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Texas Instruments TMS320C6657CZH8
- Part No.:
- TMS320C6657CZH8
- Manufacturer:
- Texas Instruments
- Category:
- DSP (Digital Signal Processors)
- Package:
- 625-BFBGA, FCBGA
- Datasheet:
-
TMS320C6657CZH8.pdf
- Description:
- IC DSP FIX/FLOAT POINT 625FCBGA
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
TMS320C6657CZH8 from Texas Instruments is a dual-core fixed- and floating-point digital signal processor (DSP) based on the KeyStone multicore architecture, operating at up to 1.25 GHz per core with 40 GMAC and 20 GFLOPS computational performance. It integrates two C66x DSP CorePacs, 1 MB multicore shared memory (MSM SRAM), 32-bit DDR3-1333 interface, and hardware accelerators including two Viterbi coprocessors and one Turbo decoder. It targets high-throughput real-time signal processing in avionics, medical imaging, and power protection systems.
For engineers reviewing the TMS320C6657CZH8 datasheet, TMS320C6657CZH8 pinout, TMS320C6657CZH8 application, or TMS320C6657CZH8 equivalent, key selection considerations include dual-core deterministic latency, integrated MSMC with memory protection, HyperLink interconnect for chip-to-chip scalability, and support for RapidIO 2.1, PCIe Gen2, and Gigabit Ethernet SGMII interfaces.
Technical Context
The TMS320C6657CZH8 implements TI's KeyStone architecture centered on TeraNet nonblocking switch fabric, Multicore Navigator for 8192-hardware-queue packet-based DMA, and MSMC enabling direct core access to shared memory without consuming TeraNet bandwidth. Its dual C66x cores execute IEEE 754-compliant single/double/mixed-precision floating-point operations and deliver 8 single-precision MACs per cycle.
Peripherals are tightly coupled via dedicated interconnects: DDR3 EMIF supports ECC DRAM at 1333 MHz; HyperLink provides 40-Gbaud full-duplex chip-level interconnect; SRIO 2.1 supports 5 GBaud/lane across configurable 1×/2×/4× links; and PCIe Gen2 operates at up to 5 GBaud per lane in 1- or 2-lane configurations.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Count | Dual C66x DSP CorePacs - enables parallel real-time signal processing tasks with independent cache and execution units. |
| Max Core Frequency | 1.25 GHz - delivers 40 GMAC (fixed-point) and 20 GFLOPS (floating-point) per core for computationally intensive kernels. |
| Shared Memory | 1024 KB MSM SRAM - accessible by both cores with memory protection unit (MPU) enforcement for secure inter-core data exchange. |
| DDR Interface | 32-bit DDR3-1333 with ECC - supports up to 4 GB addressable external memory space with error correction for mission-critical reliability. |
| High-Speed I/O | SRIO 2.1 (4 lanes), PCIe Gen2 (2 lanes), HyperLink (40 Gbaud), SGMII - enables low-latency, high-bandwidth connectivity to FPGAs, ASICs, or other KeyStone devices. |
| Hardware Accelerators | Two VCP2 Viterbi coprocessors and one TCP3d Turbo decoder - offload baseband processing in wireless infrastructure and communications systems. |
| Temperature Range | –40°C to 100°C (extended) - qualified for deployment in harsh industrial, avionics, and defense environments. |
Pinout & Package
Package: 625-pin flip-chip plastic BGA (CZH), 21 mm × 21 mm, 0.80 mm pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CORECLKP / CORECLKN | Main PLL reference clock input pair | Differential 1.25 GHz clock source for synchronizing both C66x cores and internal timing domains. |
| DDRCLKP / DDRCLKN | DDR3 PLL reference clock input pair | Differential reference for DDR3 interface timing; enables stable 1333 MHz operation with phase alignment control. |
| PCIECLKP / PCIECLKN | PCIe SerDes reference clock input pair | Provides precise 100 MHz or 125 MHz differential clock for PCIe Gen2 link training and data recovery. |
| SRIOSGMIICLKP / SRIOSGMIICLKN | RapidIO/SGMII SerDes reference clock input pair | Shared reference for multi-protocol SerDes supporting 1.24–5 GBaud operation across SRIO and Ethernet PHY layers. |
| MCMCLKP / MCMCLKN | HyperLink SerDes reference clock input pair | Drives 40-Gbaud full-duplex chip-to-chip interconnect; critical for scalable multicore system-on-module designs. |
| EMIFA[0:23] / EMIFD[0:31] | DDR3 address/data bus signals | 32-bit bidirectional data bus and 24-bit address bus with dedicated DQS/DQSN strobes and ODT control for impedance-matched signaling. |
| RESET / LRESET / RESETFULL | Asynchronous reset inputs | Supports warm reset (LRESET), full device reset (RESETFULL), and isolated subsystem reset for fault containment and safe reinitialization. |
Key Features
| Feature | Design Value |
|---|---|
| Dual C66x CorePac Architecture | Independent L1 program/data caches (32 KB each), unified 1024 KB L2 cache, and backward binary compatibility with C6000 family software. |
| Multicore Shared Memory Controller (MSMC) | Direct core access to 1 MB MSM SRAM with MPU-enforced memory protection-eliminates TeraNet contention for shared data structures. |
| Multicore Navigator | Hardware-accelerated dispatch across 8192 queues with zero-overhead packet-based DMA-enables deterministic data movement between peripherals and cores. |
| HyperLink Interconnect | 40-Gbaud full-duplex chip-level interface with low protocol overhead-allows transparent task distribution across multiple KeyStone SoCs as a single logical resource. |
| Integrated Hardware Accelerators | VCP2 (Viterbi) and TCP3d (Turbo) coprocessors operate at CPU/3 and CPU/2 clock rates-offload convolutional and LDPC decoding without CPU intervention. |
| Flexible Boot Configuration | 13-bit BOOTMODE[12:0] pins support boot from SPI, I2C, uPP, EMIF16, or HyperLink-with ROM-resident second-level bootloader for field-upgradable firmware. |
Applications
| Avionics Signal Processing | Medical Imaging Reconstruction |
|---|---|
Use Scenario: Real-time radar pulse compression and synthetic aperture radar (SAR) image formation in airborne platforms. IC Role / Device Role / Timing Role: Dual-core deterministic execution of FFT, FIR, and matrix operations with sub-microsecond interrupt latency and synchronized DMA transfers. Use Value: Enables >10 GOPS sustained throughput within thermal and SWaP-C constraints, meeting DO-254/DO-178C certification requirements for Level A/B functions. |
Use Scenario: Parallel reconstruction of CT/MRI volumetric datasets using iterative algorithms and compressed sensing. IC Role / Device Role / Timing Role: Offloads compute-intensive backprojection and denoising kernels from host CPU while managing DDR3-ECC memory for patient data integrity. Use Value: Reduces reconstruction time by >4× versus single-core DSPs, supporting real-time intraoperative imaging with <50 ms latency. |
| Power System Protection Relays | Wireless Baseband Processing |
Use Scenario: Fault detection, harmonic analysis, and adaptive protection logic in IEC 61850-compliant digital relays. IC Role / Device Role / Timing Role: Simultaneous sampling of 16+ analog channels via external ADCs, real-time phasor estimation (IEEE C37.118), and GOOSE messaging over Ethernet. Use Value: Meets Class T1/T2 synchrophasor accuracy with <1 µs time synchronization via SGMII PTP stack and hardware timestamping. |
Use Scenario: Layer 1 physical layer processing for LTE-Advanced and 5G NR base stations including channel estimation, MIMO detection, and FEC decoding. IC Role / Device Role / Timing Role: VCP2 and TCP3d accelerators handle Viterbi/Turbo decoding; dual C66x cores manage OFDM modulation, precoding, and scheduler logic. Use Value: Supports 4×4 MIMO with 20 MHz bandwidth and 1024-QAM modulation while maintaining <100 µs processing latency per subframe. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core DSP applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMS320C6655CZH8 | Single-core variant with identical package, peripherals, and memory subsystem-but half the raw compute (1 core @ 1.25 GHz) and no second VCP2/TCP3d instance. | Suitable for cost-sensitive or lower-throughput applications where dual-core parallelism is unnecessary, e.g., single-channel ultrasound beamforming. | Select TMS320C6655CZH8 when application workload fits within one C66x core and budget constraints exclude dual-core capacity. |
| ADSP-SC589KSWZ-4 | Analog Devices dual-core SHARC+ + ARM Cortex-A5 SoC; lacks HyperLink and MSMC but adds Linux-capable ARM core and audio-specific peripherals. | Better suited for mixed-signal applications requiring real-time DSP + general-purpose OS services (e.g., voice analytics gateways), not pure high-throughput signal processing. | Choose ADSP-SC589KSWZ-4 only if ARM-hosted middleware, audio codecs, or heterogeneous task partitioning are required-TMS320C6657CZH8 remains superior for deterministic DSP-only workloads. |
Compared with TMS320C6655CZH8, the TMS320C6657CZH8 delivers 2× peak compute and full hardware accelerator redundancy; versus ADSP-SC589KSWZ-4, it offers higher fixed/floating-point throughput, dedicated MSMC, and HyperLink scalability-but no ARM runtime or audio peripherals.
Availability
TMS320C6657CZH8 is available at Aetrix Electronics and suitable for avionics signal processing, medical imaging reconstruction, and power system protection relays requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for TMS320C6657CZH8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and digital signal processing technologies, with decades of leadership in high-performance DSP architectures.
The TMS320C6657 belongs to TI's KeyStone multicore DSP family, designed specifically for deterministic, high-throughput signal processing in safety-critical and infrastructure-grade applications where computational density, memory coherency, and inter-chip scalability are paramount.
FAQ
What is the maximum operating frequency of the TMS320C6657CZH8?
The TMS320C6657CZH8 operates at up to 1.25 GHz per core, delivering 40 GMAC (fixed-point) and 20 GFLOPS (floating-point) performance per C66x DSP core. This frequency is supported across the extended temperature range (–40°C to 100°C) under specified voltage and cooling conditions per the SPRS814D datasheet.
Does the TMS320C6657CZH8 support DDR3 memory with error correction?
Yes, the TMS320C6657CZH8 integrates a 32-bit DDR3 memory controller supporting DDR3-1333 operation with full ECC capability. It enables detection and correction of single-bit errors and detection of multi-bit errors in external DDR3 DRAM, essential for reliability in medical and avionics applications.
How many hardware accelerators are integrated into the TMS320C6657CZH8?
The TMS320C6657CZH8 includes two Viterbi Coprocessor 2 (VCP2) units and one Turbo Decoder Coprocessor 3d (TCP3d). These accelerators operate at CPU/3 and CPU/2 clock rates respectively, offloading convolutional and Turbo/LDPC decoding tasks from the main C66x cores in wireless infrastructure applications.
What high-speed serial interfaces does the TMS320C6657CZH8 support?
The TMS320C6657CZH8 supports RapidIO 2.1 (4 lanes, up to 5 GBaud/lane), PCIe Gen2 (1 or 2 lanes, up to 5 GBaud/lane), HyperLink (40 Gbaud full-duplex), and SGMII (10/100/1000 Mbps). All interfaces feature hardware queue management and low-latency DMA integration via Multicore Navigator.
Is the TMS320C6657CZH8 pin-compatible with the TMS320C6655CZH8?
Yes, the TMS320C6657CZH8 and TMS320C6655CZH8 share identical CZH package (625-pin BGA, 21 mm × 21 mm), pinout, power sequencing, and peripheral mapping. The only functional difference is the presence of a second C66x CorePac and associated VCP2/TCP3d accelerators in the C6657 variant.
TMS320C6657CZH8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- TMS320C66x
- Package/Case:
- 625-BFBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Type:
- Fixed/Floating Point
- Interface:
- DDR3, EBI/EMI, Ethernet, McBSP, PCIe, I2C, SPI, UART, UPP
- Clock Rate:
- 850MHz
- Non-Volatile Memory:
- ROM (128kB)
- On-Chip RAM:
- 2.06MB
- Voltage - I/O:
- 1.0V, 1.5V, 1.8V
- Voltage - Core:
- 1.00V
- Operating Temperature:
- 0°C ~ 85°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 625-FCBGA (21x21)
TMS320C6657CZH8 FAQ
1.How can I place an order for TMS320C6657CZH8 through Aetrix?
Please submit a Request for Quotation (RFQ) for TMS320C6657CZH8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TMS320C6657CZH8 reliable?
The price and inventory of TMS320C6657CZH8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMS320C6657CZH8 is usually 5 days.
3.What payment methods are accepted for TMS320C6657CZH8?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMS320C6657CZH8 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TMS320C6657CZH8?
TMS320C6657CZH8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TMS320C6657CZH8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TMS320C6657CZH8?
For technical support, including TMS320C6657CZH8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMS320C6657CZH8 requirements.
6.How does Aetrix verify that TMS320C6657CZH8 is sourced from the original manufacturer or authorized distributors?
All TMS320C6657CZH8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMS320C6657CZH8 meets industry standards.
7.What is the process for return or replacement of TMS320C6657CZH8?
All TMS320C6657CZH8 units undergo pre-shipment inspection (PSI). If there is an issue with TMS320C6657CZH8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TMS320C6657CZH8 part is unused and in its original packaging.
Return procedure for TMS320C6657CZH8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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