Texas Instruments TMS320C6678AXCYP25
- Part No.:
- TMS320C6678AXCYP25
- Manufacturer:
- Texas Instruments
- Category:
- DSP (Digital Signal Processors)
- Package:
- 841-BFBGA, FCBGA
- Datasheet:
-
TMS320C6678AXCYP25.pdf
- Description:
- IC DSP FIX/FLOAT POINT 841FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
TMS320C6678AXCYP25 from Texas Instruments is an eight-core fixed- and floating-point DSP based on the KeyStone multicore architecture, operating at up to 1.4 GHz per core with 44.8 GMAC/core and 22.4 GFLOP/core performance. It integrates 4 MB shared MSM SRAM, 64-bit DDR3-1600 interface, and hardware accelerators for packet processing and security. It serves in high-throughput communications infrastructure, such as wireless baseband processing and network packet inspection.
For engineers reviewing the TMS320C6678AXCYP25 datasheet, TMS320C6678AXCYP25 pinout, TMS320C6678AXCYP25 application, or TMS320C6678AXCYP25 equivalent, key selection criteria include per-core computational throughput, integrated Multicore Navigator queue depth (8192), network coprocessor encryption speed (up to 2.8 Gbps), HyperLink interconnect bandwidth (50 Gbaud), and DDR3 EMIF ECC support.
Technical Context
The TMS320C6678AXCYP25 implements TI's KeyStone architecture with four foundational elements: TeraNet non-blocking switch fabric, Multicore Navigator for hardware-accelerated task dispatch across 8192 queues, Multicore Shared Memory Controller (MSMC) managing 4 MB shared SRAM with memory protection, and HyperLink for chip-to-chip interconnect at 50 Gbaud. Its C66x cores are IEEE 754-compliant and execute 8 single-precision floating-point MACs per cycle.
Hardware acceleration is distributed across dedicated subsystems: Network Coprocessor includes Packet Accelerator (1.5 Mpackets/s wire-speed) and Security Accelerator (AES/SHA/3DES/GCM up to 2.8 Gbps), while peripherals include PCIe Gen2 (2-lane), SRIO 2.1 (4-lane), dual SGMII Ethernet switch, and TSIP supporting 1024 DS0s. All eight cores share coherent L2 resources via MSMC and access external memory through a 64-bit DDR3-1600 interface with ECC.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Count & Speed | Eight C66x DSP cores, each configurable up to 1.4 GHz - enables parallel real-time signal processing across heterogeneous workloads. |
| Computational Performance | 44.8 GMAC/core (fixed-point) and 22.4 GFLOP/core (floating-point) @ 1.4 GHz - delivers 11.2 GHz aggregate DSP compute for radar, beamforming, or media transcoding. |
| On-Chip Memory | 32 KB L1P + 32 KB L1D + 512 KB L2 per core, plus 4096 KB MSM SRAM shared across all cores - supports low-latency inter-core data exchange without bus contention. |
| Memory Interface | 64-bit DDR3-1600 EMIF with ECC support and 8 GB addressable space - ensures reliable high-bandwidth access to external frame buffers or packet buffers. |
| Hardware Accelerators | Packet Accelerator (1.5 Mpackets/s) and Security Accelerator (2.8 Gbps encryption) - offloads L2–L4 classification, IPsec, RoHC, and ciphering from CPU cores. |
| High-Speed I/O | SRIO 2.1 (4 lanes, up to 5 GBaud/lane), PCIe Gen2 (2-lane), HyperLink (50 Gbaud full-duplex), dual SGMII - enables scalable system-level integration with FPGAs, ASICs, or other KeyStone devices. |
| Temperature Range | Commercial grade: 0°C to 85°C - validated for deployment in telecom equipment, industrial controllers, and video analytics edge appliances. |
Pinout & Package
The TMS320C6678AXCYP25 is housed in an 841-pin FC-BGA package (package code: CYP), measuring 35 mm × 35 mm with 0.8 mm pitch. Pin assignment follows quadrant-based layout (A–D) as documented in SPRS691E Figure 2-11 through 2-16.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKIN | Reference clock input | Accepts differential 100 MHz crystal or LVDS source for MAIN PLL synchronization; required for deterministic boot and timing-critical accelerator operation. |
| DDR3_DQ[63:0] | Data bus for DDR3 interface | 64-bit bidirectional data path supporting DDR3-1600 (800 MHz clock); requires matched-length routing and on-die termination calibration. |
| SRIO_LN[3:0]_TX/RX_P/N | Serial RapidIO 2.1 differential lanes | Four independent 5 GBaud differential pairs enabling non-coherent cache coherency protocols and direct memory access between peer DSPs or FPGAs. |
| HYPERLINK_TX/RX_P/N | HyperLink differential interface | Full-duplex 50 Gbaud interconnect supporting chip-to-chip resource pooling; used for transparent task migration across KeyStone SoCs. |
| SGMII0/1_RX/TX_P/N | Gigabit Ethernet physical layer interface | Dual SGMII lanes driving integrated Ethernet switch; supports 10/100/1000 Mbps with IEEE 802.3 compliance and auto-negotiation. |
| TSIP_CLK/FS/DATA[15:0] | Telecom Serial Interface Port | 16-bit parallel TSIP interface supporting 1024 DS0 channels at 32.768 Mbps - targets TDM backhaul and legacy circuit-switched infrastructure. |
Key Features
| Feature | Design Value |
|---|---|
| Multicore Navigator with 8192 queues | Enables zero-overhead packet-based DMA and hardware-managed task distribution across eight C66x cores - eliminates software scheduler bottlenecks in real-time networking stacks. |
| Integrated Network Coprocessor | Offloads L2–L4 packet classification, checksum insertion/verification, QoS tagging, and IPsec/GTP-U/SCTP protocol handling - reduces CPU load by >70% in LTE/EPC gateway applications. |
| Backward code compatibility with C6000 family | Allows reuse of legacy C64x+/C67x firmware and toolchains - shortens time-to-market for upgrades from older TI DSP platforms. |
| Memory Protection Unit (MPU) | Provides per-core and shared-memory access control for both MSM SRAM and DDR3_EMIF - enforces isolation between safety-critical and non-critical firmware partitions. |
| Three on-chip PLLs (MAIN/DDR3/PASS) | Independent clock domains for CPU, memory, and accelerators - enables dynamic frequency scaling and power gating without system-wide clock stalls. |
Applications
| Wireless Baseband Processing | Network Packet Inspection |
|---|---|
Use Scenario: Real-time LTE-Advanced and 5G NR physical layer (PHY) processing including FFT, channel estimation, and LDPC decoding. IC Role / Device Role / Timing Role: Primary baseband processor executing time-critical DSP kernels across eight C66x cores with deterministic latency enforced by TeraNet and MSMC. Use Value: Delivers 11.2 GHz cumulative compute and hardware-accelerated FFT engines - meets sub-1ms PHY frame timing requirements in macrocell and massive MIMO systems. | Use Scenario: Deep packet inspection (DPI) and encrypted traffic analysis in carrier-grade firewalls and policy enforcement points. IC Role / Device Role / Timing Role: Offloads TCP/IP stack parsing, TLS decryption, and signature matching from host CPU using Network Coprocessor and Security Accelerator. Use Value: Processes 1.5 million packets/sec at wire speed with <5 µs per-packet latency - sustains 1 Gbps encrypted throughput without CPU intervention. |
| Video Analytics Edge Node | Industrial Radar Signal Processing |
Use Scenario: Multi-stream 4K video encoding, object detection, and metadata extraction in smart city surveillance gateways. IC Role / Device Role / Timing Role: Heterogeneous workload distributor: C66x cores handle motion estimation and CNN inference, while EDMA3 and Multicore Navigator manage frame buffering and pipeline synchronization. Use Value: Integrates 4 MB on-chip MSM SRAM and DDR3-1600 interface - eliminates external DRAM bottlenecks during concurrent encode/inference operations. | Use Scenario: FMCW radar signal processing for automotive ADAS and industrial level sensing, including range-Doppler FFT and CFAR detection. IC Role / Device Role / Timing Role: High-precision floating-point accelerator executing complex-valued FFTs and beamforming algorithms with IEEE 754 compliance. Use Value: Achieves 22.4 GFLOP/core @ 1.4 GHz - resolves microsecond-level chirp timing and supports real-time SAR imaging at >30 fps. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multicore DSP applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMS320C6670AYZHA2 | Quad-core C66x @ 1.25 GHz; no Network Coprocessor; 1 MB MSM SRAM; PCIe Gen2 (1-lane only) | Lacks packet and security acceleration; suitable for compute-bound but non-networked DSP tasks like audio coding or motor control | Select when lower cost, reduced thermal envelope, and absence of networking offload justify halving core count and memory. |
| TMS320C6678AYCYP25 | Same 8-core C66x architecture and pinout; differs only in temperature grade (–40°C to 100°C extended vs. 0°C to 85°C commercial) | Identical functionality and register compatibility; validated for harsher environmental conditions | Choose for industrial or outdoor telecom deployments requiring extended temperature operation without design change. |
Compared with TMS320C6670AYZHA2, the TMS320C6678AXCYP25 provides double core count, integrated network acceleration, and 4× shared SRAM - making it essential for packet-forwarding and multi-standard wireless baseband. Versus TMS320C6678AYCYP25, it trades extended temperature support for commercial-grade cost and power optimization.
Availability
TMS320C6678AXCYP25 is available at Aetrix Electronics and suitable for wireless infrastructure, industrial radar, video analytics, and telecom test equipment requiring stable component supply over extended production lifecycles.
Supply support for TMS320C6678AXCYP25 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog and embedded processing solutions for industrial, automotive, and communications markets since 1930.
The TMS320C6678AXCYP25 belongs to TI's C6000 DSP product line, engineered specifically for high-performance, deterministic signal processing in mission-critical communications and real-time embedded systems.
FAQ
What is the maximum operating frequency of each C66x core in the TMS320C6678AXCYP25?
The TMS320C6678AXCYP25 supports a maximum core frequency of 1.4 GHz per C66x DSP core, as confirmed in SPRS691E revision March 2014. This frequency is achievable under recommended operating conditions (CVDD = 1.05 V, junction temperature ≤ 85°C). The device also supports 1.0 GHz and 1.25 GHz configurations for power-optimized operation. All frequency modes are factory-configured and verified during production test.
Does the TMS320C6678AXCYP25 include hardware support for error correction on external DDR3 memory?
Yes, the TMS320C6678AXCYP25 includes full ECC (Error Correction Code) support for its 64-bit DDR3-1600 external memory interface. The DDR3 controller implements SEC-DED (Single Error Correction, Double Error Detection) logic, protecting against bit flips in DRAM arrays. This capability is enabled via configuration registers in the DDR3 memory controller module and is mandatory for safety-critical applications such as medical imaging or avionics processing where data integrity is paramount.
How many hardware queues does the Multicore Navigator provide in the TMS320C6678AXCYP25?
The Multicore Navigator in the TMS320C6678AXCYP25 provides exactly 8192 multipurpose hardware queues managed by the Queue Manager. These queues support packet-based DMA, inter-core messaging, and task dispatch with zero-software-overhead transfers. Each queue can be independently configured for priority, depth, and ownership - enabling fine-grained resource allocation across the eight C66x cores and accelerators.
Is the TMS320C6678AXCYP25 pin-compatible with other members of the C6678 family?
Yes, the TMS320C6678AXCYP25 shares identical pinout and package (841-pin CYP FC-BGA) with all other TMS320C6678 variants, including TMS320C6678AYCYP25 and TMS320C6678AZCYP25. Differences between these variants are limited to temperature grade, voltage tolerance, and screening - not electrical or mechanical interface. PCB designs targeting one C6678 variant can accommodate any other C6678 part without layout modification.
What development tools are officially supported for the TMS320C6678AXCYP25?
Texas Instruments officially supports the C6000 Code Generation Tools suite for the TMS320C6678AXCYP25, including the TI C6000 Optimizing C/C++ Compiler, Code Composer Studio v5.x IDE, and DSP/BIOS real-time kernel. Evaluation is enabled via the TMDXEVM6678L EVM, which provides JTAG debugging, DDR3 memory, SGMII Ethernet, and SRIO connectivity. TI also provides the KeyStone Software Development Kit (SDK) with drivers, IPC middleware, and example applications tailored to the TMS320C6678AXCYP25 architecture.
TMS320C6678AXCYP25 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- TMS320C66x
- Package/Case:
- 841-BFBGA, FCBGA
- Packaging:
- Tube
- Product Status:
- Active
- Type:
- Fixed/Floating Point
- Interface:
- EBI/EMI, I2C, PCIe, SPI, TSIP, UART, 10/100/1000 Ethernet
- Clock Rate:
- 1.25GHz
- Non-Volatile Memory:
- ROM (128kB)
- On-Chip RAM:
- 8.5MB
- Voltage - I/O:
- 1.0V, 1.5V, 1.8V
- Voltage - Core:
- 1.00V
- Operating Temperature:
- 0°C ~ 85°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 841-FCBGA (24x24)
TMS320C6678AXCYP25 FAQ
1.How can I place an order for TMS320C6678AXCYP25 through Aetrix?
Please submit a Request for Quotation (RFQ) for TMS320C6678AXCYP25 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TMS320C6678AXCYP25 reliable?
The price and inventory of TMS320C6678AXCYP25 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMS320C6678AXCYP25 is usually 5 days.
3.What payment methods are accepted for TMS320C6678AXCYP25?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMS320C6678AXCYP25 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TMS320C6678AXCYP25?
TMS320C6678AXCYP25 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TMS320C6678AXCYP25 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TMS320C6678AXCYP25?
For technical support, including TMS320C6678AXCYP25 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMS320C6678AXCYP25 requirements.
6.How does Aetrix verify that TMS320C6678AXCYP25 is sourced from the original manufacturer or authorized distributors?
All TMS320C6678AXCYP25 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMS320C6678AXCYP25 meets industry standards.
7.What is the process for return or replacement of TMS320C6678AXCYP25?
All TMS320C6678AXCYP25 units undergo pre-shipment inspection (PSI). If there is an issue with TMS320C6678AXCYP25, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TMS320C6678AXCYP25 part is unused and in its original packaging.
Return procedure for TMS320C6678AXCYP25:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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