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Texas Instruments TMS320C6671ACYP25
- Part No.:
- TMS320C6671ACYP25
- Manufacturer:
- Texas Instruments
- Category:
- DSP (Digital Signal Processors)
- Package:
- 841-BFBGA, FCBGA
- Datasheet:
-
TMS320C6671ACYP25.pdf
- Description:
- IC DSP FIX/FLOAT POINT 841FCBGA
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
TMS320C6671ACYP25 from Texas Instruments is a single-core fixed- and floating-point digital signal processor based on the KeyStone architecture, operating at up to 1.25 GHz with 40 GMACs/core (fixed-point) and 20 GFLOPs/core (floating-point). It integrates 32KB L1P, 32KB L1D, 512KB L2, and 4MB MSM SRAM, and targets high-throughput signal processing in mission-critical communications infrastructure.
For engineers reviewing the TMS320C6671ACYP25 datasheet, TMS320C6671ACYP25 pinout, TMS320C6671ACYP25 application, or TMS320C6671ACYP25 equivalent, key selection considerations include its C66x core performance, integrated packet/security accelerators, DDR3-1600 interface, and pin compatibility with TMS320C6678/6674/6672 for scalable multicore migration paths.
Technical Context
The TMS320C6671ACYP25 implements TI's KeyStone architecture with four foundational elements: Multicore Navigator (8192 hardware queues), TeraNet switched fabric (2-Tbps internal bandwidth), Multicore Shared Memory Controller (for non-blocking MSM SRAM/DDR3 access), and HyperLink (50-Gbaud chip-to-chip interconnect). Its C66x CorePac executes 8 single-precision floating-point MACs per cycle and supports IEEE 754 compliance, backward code compatibility with C6000 DSPs, and 90 new vector/floating-point instructions.
On-chip acceleration includes a Network Coprocessor with Packet Accelerator (1.5 Mpackets/s, L2–L4 classification, IPsec/GTP-U/SCTP/PDCP support) and Security Accelerator (AES/DES/3DES/Kasumi/SNOW3G/SHA-1/SHA-2, up to 2.8 Gbps encryption). Peripheral integration covers PCIe Gen2 (1–2 lanes), 4-lane SRIO 2.1 (up to 5 GBaud/lane), dual SGMII GbE switch, 64-bit DDR3-1600 EMIF, TSIP (1024 DS0s), and three PLLs for clock domain management.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | C66x DSP CorePac - single-core, fixed/floating-point, IEEE 754 compliant, 90 new math/vector instructions vs. C64x+ |
| Max Operating Frequency | 1.25 GHz - enables 40 GMACs/core (fixed-point) and 20 GFLOPs/core (floating-point) real-world throughput |
| On-Chip Memory | 32KB L1P + 32KB L1D + 512KB configurable L2 + 4096KB MSM SRAM - supports low-latency, error-corrected shared memory access without TeraNet contention |
| External Memory Interface | 64-bit DDR3-1600 EMIF with ECC support - provides 8GB addressable space and robust data integrity for large buffer applications |
| Accelerators | Packet Accelerator (1.5 Mpackets/s, wire-speed 1 Gbps) + Security Accelerator (AES/SHA/3DES/Kasumi up to 2.8 Gbps) - offloads protocol stack and crypto processing from CPU |
| High-Speed Interfaces | PCIe Gen2 (1–2 lanes), 4-lane SRIO 2.1 (up to 5 GBaud/lane), HyperLink (50 Gbaud full-duplex), dual SGMII GbE - enables multi-protocol backplane and chip-to-chip interconnect |
| Temperature Range | Commercial: 0°C to 85°C; Extended: –40°C to 100°C - qualified for industrial and telecom infrastructure environments |
Pinout & Package
The TMS320C6671ACYP25 uses an 841-pin FCCSP (Fine-Pitch Chip-Scale Package) with 0.8-mm ball pitch, designed for high-density PCB layouts in telecom and computing modules. Thermal and mechanical data confirm JEDEC-standard thermal pad under die and 35 mm × 35 mm footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKIN | Main oscillator input | Accepts 10–100 MHz reference clock; feeds MAIN PLL for system clock generation |
| DDR3_DQ[63:0] | DDR3 data bus | 64-bit bidirectional data interface supporting DDR3-1600 (800 MHz) with on-die termination control |
| SRIO_LN[3:0]_TX/RX | Serial RapidIO lanes | Four differential pairs supporting 1.24/2.5/3.125/5 GBaud per lane; configurable as 1×, 2×, or 4× links |
| PCIE_REFCLK_P/N | PCIe reference clock | Differential 100-MHz input for PCIe Gen2 PHY synchronization and jitter tolerance |
| HYPERLINK_TX/RX[3:0] | HyperLink transceivers | Four full-duplex differential lanes enabling 50-Gbaud chip-to-chip interconnect with low-protocol overhead |
| TSIP_CLK/FSYNC/DATA | Telecom Serial Interface Port | Supports 2/4/8-lane operation at 32.768/16.384/8.192 Mbps per lane; handles 1024 DS0 time-division multiplexing |
Key Features
| Feature | Design Value |
|---|---|
| Pin-for-pin compatibility | With TMS320C6678/6674/6672 - enables seamless migration from single-core to multicore KeyStone platforms without PCB redesign |
| Backward software compatibility | Full C6000 family instruction set compatibility - allows reuse of legacy C64x+/C67x code and toolchains |
| Integrated packet acceleration | Hardware-accelerated L2–L4 classification, checksum, QoS, and tunneling (GTP-U, SCTP, PDCP) - reduces host CPU load in baseband and packet-processing systems |
| Memory protection unit (MPU) | Enforces access control for both MSM SRAM and DDR3_EMIF - prevents unauthorized memory access in safety-critical or multi-tenant applications |
| SmartReflex power management | Dynamic voltage and frequency scaling (DVFS) with real-time monitoring - optimizes power efficiency across varying computational loads |
Applications
| Wireless Baseband Processing | Medical Imaging Reconstruction |
|---|---|
Use Scenario: Real-time LTE-Advanced and 5G NR physical layer processing including FFT, channel estimation, and turbo decoding in macro/pico cell base stations. IC Role / Device Role / Timing Role: Primary DSP engine executing deterministic, low-latency signal processing kernels with hardware-accelerated packet framing and transport-layer offload. Use Value: Delivers 1.25 GHz sustained compute throughput and integrated packet accelerator enable 1-Gbps wire-speed processing without external FPGA co-processing. |
Use Scenario: High-resolution CT/MRI image reconstruction using iterative algorithms requiring massive parallel floating-point computation and large local memory buffers. IC Role / Device Role / Timing Role: Fixed/floating-point compute node handling back-projection, filtering, and denoising with direct access to 4MB MSM SRAM and DDR3-1600 for frame buffering. Use Value: 20 GFLOPs/core performance and IEEE 754 compliance ensure numerical accuracy and reproducibility in diagnostic-grade imaging pipelines. |
| Industrial Vision Analytics | Test & Measurement Equipment |
Use Scenario: Real-time defect detection and metrology in automated optical inspection (AOI) systems using convolutional neural networks and sub-pixel edge analysis. IC Role / Device Role / Timing Role: Vision-specific DSP subsystem performing pixel-level arithmetic, histogram equalization, and feature extraction with deterministic latency via EDMA3 and Multicore Navigator. Use Value: 40 GMACs/core fixed-point capability and 512KB L2 cache enable >100 fps processing of 4K monochrome image streams with minimal external memory access. |
Use Scenario: High-speed digital signal analysis in oscilloscopes and protocol analyzers requiring real-time FFT, spectral masking, and jitter measurement on multi-GHz serial data streams. IC Role / Device Role / Timing Role: Signal acquisition and post-processing engine interfacing with high-speed ADCs via EMIF16 or TSIP, executing time-domain and frequency-domain transforms. Use Value: C66x core's 8-cycle single-precision MAC and dedicated hardware loop control reduce FFT execution time by >3× versus prior C64x+ generations. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DSP processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMS320C6678ACY | Octa-core C66x, same KeyStone architecture, identical pinout and peripheral set, but 8× the raw compute (320 GMACs vs. 40 GMACs) | Targeted at massively parallel workloads (e.g., massive MIMO, radar beamforming) where task partitioning across cores is required | Select when application demands scalable multicore parallelism and can leverage TI's Multicore Navigator for inter-core task dispatch |
| TMS320C6657CZHA | Dual-core C66x, 1.0 GHz max, 682-pin BGA, lacks HyperLink and reduced MSM SRAM (2MB vs. 4MB); no packet/security accelerators | Suitable for cost-sensitive embedded DSP tasks (e.g., audio codecs, motor control) without network-aware acceleration requirements | Choose for lower-power, lower-cost deployments where single-core 1.25 GHz performance exceeds needs and advanced accelerators are unused |
Compared with TMS320C6671ACYP25, the TMS320C6678ACY offers immediate scalability via eight identical C66x cores and full pin compatibility, while the TMS320C6657CZHA trades performance, acceleration, and memory for reduced package size and power - making the TMS320C6671ACYP25 optimal for single-threaded, accelerator-dependent, high-clock-rate applications.
Availability
TMS320C6671ACYP25 is available at Aetrix Electronics and suitable for wireless infrastructure, medical imaging systems, industrial vision analytics, and test & measurement equipment requiring stable component supply, long-term lifecycle support, and guaranteed traceability.
Supply support for TMS320C6671ACYP25 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of leadership in DSP innovation and industrial-grade reliability.
The TMS320C6671ACYP25 belongs to TI's KeyStone-based C66x DSP product line, engineered for high-performance, low-latency signal processing in communications infrastructure, medical imaging, and real-time analytics where deterministic compute and hardware acceleration are critical.
FAQ
What is the maximum operating frequency of the TMS320C6671ACYP25?
The TMS320C6671ACYP25 operates at up to 1.25 GHz, delivering 40 GMACs/core for fixed-point and 20 GFLOPs/core for floating-point computation. This frequency is validated across commercial (0°C to 85°C) and extended (–40°C to 100°C) temperature ranges with appropriate power supply and cooling design per TI's SPRS756E datasheet.
Does the TMS320C6671ACYP25 support DDR3 memory, and what speed does it achieve?
Yes, the TMS320C6671ACYP25 integrates a 64-bit DDR3 external memory interface (EMIF) supporting DDR3-1600 (800 MHz data rate), providing up to 8GB of addressable memory space with ECC DRAM support. The interface is fully compliant with JEDEC DDR3L standards and includes programmable timing parameters for reliable operation across voltage and temperature corners.
Is the TMS320C6671ACYP25 pin-compatible with other C66x devices?
Yes, the TMS320C6671ACYP25 is explicitly pin-for-pin compatible with the TMS320C6678, TMS320C6674, and TMS320C6672 multicore DSPs. This allows hardware reuse across single-core and multicore KeyStone platforms, reducing development risk and accelerating time-to-market for scalable system designs.
What accelerators are integrated into the TMS320C6671ACYP25?
The TMS320C6671ACYP25 includes a Network Coprocessor with two dedicated engines: a Packet Accelerator supporting IPsec, GTP-U, SCTP, and PDCP at 1.5 Mpackets/s; and a Security Accelerator supporting AES, DES, SHA-1/2, Kasumi, and SNOW 3G with up to 2.8 Gbps encryption throughput - both offloading CPU-intensive protocol and crypto operations.
What development tools are supported for the TMS320C6671ACYP25?
Texas Instruments provides a complete toolchain for the TMS320C6671ACYP25, including the C6000 Code Generation Tools (C compiler, assembler, linker), Code Composer Studio IDE with real-time debugging and profiling, and the C66x Optimizing Compiler with auto-vectorization. TI also supplies device-specific drivers, BIOS/PSP software libraries, and reference examples for all major peripherals and accelerators.
TMS320C6671ACYP25 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- TMS320C66x
- Package/Case:
- 841-BFBGA, FCBGA
- Packaging:
- Tube
- Product Status:
- Active
- Type:
- Fixed/Floating Point
- Interface:
- EBI/EMI, Ethernet MAC, PCIe, I2C, SPI, SRIO, UART
- Clock Rate:
- 1.25GHz
- Non-Volatile Memory:
- ROM (128kB)
- On-Chip RAM:
- 4.56MB
- Voltage - I/O:
- 1.0V, 1.5V, 1.8V
- Voltage - Core:
- 1.00V
- Operating Temperature:
- 0°C ~ 85°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 841-FCBGA (24x24)
TMS320C6671ACYP25 FAQ
1.How can I place an order for TMS320C6671ACYP25 through Aetrix?
Please submit a Request for Quotation (RFQ) for TMS320C6671ACYP25 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TMS320C6671ACYP25 reliable?
The price and inventory of TMS320C6671ACYP25 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMS320C6671ACYP25 is usually 5 days.
3.What payment methods are accepted for TMS320C6671ACYP25?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMS320C6671ACYP25 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TMS320C6671ACYP25?
TMS320C6671ACYP25 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TMS320C6671ACYP25 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TMS320C6671ACYP25?
For technical support, including TMS320C6671ACYP25 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMS320C6671ACYP25 requirements.
6.How does Aetrix verify that TMS320C6671ACYP25 is sourced from the original manufacturer or authorized distributors?
All TMS320C6671ACYP25 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMS320C6671ACYP25 meets industry standards.
7.What is the process for return or replacement of TMS320C6671ACYP25?
All TMS320C6671ACYP25 units undergo pre-shipment inspection (PSI). If there is an issue with TMS320C6671ACYP25, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TMS320C6671ACYP25 part is unused and in its original packaging.
Return procedure for TMS320C6671ACYP25:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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