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Texas Instruments TMS320C6678CYP25
- Part No.:
- TMS320C6678CYP25
- Manufacturer:
- Texas Instruments
- Category:
- DSP (Digital Signal Processors)
- Package:
- 841-BFBGA, FCBGA
- Datasheet:
-
TMS320C6678CYP25.pdf
- Description:
- IC DSP FIX/FLOAT POINT 841FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,442
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Product details
Overview
TMS320C6678CYP25 from Texas Instruments is an eight-core fixed- and floating-point DSP based on the KeyStone multicore architecture, operating at up to 1.4 GHz per core with 44.8 GMAC/core (fixed-point) and 22.4 GFLOP/core (floating-point). It integrates 4 MB shared MSM SRAM, 64-bit DDR3-1600 interface, and hardware accelerators for packet processing and security. It serves in high-throughput signal processing pipelines for radar, baseband processing, and media infrastructure.
For engineers reviewing the TMS320C6678CYP25 datasheet, TMS320C6678CYP25 pinout, TMS320C6678CYP25 application, or TMS320C6678CYP25 equivalent, key selection criteria include per-core computational throughput, MSM memory bandwidth allocation, HyperLink inter-chip scalability, and network coprocessor support for L2–L4 packet acceleration in real-time communications systems.
Technical Context
The TMS320C6678CYP25 implements eight independent C66x CorePacs, each with 32 KB L1P, 32 KB L1D, and 512 KB configurable L2 memory, all backed by ECC protection. Its Multicore Shared Memory Controller (MSMC) provides non-blocking access to 4096 KB of shared MSM SRAM and manages DDR3-1600 EMIF with ECC support.
Hardware acceleration is distributed across three domains: Multicore Navigator manages 8192 queues and zero-overhead packet-based DMA; Network Coprocessor delivers 1.5 Mpackets/s wire-speed packet acceleration and 2.8 Gbps encryption via Security Accelerator; TeraNet switch fabric enables 2-Tbps internal bandwidth with full resource arbitration between cores, peripherals, and accelerators.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Count & Type | 8 × C66x DSP cores, each capable of simultaneous fixed- and floating-point execution |
| Max Core Frequency | 1.4 GHz - enables 44.8 GMAC/core (fixed) and 22.4 GFLOP/core (floating) sustained compute |
| On-Chip Memory | 32 KB L1P + 32 KB L1D + 512 KB L2 per core; 4096 KB shared MSM SRAM with memory protection |
| External Memory Interface | 64-bit DDR3-1600 EMIF supporting up to 8 GB addressable space with ECC DRAM support |
| Interconnect Bandwidth | HyperLink: 50 Gbaud full-duplex chip-to-chip; TeraNet: 2-Tbps non-blocking internal switch fabric |
| Accelerated Functions | Packet Accelerator: 1.5 Mpackets/s L2–L4 classification; Security Accelerator: AES/SHA/3DES/GCM up to 2.8 Gbps |
| High-Speed I/O | 4-lane SRIO 2.1 (5 GBaud), PCIe Gen2 (2-lane), dual SGMII GbE, TSIP (1024 DS0s) |
Pinout & Package
The TMS320C6678CYP25 uses an 841-pin FCCSP (Fine-Pitch Chip-Scale Package) with 0.8 mm pitch, thermally enhanced for high-power multicore operation in industrial and telecom environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_CORE | Core power supply | 1.0 V ±3% supply for all eight C66x cores and L1/L2 caches; requires tight regulation and local decoupling |
| VDD_MSM | Shared memory power | 1.2 V supply dedicated to 4 MB MSM SRAM; isolated from core and I/O domains for noise immunity |
| VDD_DDR | DDR3 interface power | 1.5 V supply for 64-bit DDR3-1600 EMIF; supports termination and drive strength matching per JEDEC spec |
| CLKIN | Reference clock input | Differential 100 MHz input for MAIN PLL; used to derive all internal clocks including core, DDR3, and PASS PLLs |
| HYPERLINK[15:0] | Chip-to-chip interconnect | 16-bit bidirectional differential bus supporting 50 Gbaud full-duplex; enables transparent resource pooling across KeyStone devices |
| SRIO[3:0]_TX/RX | RapidIO physical layer | Four independent 5 GBaud differential lanes; supports direct I/O, message passing, and configurable link topologies (1×, 2×, 4×) |
Key Features
| Feature | Design Value |
|---|---|
| Backward Software Compatibility | Fully code-compatible with prior C6000 DSP families - enables reuse of legacy algorithms and toolchains without recompilation |
| Memory Protection Unit (MPU) | Enforces access control for both MSM SRAM and DDR3_EMIF - prevents unintended cross-core memory corruption in safety-critical tasks |
| Multicore Navigator Queues | 8192 hardware-managed queues enable deterministic task dispatching and zero-software-overhead data movement between cores and peripherals |
| Network Coprocessor Offload | Offloads L2–L4 packet classification, checksum, QoS, and crypto operations - frees all eight DSP cores for application-layer signal processing |
| SmartReflex Power Management | Dynamic voltage and frequency scaling per core domain - reduces active power by up to 30% under partial-load conditions |
Applications
| Radar Signal Processing | Wireless Baseband Processing |
|---|---|
Use Scenario: Real-time beamforming, pulse-Doppler FFT, and CFAR detection in phased-array radar systems. IC Role / Device Role / Timing Role: Primary compute engine executing parallelized DSP kernels across all eight C66x cores with synchronized access to shared MSM memory for intermediate results. Use Value: 11.2 GHz aggregate compute (8 × 1.4 GHz) and 2-Tbps TeraNet bandwidth ensure sub-millisecond latency for multi-channel SAR imaging pipelines. | Use Scenario: LTE-Advanced and 5G NR physical layer processing including channel estimation, MIMO decoding, and LDPC/FEC acceleration. IC Role / Device Role / Timing Role: Baseband processor handling symbol-level computation with packet accelerator offloading MAC/RLC layer functions and security engine encrypting user-plane traffic. Use Value: Hardware-accelerated 1.5 Mpackets/s throughput and 2.8 Gbps encryption eliminate bottlenecks in high-density small-cell deployments. |
| Media Infrastructure Transcoding | Industrial Vision Analytics |
Use Scenario: Multi-stream 4K video ingest, HEVC/H.264 decode, AI-enhanced upscaling, and IP multicast distribution in broadcast headends. IC Role / Device Role / Timing Role: Heterogeneous workload distributor - cores handle codec pipelines while Network Coprocessor manages RTP/RTCP packetization and QoS tagging. Use Value: Dual SGMII GbE ports + integrated Ethernet switch enable direct 10/100/1000 Mbps streaming without external PHY or switch IC. | Use Scenario: Real-time defect detection, OCR, and thermal anomaly analysis on high-resolution factory-floor camera feeds. IC Role / Device Role / Timing Role: Edge inference accelerator running optimized CNN kernels on C66x VLIW architecture with DMA-driven frame buffering from TSIP or EMIF16 interfaces. Use Value: 1024 DS0-capable TSIP and 16-bit EMIF allow direct connection to legacy machine vision sensors and PLC I/O modules. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multicore DSP applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMS320C6670ACYPA | Quad-core variant (4 × C66x @ 1.25 GHz); no Network Coprocessor; 1 MB MSM SRAM | Lacks packet acceleration and security offload - suitable only for compute-bound, non-networked DSP tasks | Select when system-level packet handling is implemented externally and total compute demand is ≤50% of TMS320C6678CYP25 capacity |
| TMS320C6657CZHA | Dual-core C66x @ 1.25 GHz; includes basic packet accelerator (no security engine); 128 KB MSM SRAM | Targeted at cost-sensitive, lower-throughput edge nodes - lacks HyperLink, full DDR3 EMIF, and MSM scalability | Choose for compact, low-power embedded DSP where inter-chip scalability and full L2–L4 acceleration are unnecessary |
Compared with TMS320C6678CYP25, the C6670 offers reduced core count and no network acceleration, making it less suitable for scalable infrastructure; the C6657 trades raw performance and memory for footprint and cost, limiting use to single-node edge analytics rather than clustered signal processing systems.
Availability
TMS320C6678CYP25 is available at Aetrix Electronics and suitable for radar signal processing, wireless baseband infrastructure, and industrial vision analytics requiring stable component supply across extended temperature ranges (–40°C to 100°C).
Supply support for TMS320C6678CYP25 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and digital signal technologies with over 50 years of innovation in high-reliability, high-performance silicon.
The TMS320C6678CYP25 belongs to TI's KeyStone multicore DSP product line, engineered for mission-critical, high-throughput signal processing in communications infrastructure, defense electronics, and industrial automation where deterministic latency and hardware-accelerated data movement are essential.
FAQ
What is the maximum operating frequency of the TMS320C6678CYP25?
The TMS320C6678CYP25 operates at up to 1.4 GHz per core, delivering 44.8 GMAC/core for fixed-point and 22.4 GFLOP/core for floating-point computation. This frequency is validated under extended temperature conditions (–40°C to 100°C) with appropriate thermal design and power delivery. The TMS320C6678CYP25 achieves this speed using TI's C66x core architecture with enhanced VLIW and SIMD execution units.
Does the TMS320C6678CYP25 support DDR3 memory with error correction?
Yes, the TMS320C6678CYP25 includes a 64-bit DDR3-1600 EMIF with full ECC DRAM support. It implements single-bit error correction and double-bit error detection per 64-bit word, protecting both application data and instruction fetches from memory-induced faults. This capability is integral to the TMS320C6678CYP25's suitability for safety-critical and high-availability systems.
How many hardware queues does the Multicore Navigator in the TMS320C6678CYP25 support?
The Multicore Navigator in the TMS320C6678CYP25 supports exactly 8192 multipurpose hardware queues managed by a dedicated Queue Manager. These queues enable zero-software-overhead task dispatching and packet-based DMA transfers across all eight C66x cores, peripherals, and accelerators - a defining feature of the TMS320C6678CYP25's deterministic real-time behavior.
Is the TMS320C6678CYP25 pin-compatible with other C6678 variants like the CYP or CYPA packages?
No, the TMS320C6678CYP25 is not pin-compatible with other C6678 package variants such as CYPA or CYP. While all share the same 841-pin FCCSP footprint, the CYP25 variant implements specific power and thermal enhancements, including revised VDD_CORE/VDD_MSM pin assignments and additional thermal vias - requiring unique PCB layout and decoupling design. Always consult the TMS320C6678CYP25-specific pin map before migration.
What development tools are supported for the TMS320C6678CYP25?
The TMS320C6678CYP25 is supported by TI's C6000 Code Generation Tools v8.x+, Code Composer Studio IDE v10+, and the C66x Optimizing C Compiler. Debugging leverages JTAG IEEE 1149.1 with advanced event triggering (AET) and real-time trace. Evaluation is enabled via the TMDXEVM6678L EVM, which provides full access to all I/O including HyperLink, SRIO, and DDR3 interfaces - critical for validating TMS320C6678CYP25 system integration.
TMS320C6678CYP25 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- TMS320C66x
- Package/Case:
- 841-BFBGA, FCBGA
- Packaging:
- Tube
- Product Status:
- Discontinued at Digi-Key
- Type:
- Fixed/Floating Point
- Interface:
- EBI/EMI, I2C, PCIe, SPI, TSIP, UART, 10/100/1000 Ethernet
- Clock Rate:
- 1.25GHz
- Non-Volatile Memory:
- ROM (128kB)
- On-Chip RAM:
- 8.5MB
- Voltage - I/O:
- 1.0V, 1.5V, 1.8V
- Voltage - Core:
- 1.00V
- Operating Temperature:
- 0°C ~ 85°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 841-FCBGA (24x24)
TMS320C6678CYP25 FAQ
1.How can I place an order for TMS320C6678CYP25 through Aetrix?
Please submit a Request for Quotation (RFQ) for TMS320C6678CYP25 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TMS320C6678CYP25 reliable?
The price and inventory of TMS320C6678CYP25 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMS320C6678CYP25 is usually 5 days.
3.What payment methods are accepted for TMS320C6678CYP25?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMS320C6678CYP25 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TMS320C6678CYP25?
TMS320C6678CYP25 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TMS320C6678CYP25 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TMS320C6678CYP25?
For technical support, including TMS320C6678CYP25 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMS320C6678CYP25 requirements.
6.How does Aetrix verify that TMS320C6678CYP25 is sourced from the original manufacturer or authorized distributors?
All TMS320C6678CYP25 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMS320C6678CYP25 meets industry standards.
7.What is the process for return or replacement of TMS320C6678CYP25?
All TMS320C6678CYP25 units undergo pre-shipment inspection (PSI). If there is an issue with TMS320C6678CYP25, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TMS320C6678CYP25 part is unused and in its original packaging.
Return procedure for TMS320C6678CYP25:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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