Texas Instruments TMS320C6678AXCYP
- Part No.:
- TMS320C6678AXCYP
- Manufacturer:
- Texas Instruments
- Category:
- DSP (Digital Signal Processors)
- Package:
- 841-BFBGA, FCBGA
- Datasheet:
-
TMS320C6678AXCYP.pdf
- Description:
- IC DSP FIX/FLOAT POINT 841FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
TMS320C6678AXCYP from Texas Instruments is an eight-core fixed- and floating-point digital signal processor based on the KeyStone multicore architecture, operating at up to 1.4 GHz per core with 44.8 GMAC/core (fixed-point) and 22.4 GFLOP/core (floating-point). It integrates 32 KB L1P, 32 KB L1D, and 512 KB L2 memory per core, 4 MB shared MSM SRAM, and a 64-bit DDR3-1600 interface. It serves in high-throughput signal processing pipelines for radar baseband, wireless infrastructure baseband, and real-time video analytics.
For engineers reviewing the TMS320C6678AXCYP datasheet, TMS320C6678AXCYP pinout, TMS320C6678AXCYP application, or TMS320C6678AXCYP equivalent, this page delivers verified core count, clock speed, memory hierarchy, accelerator capabilities (Network Coprocessor, Multicore Navigator), and thermal grade - all confirmed for the AXCYP variant with GYP package and extended temperature range (–40°C to 100°C).
Technical Context
The TMS320C6678AXCYP implements TI's KeyStone architecture centered on four hardware pillars: TeraNet (non-blocking 2-Tbps switch fabric), Multicore Navigator (8192-hardware-queue packet dispatcher), Multicore Shared Memory Controller (direct access to 4 MB MSM SRAM and DDR3-1600 with ECC), and HyperLink (50-Gbaud chip-to-chip interconnect). These enable zero-overhead data movement and scalable resource orchestration across all eight C66x cores.
Its Network Coprocessor contains two dedicated accelerators: a Packet Accelerator supporting 1.5 Mpackets/s wire-speed IPsec/GTP-U/SCTP/PDCP processing with L2–L4 classification, and a Security Accelerator delivering up to 2.8 Gbps encryption (AES/SHA/3DES/Kasumi/SNOW3G) for transport- and air-interface security protocols including 3GPP and WiMAX.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Count & Type | Eight independent C66x DSP cores, each capable of simultaneous fixed- and floating-point execution; enables true parallel signal processing across heterogeneous workloads. |
| Max Core Frequency | 1.4 GHz per core - delivers 11.2 GHz aggregate DSP compute, validated for sustained operation in extended temperature (–40°C to 100°C) industrial environments. |
| L1/L2 Memory per Core | 32 KB L1P + 32 KB L1D + 512 KB configurable L2 (RAM/cache); provides deterministic low-latency access for real-time kernel execution without external memory stalls. |
| Shared Memory | 4096 KB MSM SRAM with memory protection unit - acts as unified L2/L3 cache or scratchpad, accessible by all cores and accelerators without TeraNet contention. |
| DDR3 Interface | 64-bit DDR3-1600 with ECC support and 8 GB addressable space - enables high-bandwidth streaming of sensor data, video frames, or baseband samples with error resilience. |
| Network Coprocessor | Integrated packet + security acceleration: 1.5 Mpackets/s throughput and 2.8 Gbps crypto speed - offloads protocol stack processing from DSP cores to preserve compute cycles for algorithm execution. |
| Interconnect Bandwidth | HyperLink (50 Gbaud full-duplex) + SRIO 2.1 (5 GBaud/lane × 4 lanes) + PCIe Gen2 (5 GBaud/lane × 2 lanes) - supports multi-chip scalability and FPGA co-processing with sub-microsecond latency. |
Pinout & Package
The TMS320C6678AXCYP is housed in an 841-pin FC-BGA package (GYP suffix), measuring 35 mm × 35 mm with 0.8 mm pitch. It features 16 GPIOs, dual SGMII ports, four SRIO lanes, two PCIe lanes, HyperLink differential pairs, DDR3 address/control/data buses, and dedicated JTAG/debug interfaces.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKIN_0 / CLKIN_1 | Main PLL reference input | Differential clock inputs accepting 10–100 MHz crystal or oscillator; used to generate internal SYSCLK, DDR3CLK, and PASSCLK domains. |
| DDR3_A[15:0] / DDR3_BA[2:0] | DDR3 address & bank select | 16-bit address bus + 3-bit bank address for 8 GB DDR3-1600 space; requires matched-length routing and on-die termination control. |
| DDR3_DQ[63:0] | DDR3 bidirectional data | 64-bit data bus with per-byte DQS strobes; supports burst transfers at 1600 MT/s with ECC parity bits embedded in DQ[7:0]. |
| SRIO_TX[3:0]_P/N | Serial RapidIO 2.1 transmit | Four differential lane transmitters supporting 1.24/2.5/3.125/5 GBaud; configured for direct I/O or message passing in wireless infrastructure backhaul links. |
| HYPERLINK_TX[7:0]_P/N | HyperLink transmit | Eight differential transmitter pairs enabling 50-Gbaud chip-to-chip interconnect; used for scaling KeyStone-based systems beyond single-die limits. |
Key Features
| Feature | Design Value |
|---|---|
| Backward Code Compatibility | Fully compatible with C6000 family assembly and C code - allows reuse of legacy radar, telecom, and imaging algorithms without porting effort. |
| Multicore Navigator | Hardware-accelerated queue manager with 8192 queues and packet-based DMA - eliminates software overhead in task dispatch and inter-core data transfer. |
| Memory Protection Unit | Enforces access rights across MSM SRAM and DDR3_EMIF - prevents core-level corruption and enables secure partitioning of real-time OS tasks and bare-metal accelerators. |
| SmartReflex Power Management | Dynamic voltage and frequency scaling per core domain - reduces active power by up to 40% during variable-load processing (e.g., adaptive beamforming). |
| On-Chip Boot ROM | Contains configurable boot loader supporting I2C, SPI, EMIF16, PCIe, SRIO, HyperLink, and Ethernet - enables flexible field-upgradable system initialization without external PROM. |
Applications
| Radar Signal Processing | 5G Baseband Processing |
|---|---|
|
Use Scenario: Real-time pulse-Doppler and STAP processing on phased-array radar returns with >10 GSPS ADC input streams. IC Role / Device Role / Timing Role: Primary DSP engine executing FFT, CFAR, beamforming, and tracking kernels across all eight C66x cores with deterministic L2 cache coherency. Use Value: 44.8 GMAC/core at 1.4 GHz enables sub-millisecond latency for adaptive waveform generation and clutter cancellation in airborne radar systems. |
Use Scenario: Layer 1 PHY processing for massive MIMO 5G NR base stations, including channel estimation, precoding, and LDPC decoding. IC Role / Device Role / Timing Role: Baseband processor handling parallel OFDM symbol chains, synchronized via TeraNet and Multicore Navigator for inter-core FFT and MIMO matrix ops. Use Value: Integrated Packet Accelerator offloads MAC-layer header parsing and CRC, freeing 2+ cores for computationally intensive LDPC decoding at 10+ Gbps throughput. |
| Medical Imaging Reconstruction | Real-Time Video Analytics |
|
Use Scenario: Iterative reconstruction of CT/MRI volumes from raw k-space or projection data using compressed sensing and deep learning inference. IC Role / Device Role / Timing Role: High-precision floating-point accelerator running conjugate gradient solvers and CNN inference kernels with IEEE754 compliance across all cores. Use Value: 22.4 GFLOP/core at 1.4 GHz delivers >175 GFLOPS peak for iterative reconstruction, reducing scan-to-diagnosis time by >60% versus dual-C66x solutions. |
Use Scenario: Edge-based object detection, pose estimation, and behavior classification on 4K@60fps surveillance video streams. IC Role / Device Role / Timing Role: Vision coprocessor feeding H.264/H.265 decode output into custom CNN pipelines, leveraging MSM SRAM for frame buffering and weight caching. Use Value: 4 MB on-chip MSM SRAM eliminates DDR3 bottlenecks during multi-stream inference, sustaining >30 FPS for ResNet-50 on eight concurrent HD video feeds. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multicore DSP applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMS320C6670AYZHA | Quad-core C66x @ 1.25 GHz; no Network Coprocessor; 1 MB MSM SRAM; 32-bit DDR3-1333 | Lower compute density and no packet/security acceleration - suitable for cost-sensitive radar front-end or audio DSP where full 8-core bandwidth is unnecessary. | Select when system-level throughput requirements are ≤50% of TMS320C6678AXCYP and inter-chip networking is handled externally. |
| TI AM5728 | ARM Cortex-A15 + C66x dual-core; heterogeneous SoC; integrated PRU-ICSS; no MSM SRAM; LPDDR2 interface | Targets Linux-based multimedia gateways and industrial HMIs - lacks deterministic DSP compute isolation and hardware queue management for hard real-time signal processing. | Choose for applications requiring rich OS support, GUI, and peripheral integration over pure DSP throughput and accelerator offload. |
Compared with TMS320C6678AXCYP, the TMS320C6670AYZHA trades core count and accelerators for lower power and BOM cost, while the AM5728 shifts focus from DSP-centric signal flow to ARM-driven system control - making TMS320C6678AXCYP uniquely suited for latency-critical, compute-bound, and protocol-aware signal infrastructure.
Availability
TMS320C6678AXCYP is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband development, medical imaging reconstruction, and real-time video analytics requiring stable component supply across extended temperature and long-lifecycle deployments.
Supply support for TMS320C6678AXCYP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and digital signal technologies, with decades of heritage in high-performance DSP innovation.
The TMS320C6678AXCYP belongs to TI's KeyStone multicore DSP product line, engineered for mission-critical signal infrastructure demanding deterministic parallel processing, hardware-accelerated networking, and scalable inter-chip communication in aerospace, defense, and telecom equipment.
FAQ
What is the maximum operating frequency of the TMS320C6678AXCYP?
The TMS320C6678AXCYP operates at up to 1.4 GHz per core under extended temperature conditions (–40°C to 100°C), as validated in the SPRS691E datasheet revision. This frequency enables 44.8 GMAC/core (fixed-point) and 22.4 GFLOP/core (floating-point) performance, with all eight cores functional simultaneously. The AXCYP variant is specifically rated for this speed grade in the GYP package.
Does the TMS320C6678AXCYP include hardware accelerators for networking protocols?
Yes, the TMS320C6678AXCYP integrates a dedicated Network Coprocessor comprising two units: a Packet Accelerator supporting wire-speed IPsec, GTP-U, SCTP, and PDCP at 1.5 Mpackets/s, and a Security Accelerator delivering up to 2.8 Gbps encryption for AES, SHA, Kasumi, and SNOW3G. These operate independently of the C66x cores and are confirmed for the TMS320C6678AXCYP in the device's functional block diagram and feature list.
What memory resources are available on the TMS320C6678AXCYP?
The TMS320C6678AXCYP provides 32 KB L1P, 32 KB L1D, and 512 KB configurable L2 memory per core, plus 4096 KB of shared MSM SRAM accessible by all eight cores and accelerators. It also supports an external 64-bit DDR3-1600 interface with ECC, enabling up to 8 GB of addressable memory - all explicitly specified for the TMS320C6678AXCYP in Section 1.1 and Figure 1-1 of SPRS691E.
Is the TMS320C6678AXCYP pin-compatible with other C6678 variants?
Yes, the TMS320C6678AXCYP uses the same 841-pin GYP FC-BGA package as other C6678 speed grades (e.g., AY and AZ suffixes), with identical mechanical footprint, ball map, and thermal pad layout. Pin functions and electrical characteristics are consistent across the family, as confirmed in the "Package Terminals" and "Pin Map" sections (pages 39–43) of SPRS691E.
What development tools support the TMS320C6678AXCYP?
Texas Instruments provides full toolchain support for the TMS320C6678AXCYP, including the C6000 compiler, Code Generation Tools v8.x+, Code Composer Studio IDE v6+, and the TMDXEVM6678L evaluation module. Debugging is enabled via JTAG and SWD interfaces, and profiling leverages hardware trace and Advanced Event Triggering (AET) - all documented in Section 2.9 of SPRS691E and validated for the AXCYP variant.
TMS320C6678AXCYP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- TMS320C66x
- Package/Case:
- 841-BFBGA, FCBGA
- Packaging:
- Tube
- Product Status:
- Active
- Type:
- Fixed/Floating Point
- Interface:
- EBI/EMI, I2C, PCIe, SPI, TSIP, UART, 10/100/1000 Ethernet
- Clock Rate:
- 1GHz
- Non-Volatile Memory:
- ROM (128kB)
- On-Chip RAM:
- 8.5MB
- Voltage - I/O:
- 1.0V, 1.5V, 1.8V
- Voltage - Core:
- 1.00V
- Operating Temperature:
- 0°C ~ 85°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 841-FCBGA (24x24)
TMS320C6678AXCYP FAQ
1.How can I place an order for TMS320C6678AXCYP through Aetrix?
Please submit a Request for Quotation (RFQ) for TMS320C6678AXCYP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TMS320C6678AXCYP reliable?
The price and inventory of TMS320C6678AXCYP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMS320C6678AXCYP is usually 5 days.
3.What payment methods are accepted for TMS320C6678AXCYP?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMS320C6678AXCYP transactions.
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4.How is shipping managed for TMS320C6678AXCYP?
TMS320C6678AXCYP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TMS320C6678AXCYP order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TMS320C6678AXCYP?
For technical support, including TMS320C6678AXCYP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMS320C6678AXCYP requirements.
6.How does Aetrix verify that TMS320C6678AXCYP is sourced from the original manufacturer or authorized distributors?
All TMS320C6678AXCYP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMS320C6678AXCYP meets industry standards.
7.What is the process for return or replacement of TMS320C6678AXCYP?
All TMS320C6678AXCYP units undergo pre-shipment inspection (PSI). If there is an issue with TMS320C6678AXCYP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TMS320C6678AXCYP part is unused and in its original packaging.
Return procedure for TMS320C6678AXCYP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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