonblocking TeraNet switch fabric, enabling concurrent access to C66x core, MSMC, peripherals, and accelerators without resource contention. Its C66x core delivers IEEE 754-compliant single/double/mixed-precision floating-point operations and executes 8 single-precision MACs per cycle.

Memory subsystem includes 32KB L1P/L1D cache, 1024KB configurable L2 unified memory, and 1024KB MSM SRAM protected by error detection and correction (EDAC). The device supports boot from SPI, I2C, UART, or EMIF, with two on-chip PLLs (main PLL and DDR3 PLL) providing independent clock domains for CPU, DDR, PCIe, SRIO, and HyperLink subsystems.

Key Specifications

Pinout & Package

Package: 625-pin flip-chip plastic BGA (CZH), 21 mm × 21 mm body size, 0.80 mm pitch, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar DSP applications.

Compared with TMS320C6655SCZH, the C6657SCZH doubles raw compute and interconnect capacity but increases power by 38% and BOM cost by 22%; the ADSP-SC589 offers ARM/DSP heterogeneity but sacrifices 3.7× peak GMAC and lacks hardware-accelerated communications required for scalable radar or comms infrastructure.

Availability

TMS320C6655SCZH is available at Aetrix Electronics and suitable for power protection systems, medical imaging equipment, avionics and defense electronics, and industrial transportation systems requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for TMS320C6655SCZH includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies - serving industrial, automotive, and communications markets with high-reliability silicon and comprehensive design ecosystems.

The TMS320C6655SCZH belongs to TI's KeyStone DSP product line, engineered for high-throughput, low-latency signal processing in safety-critical infrastructure - emphasizing deterministic execution, hardware-accelerated interconnect, and robust thermal/power management for 24/7 operation.

FAQ

What is the maximum operating frequency of the TMS320C6655SCZH?

The TMS320C6655SCZH operates at a maximum core frequency of 1.25 GHz, delivering 40 GMAC (fixed-point) and 20 GFLOP (floating-point) peak performance. This frequency is achieved under recommended operating conditions with proper thermal management and voltage regulation - specifically SmartReflex-enabled 0.95 V core supply at 100°C case temperature. The TMS320C6655SCZH datasheet specifies 0.8 ns cycle time and validates timing margins across the full –40°C to 100°C extended temperature range.

Does the TMS320C6655SCZH support DDR3 memory with ECC?

Yes, the TMS320C6655SCZH supports DDR3 memory with ECC through its 32-bit DDR3-1333 EMIF. The interface includes dedicated check bit lines (DDRCB[3:0]) and hardware-based error detection and correction logic for both MSM SRAM and external DDR3 memory. ECC operation is configurable via the DDR3 controller registers and validated for single-bit error correction and double-bit error detection - critical for medical imaging and power protection firmware integrity.

How many hardware accelerators are integrated into the TMS320C6655SCZH?

The TMS320C6655SCZH integrates three hardware accelerators: two Viterbi Coprocessor 2 (VCP2) units and one Turbo Coprocessor Decoder 3d (TCP3d). Each VCP2 operates at CPU/3 clock frequency and handles convolutional decoding for wireless standards; the TCP3d runs at CPU/2 frequency and accelerates LDPC and turbo decoding. These accelerators are accessible via the Multicore Navigator queue system and reduce CPU load by offloading computationally intensive channel decoding tasks.

What is the package type and pin count of the TMS320C6655SCZH?

The TMS320C6655SCZH uses a 625-pin flip-chip plastic BGA package designated CZH, with 21 mm × 21 mm body size and 0.80 mm ball pitch. This package is RoHS-compliant and thermally optimized for extended temperature operation (–40°C to 100°C). Pin assignments are documented in TI's SPRS814C datasheet Figures 4-1 through 4-6, covering DDR3, SRIO, PCIe, HyperLink, and peripheral I/O signal groups across four quadrants.

Can the TMS320C6655SCZH boot from SPI flash memory?

Yes, the TMS320C6655SCZH supports boot from SPI flash memory using its integrated boot ROM and configurable boot mode pins (BOOTMODE[12:0]). SPI boot mode is selected by setting specific combinations on GPIO-mapped pins during power-up reset. The device loads the first-stage bootloader from SPI, then executes second-stage initialization including PLL configuration, memory initialization, and peripheral setup - fully documented in Section 6.27 "Boot Sequence" of the SPRS814C datasheet.