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Texas Instruments TMS320C6671ACYPA25

Part No.:
TMS320C6671ACYPA25
Manufacturer:
Texas Instruments
Category:
DSP (Digital Signal Processors)
Package:
841-BFBGA, FCBGA
Datasheet:
AetrixTMS320C6671ACYPA25.pdf
Description:
IC DSP FIX/FLOAT POINT 841FCBGA
Quantity:
Payment:
Payment
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Inventory:4,251

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Product details

Overview

TMS320C6671ACYPA25 from Texas Instruments is a single-core fixed- and floating-point digital signal processor based on the KeyStone architecture, operating at 1.25 GHz with 40 GMACs/core and 20 GFLOPs/core. It integrates 32KB L1P, 32KB L1D, 512KB L2, and 4MB MSM SRAM, and targets high-throughput signal processing in mission-critical communications infrastructure.

For engineers reviewing the TMS320C6671ACYPA25 datasheet, TMS320C6671ACYPA25 pinout, TMS320C6671ACYPA25 application, or TMS320C6671ACYPA25 equivalent, key selection criteria include its C66x core performance, integrated packet/security accelerators, DDR3-1600 interface, and compatibility with TI's C6000 software ecosystem.

Technical Context

The TMS320C6671ACYPA25 implements a single C66x DSP CorePac with IEEE 754-compliant single/double-precision floating-point execution and 90 new vector-math instructions versus C64x+. Its TeraNet switch fabric enables nonblocking internal data movement between the Multicore Navigator, MSMC, and peripherals.

Hardware acceleration is distributed across three domains: the Network Coprocessor (Packet Accelerator + Security Accelerator), Multicore Navigator (8192 hardware queues with zero-overhead packet DMA), and MSMC (memory protection for both 4MB MSM SRAM and DDR3-EMIF).

Key Specifications

ParameterValue and Actual Design Meaning
Core ArchitectureC66x DSP CorePac - single-core, backward-compatible with C6000 family, supports fixed/floating-point code without recompilation.
Max Operating Frequency1.25 GHz - delivers 40 GMACs/core (fixed) and 20 GFLOPs/core (floating) for real-time baseband and media processing.
L1/L2 Memory32KB L1P + 32KB L1D + 512KB configurable L2 - enables low-latency access to critical code/data; all caches support ECC.
Shared Memory4096KB MSM SRAM - accessible by all on-chip subsystems without consuming TeraNet bandwidth; includes memory protection unit.
External Memory Interface64-bit DDR3-1600 EMIF - supports up to 8GB addressable space with ECC DRAM support for system reliability.
AcceleratorsPacket Accelerator (1.5 Mpps wire-speed) + Security Accelerator (AES/SHA/3DES up to 2.8 Gbps) - offloads Layer 2–4 packet processing and crypto from CPU.
High-Speed I/O4-lane SRIO 2.1 (5 GBaud), PCIe Gen2 (2-lane), HyperLink (50 Gbaud), dual SGMII - enables scalable interconnect in multi-chip systems.

Pinout & Package

The TMS320C6671ACYPA25 is housed in a 841-pin CYP BGA package (27 mm × 27 mm, 0.8 mm pitch) with thermal lid, rated for commercial temperature (0°C to 85°C).

Pin/TerminalCircuit RoleDesign Meaning
CLKINReference clock inputAccepts differential 100 MHz crystal or oscillator input for MAIN PLL; required for boot and core timing initialization.
DDR3_DQ[63:0]Data bus64-bit bidirectional DDR3 data interface supporting burst transfers at 1600 MT/s; requires matched-length routing and termination.
SRIO_LANE[3:0]_TX/RXSerial RapidIO transceiverDifferential pairs supporting 1.24–5 GBaud per lane; configured for 1×, 2×, or 4× link topologies via strap pins or firmware.
PCIe_REFCLK_P/NPCIe reference clock100 MHz differential reference for PCIe Gen2 PHY; must meet jitter and skew requirements per PCI-SIG specification.
HYPERLINK_TX[7:0]/RX[7:0]HyperLink physical layerEight differential TX/RX pairs enabling 50 Gbaud full-duplex chip-to-chip interconnect; used for KeyStone device scaling.
SGMII0/1_TXP/N, RXP/NGigabit Ethernet PHY interfaceDual SGMII lanes connecting to external PHYs; supports 10/100/1000 Mbps with IEEE 802.3 compliance.

Key Features

FeatureDesign Value
Backward software compatibilityFully compatible with TI C6000 toolchain and legacy fixed/floating-point binaries - eliminates porting effort for migration from C64x+/C674x.
Memory protectionMPU enforces access control across MSM SRAM and DDR3-EMIF - prevents unauthorized read/write by peripheral or accelerator engines.
Zero-overhead packet DMAMulticore Navigator manages 8192 hardware queues and routes packets directly to EDMA3 channels - eliminates CPU polling and interrupt overhead.
Integrated network co-processorOffloads IPsec, GTP-U, SCTP, PDCP, RoHC, and air ciphering - enables single-chip LTE eNodeB or 5G small cell baseband processing.
Power-aware architectureThree independent PLLs (MAIN, DDR3, PASS) and SmartReflex voltage scaling - allows dynamic power management per subsystem during runtime.

Applications

Wireless Base Station ProcessingMedical Imaging Reconstruction

Use Scenario: Real-time LTE-Advanced Layer 1 processing in macrocell remote radio heads with CPRI fronthaul.

IC Role / Device Role / Timing Role: Primary DSP executing FFT, channel estimation, MIMO detection, and turbo decoding at sub-100 µs latency.

Use Value: 1.25 GHz C66x core + packet accelerator enables concurrent PHY-layer processing and backhaul packet forwarding without external NIC.

Use Scenario: GPU-accelerated CT/MRI image reconstruction pipeline requiring deterministic low-latency compute.

IC Role / Device Role / Timing Role: Offload compute-intensive back-projection and iterative reconstruction kernels from host CPU.

Use Value: 40 GMACs/core and 512KB L2 enable >95% of reconstruction ops to execute on-chip, reducing PCIe transfer bottlenecks.

Industrial Video Analytics Edge NodeSecure Communications Gateway

Use Scenario: Multi-camera video analytics node performing H.264/H.265 encode + AI inference at edge.

IC Role / Device Role / Timing Role: Real-time video preprocessing (deinterlacing, noise reduction) and motion detection before encoding.

Use Value: Dual SGMII + SRIO + HyperLink allow synchronized camera ingest, local processing, and secure upstream transmission.

Use Scenario: FIPS-compliant encrypted VoIP gateway for defense-grade tactical networks.

IC Role / Device Role / Timing Role: Hardware-accelerated IPsec and SRTP crypto engine with deterministic 2.8 Gbps throughput.

Use Value: Security Accelerator handles AES-GCM, SHA-2, and HMAC without CPU intervention - preserves 100% core cycles for call signaling stack.

Equivalent & Alternatives

The following parts are listed as comparable options for similar DSP-based signal processing applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
TMS320C6678ACYPA25Octa-core C66x (8× 1.25 GHz), 32MB MSM SRAM, identical pinout and software compatibility.Higher aggregate throughput for massive MIMO or multi-sector baseband; larger memory footprint for multi-threaded workloads.Select when parallel task distribution across cores is required; same PCB layout but higher power and thermal demand.
TMS320C6670ACYPA25Single-core C66x at 1.0 GHz, reduced L2 (256KB), no Network Coprocessor or HyperLink.Cost-optimized variant for less demanding signal processing where packet/crypto acceleration is handled externally.Select for lower-power, lower-BOM-cost designs where full C6671 feature set is unused; not pin-compatible.

Compared with TMS320C6671ACYPA25, the C6678 offers scalable multicore performance with identical software and pinout, while the C6670 trades acceleration features and speed for cost and power efficiency - making the C6671 the optimal balance for single-threaded high-throughput DSP tasks requiring integrated networking.

Availability

TMS320C6671ACYPA25 is available at Aetrix Electronics and suitable for wireless infrastructure, medical imaging systems, and industrial video analytics requiring stable component supply over extended production lifecycles.

Supply support for TMS320C6671ACYPA25 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog and embedded processing solutions for industrial, automotive, and communications markets.

The TMS320C6671ACYPA25 belongs to TI's KeyStone-based C66x DSP product line, designed specifically for high-performance, low-latency signal processing in communications infrastructure and real-time embedded systems.

FAQ

What is the maximum operating frequency of the TMS320C6671ACYPA25?

The TMS320C6671ACYPA25 operates at a maximum core frequency of 1.25 GHz, delivering 40 GMACs/core for fixed-point and 20 GFLOPs/core for floating-point computation. This frequency is achieved using TI's C66x DSP core with optimized pipeline depth and dual-issue VLIW architecture. The device maintains this speed under commercial temperature conditions (0°C to 85°C) with proper power delivery and thermal management. TMS320C6671ACYPA25 supports dynamic frequency scaling via its MAIN PLL configuration registers.

Does the TMS320C6671ACYPA25 support backward compatibility with older C6000 DSP code?

Yes, the TMS320C6671ACYPA25 is fully backward code-compatible with TI's prior C6000 fixed- and floating-point DSP generations, including C64x+ and C674x. This compatibility extends to instruction set, register mapping, and memory model - allowing existing binaries to run without modification. Software porting is simplified using TI's Code Generation Tools v8.x and SYS/BIOS RTOS. TMS320C6671ACYPA25 retains the same ABI and exception model, ensuring seamless integration into legacy signal processing frameworks.

What memory interfaces does the TMS320C6671ACYPA25 provide?

The TMS320C6671ACYPA25 integrates multiple memory interfaces: 32KB L1P and 32KB L1D on-chip caches, 512KB configurable L2 memory, 4MB MSM SRAM with memory protection, and a 64-bit DDR3-1600 external memory interface supporting up to 8GB address space with ECC. All on-chip memories implement error detection and correction. The DDR3 EMIF complies with JEDEC DDR3L standards and supports programmable timing parameters. TMS320C6671ACYPA25 does not include LPDDR or QDR interfaces.

Is the TMS320C6671ACYPA25 pin-compatible with other KeyStone devices?

Yes, the TMS320C6671ACYPA25 is pin-for-pin compatible with the TMS320C6678, C6674, and C6672 DSPs in the same CYP BGA package. This allows direct substitution in existing PCB layouts when upgrading from single-core to multicore configurations or vice versa. Pin compatibility covers power, ground, clock, JTAG, DDR3, SRIO, PCIe, HyperLink, and SGMII signals. However, unused pins on the C6671 (e.g., additional core-specific signals on multicore variants) are NC and must remain unconnected. TMS320C6671ACYPA25 shares identical mechanical and thermal specifications with these counterparts.

What development tools are supported for the TMS320C6671ACYPA25?

Texas Instruments provides full toolchain support for the TMS320C6671ACYPA25, including Code Generation Tools v8.3.12+, SYS/BIOS real-time kernel, XDS200/XDS560v2 debug probes, and Code Composer Studio v10 IDE. TI's C66x compiler supports auto-vectorization and intrinsic functions for optimized DSP math. Evaluation is enabled via the TMS320C6678 EVM (which shares pinout and software compatibility). Third-party tools like MATLAB Coder and Arm GNU Toolchain are not officially supported. TMS320C6671ACYPA25 also supports TI's Processor SDK for Linux and RTOS-based bare-metal examples.

TMS320C6671ACYPA25 Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
TMS320C66x
Package/Case:
841-BFBGA, FCBGA
Packaging:
Tube
Product Status:
Active
Type:
Fixed/Floating Point
Interface:
EBI/EMI, Ethernet MAC, PCIe, I2C, SPI, SRIO, UART
Clock Rate:
1.25GHz
Non-Volatile Memory:
ROM (128kB)
On-Chip RAM:
4.56MB
Voltage - I/O:
1.0V, 1.5V, 1.8V
Voltage - Core:
1.00V
Operating Temperature:
-40°C ~ 100°C (TC)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
841-FCBGA (24x24)

TMS320C6671ACYPA25 FAQ

1.How can I place an order for TMS320C6671ACYPA25 through Aetrix?

Please submit a Request for Quotation (RFQ) for TMS320C6671ACYPA25 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TMS320C6671ACYPA25 reliable?

The price and inventory of TMS320C6671ACYPA25 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMS320C6671ACYPA25 is usually 5 days.

3.What payment methods are accepted for TMS320C6671ACYPA25?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMS320C6671ACYPA25 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TMS320C6671ACYPA25?

TMS320C6671ACYPA25 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TMS320C6671ACYPA25 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TMS320C6671ACYPA25?

For technical support, including TMS320C6671ACYPA25 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMS320C6671ACYPA25 requirements.

6.How does Aetrix verify that TMS320C6671ACYPA25 is sourced from the original manufacturer or authorized distributors?

All TMS320C6671ACYPA25 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMS320C6671ACYPA25 meets industry standards.

7.What is the process for return or replacement of TMS320C6671ACYPA25?

All TMS320C6671ACYPA25 units undergo pre-shipment inspection (PSI). If there is an issue with TMS320C6671ACYPA25, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TMS320C6671ACYPA25 part is unused and in its original packaging.

Return procedure for TMS320C6671ACYPA25:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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