Texas Instruments TMS320C6672ACYP
- Part No.:
- TMS320C6672ACYP
- Manufacturer:
- Texas Instruments
- Category:
- DSP (Digital Signal Processors)
- Package:
- 841-BFBGA, FCBGA
- Datasheet:
-
TMS320C6672ACYP.pdf
- Description:
- IC DSP FIX/FLOAT POINT 841FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
TMS320C6672ACYP from Texas Instruments is a dual-core fixed- and floating-point digital signal processor based on the KeyStone multicore architecture, featuring two 1.5 GHz C66x DSP cores delivering 48 GMAC/core and 24 GFLOP/core, 1 MB L2 cache per core, 4 MB shared MSM SRAM, and integrated network coprocessor with packet and security acceleration - deployed in high-throughput wireless baseband and media infrastructure systems.
For engineers reviewing the TMS320C6672ACYP datasheet, TMS320C6672ACYP pinout, TMS320C6672ACYP application, or TMS320C6672ACYP equivalent, key selection criteria include dual-C66x core performance at 1.5 GHz, hardware-accelerated packet processing up to 1.5 Mpps, DDR3-1600 interface with ECC support, and HyperLink interconnect for chip-to-chip scalability in telecom and radar systems.
Technical Context
The TMS320C6672ACYP implements TI's KeyStone architecture with four foundational elements: Multicore Navigator (8192 hardware queues), TeraNet non-blocking switch fabric, Multicore Shared Memory Controller (MSMC) for direct access to 4 MB shared SRAM and DDR3-1600 EMIF, and HyperLink (50 Gbaud full-duplex) for seamless multi-chip resource pooling.
Its dual C66x CorePacs each integrate 32 KB L1P, 32 KB L1D, and 512 KB configurable L2 memory with error correction; the Network Coprocessor includes dedicated Packet Accelerator (L2–L4 classification, checksum, QoS) and Security Accelerator (AES, SHA-2, GCM, up to 2.8 Gbps encryption), both operating independently of CPU cores.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Count & Type | Dual C66x DSP cores, fixed/floating-point, IEEE 754-compliant, backward-compatible with C6000 family |
| Max Core Frequency | 1.5 GHz - enables 48 GMAC/core (fixed) and 24 GFLOP/core (floating) computational throughput |
| On-Chip Memory | 32 KB L1P + 32 KB L1D per core; 512 KB L2 per core; 4096 KB MSM SRAM shared between cores with memory protection |
| External Memory Interface | 64-bit DDR3-1600 EMIF with ECC support and 8 GB addressable space |
| High-Speed Interconnects | 4-lane SRIO 2.1 (up to 5 GBaud/lane), PCIe Gen2 (1–2 lanes), HyperLink (50 Gbaud), dual SGMII Gigabit Ethernet |
| Accelerators | Network Coprocessor with Packet Accelerator (1.5 Mpps wire-speed) and Security Accelerator (AES/SHA/3DES up to 2.8 Gbps) |
| Temperature Range | Extended industrial grade: –40°C to +100°C - qualified for base station and radar environmental stress |
Pinout & Package
The TMS320C6672ACYP is housed in an 841-pin FC-BGA package (19 mm × 19 mm, 0.8 mm pitch) with thermal lid, designed for high-density PCB layouts in telecom and defense applications requiring controlled impedance routing and thermal management.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKIN | Reference clock input | Accepts differential 100 MHz system reference for MAIN PLL; critical for deterministic timing across all clock domains |
| DDR3_DQ[63:0] | Data bus for DDR3 interface | 64-bit bidirectional data path supporting DDR3-1600; requires matched-length routing and on-die termination calibration |
| SRIO_LANE[3:0]_TXP/N | Serial RapidIO transmit differential pair | Four independent 5 GBaud lanes; supports direct I/O and message passing without CPU intervention via Multicore Navigator |
| HYP_TXP/N, HYP_RXP/N | HyperLink full-duplex differential I/O | 50 Gbaud chip-to-chip interconnect; enables transparent task dispatch across multiple KeyStone devices |
| SGMII0/1_TXP/N, RXP/N | Gigabit Ethernet physical layer interface | Dual SGMII ports supporting 10/100/1000 Mbps; integrated switch subsystem eliminates external PHY dependency for basic bridging |
| TSIP0/1_CLK, TSIP0/1_DATA | Telecom Serial Interface Port | Supports 1024 DS0 channels per port at 32.768 Mbps; used for TDM backhaul in wireless infrastructure |
Key Features
| Feature | Design Value |
|---|---|
| Multicore Navigator with 8192 queues | Enables zero-overhead packet-based DMA and hardware-accelerated task dispatch across cores and accelerators without software scheduling overhead |
| Integrated Network Coprocessor | Offloads L2–L4 packet processing (GTP-U, PDCP, SCTP) and cryptographic operations (IPsec, SSL/TLS) from CPU cores, preserving 100% DSP compute for signal processing |
| Memory Protection Unit (MPU) | Provides independent protection for MSM SRAM and DDR3_EMIF, preventing errant code or DMA from corrupting shared memory regions |
| Backward binary compatibility | Executes legacy C6000 assembly and C code without recompilation, reducing migration effort for existing DSP firmware bases |
| SmartReflex dynamic voltage scaling | Automatically adjusts CVDD supply voltage based on real-time workload and temperature, reducing active power by up to 25% in burst-mode operation |
Applications
| Wireless Baseband Processing | Radar Signal Processing |
|---|---|
Use Scenario: Real-time LTE-Advanced and 5G NR physical layer processing including FFT, channel estimation, and MIMO detection in macrocell and small cell base stations. IC Role / Device Role / Timing Role: Primary DSP engine executing layered protocol stack functions with deterministic sub-microsecond latency for symbol-level processing. Use Value: Dual 1.5 GHz C66x cores deliver >96 GMAC aggregate throughput while Network Coprocessor handles transport-layer packet encapsulation, enabling single-chip Layer 1+2 implementation. | Use Scenario: High-resolution pulse-Doppler and SAR imaging in airborne and ground-based radar systems requiring low-latency beamforming and CFAR detection. IC Role / Device Role / Timing Role: Real-time signal processor performing range-Doppler map generation, clutter suppression, and target tracking with synchronized timer-triggered acquisition. Use Value: 512 KB L2 cache per core and 4 MB MSM SRAM enable large FFT buffers and coefficient tables; HyperLink allows expansion to multi-chip beamformer arrays. |
| Media Infrastructure Transcoding | Industrial Video Analytics |
Use Scenario: Multi-channel 4K video transcoding and format conversion in broadcast headends and cloud media servers. IC Role / Device Role / Timing Role: Fixed/floating-point accelerator for HEVC/H.264 encode/decode kernels, motion estimation, and color-space conversion pipelines. Use Value: IEEE 754-compliant floating-point unit and 8 single-precision MAC/cycle capability accelerate math-intensive video algorithms; DDR3-1600 interface sustains >12 GB/s memory bandwidth for frame buffering. | Use Scenario: Real-time object detection, optical flow, and anomaly classification in factory automation vision systems using CNN inference and traditional computer vision filters. IC Role / Device Role / Timing Role: Edge DSP co-processor offloading vision algorithm execution from host ARM SoC, with deterministic response for safety-critical motion control loops. Use Value: Packet Accelerator enables time-synchronized camera sensor data ingestion over TSIP or SGMII; Security Accelerator signs firmware updates and authenticates peripheral modules. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multicore DSP applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMS320C6678ACYA | Octal-core variant (8× C66x), same KeyStone architecture, higher total compute (384 GMAC), larger MSM SRAM (8 MB), additional peripherals including PCIe x4 and second HyperLink port | Suitable for full macro baseband or multi-sector radar where TMS320C6672ACYP's dual-core capacity is insufficient | Select when scaling beyond dual-core throughput is required; board redesign needed due to different BGA footprint (900-pin vs. 841-pin) and power delivery |
| ADSP-SC589KSWZ-4 | ARM Cortex-A5 + SHARC+ dual-core architecture; 450 MHz SHARC+ core, 400 MHz Cortex-A5; lacks Network Coprocessor and HyperLink; includes SigmaStudio audio tools | Better suited for mixed-signal audio infrastructure and industrial control with RTOS integration, not telecom packet processing | Choose for applications prioritizing ARM ecosystem compatibility and audio-specific toolchains over raw DSP packet throughput and chip-to-chip interconnect |
Compared with TMS320C6672ACYP, the TMS320C6678ACYA offers scalable compute and interconnect for larger systems but requires mechanical redesign, while the ADSP-SC589KSWZ-4 trades packet acceleration and HyperLink for ARM+SHARC flexibility in non-telecom domains - neither is pin-compatible, and selection depends on whether system-level throughput or architectural alignment dominates the design priority.
Availability
TMS320C6672ACYP is available at Aetrix Electronics and suitable for wireless infrastructure, radar signal processing, and media transcoding applications requiring stable component supply, long-term industrial lifecycle support, and traceable sourcing from authorized channels.
Supply support for TMS320C6672ACYP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, specializing in analog, embedded processing, and connectivity technologies for industrial, automotive, and communications markets.
The TMS320C6672ACYP belongs to TI's KeyStone multicore DSP product line, engineered specifically for high-throughput, low-latency signal and packet processing in mission-critical communications infrastructure where deterministic performance and hardware-accelerated networking are essential.
FAQ
What is the maximum operating frequency of the TMS320C6672ACYP cores?
The TMS320C6672ACYP features two C66x DSP cores rated for operation up to 1.5 GHz. At this frequency, each core delivers 48 GMAC (fixed-point) and 24 GFLOP (floating-point) performance. The device supports lower speed grades (1.0 GHz and 1.25 GHz) depending on configuration and thermal conditions, but the TMS320C6672ACYP variant is specified for 1.5 GHz operation under extended temperature conditions (–40°C to +100°C).
Does the TMS320C6672ACYP support DDR3 memory with error correction?
Yes, the TMS320C6672ACYP includes a 64-bit DDR3-1600 external memory interface with full ECC (Error Correction Code) support for DRAM. This enables single-bit error correction and double-bit error detection, enhancing system reliability in mission-critical applications such as wireless baseband and radar. The DDR3 controller also supports programmable timing parameters and on-die termination calibration.
How does the Network Coprocessor in the TMS320C6672ACYP reduce CPU load?
The Network Coprocessor in the TMS320C6672ACYP consists of two independent engines - Packet Accelerator and Security Accelerator - that operate autonomously from the C66x cores. It handles L2–L4 packet classification, checksum insertion/verification, QoS tagging, IPsec encryption/decryption, and TLS handshake offload, freeing both DSP cores to focus exclusively on signal processing tasks without context switching or interrupt overhead.
Is the TMS320C6672ACYP pin-compatible with other C66x-based devices like the TMS320C6678?
No, the TMS320C6672ACYP is not pin-compatible with the TMS320C6678 or other members of the C66x family. It uses an 841-pin FC-BGA package, whereas the TMS320C6678 employs a 900-pin package with different pin assignments, power delivery requirements, and thermal pad layout. Migration between these devices requires PCB redesign and signal integrity revalidation.
What development tools are supported for the TMS320C6672ACYP?
Texas Instruments provides full toolchain support for the TMS320C6672ACYP, including the C6000 Code Generation Tools (C compiler, assembler, linker), Code Composer Studio IDE (v6.x+), DSP/BIOS and SYS/BIOS real-time kernels, and the Multicore Software Development Kit (MCSDK) with pre-validated drivers for SRIO, PCIe, HyperLink, and the Network Coprocessor. Evaluation is enabled via the TMS320C6678 EVM, which shares compatible software infrastructure despite hardware differences.
TMS320C6672ACYP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- TMS320C66x
- Package/Case:
- 841-BFBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Type:
- Fixed/Floating Point
- Interface:
- EBI/EMI, Ethernet MAC, PCIe, I2C, SPI, SRIO, UART
- Clock Rate:
- 1GHz
- Non-Volatile Memory:
- ROM (128kB)
- On-Chip RAM:
- 5.125MB
- Voltage - I/O:
- 1.0V, 1.5V, 1.8V
- Voltage - Core:
- 1.00V
- Operating Temperature:
- 0°C ~ 85°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 841-FCBGA (24x24)
TMS320C6672ACYP FAQ
1.How can I place an order for TMS320C6672ACYP through Aetrix?
Please submit a Request for Quotation (RFQ) for TMS320C6672ACYP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TMS320C6672ACYP reliable?
The price and inventory of TMS320C6672ACYP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMS320C6672ACYP is usually 5 days.
3.What payment methods are accepted for TMS320C6672ACYP?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMS320C6672ACYP transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TMS320C6672ACYP?
TMS320C6672ACYP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TMS320C6672ACYP order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TMS320C6672ACYP?
For technical support, including TMS320C6672ACYP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMS320C6672ACYP requirements.
6.How does Aetrix verify that TMS320C6672ACYP is sourced from the original manufacturer or authorized distributors?
All TMS320C6672ACYP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMS320C6672ACYP meets industry standards.
7.What is the process for return or replacement of TMS320C6672ACYP?
All TMS320C6672ACYP units undergo pre-shipment inspection (PSI). If there is an issue with TMS320C6672ACYP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TMS320C6672ACYP part is unused and in its original packaging.
Return procedure for TMS320C6672ACYP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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