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Texas Instruments TMS320C6678XCYPA
- Part No.:
- TMS320C6678XCYPA
- Manufacturer:
- Texas Instruments
- Category:
- DSP (Digital Signal Processors)
- Package:
- 841-BFBGA, FCBGA
- Datasheet:
-
TMS320C6678XCYPA.pdf
- Description:
- IC DSP FIX/FLOAT POINT 841FCBGA
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
TMS320C6678XCYPA from Texas Instruments is an eight-core fixed- and floating-point digital signal processor based on the KeyStone multicore architecture, operating at up to 1.4 GHz per core with 44.8 GMAC/core (fixed-point) and 22.4 GFLOP/core (floating-point). It integrates 4 MB shared MSM SRAM, a 64-bit DDR3-1600 interface, and hardware accelerators for packet processing and security. It serves as the computational engine in high-throughput communications infrastructure and real-time media processing systems.
For engineers reviewing the TMS320C6678XCYPA datasheet, TMS320C6678XCYPA pinout, TMS320C6678XCYPA application, or TMS320C6678XCYPA equivalent, key selection criteria include per-core compute density, integrated network coprocessor throughput (1.5 Mpackets/s), MSM memory coherency support, and compatibility with TI's C6000 software ecosystem and KeyStone development tools.
Technical Context
The TMS320C6678XCYPA implements eight independent C66x DSP CorePacs, each with dedicated 32 KB L1P, 32 KB L1D, and 512 KB configurable L2 memory. All cores share a 4096 KB MSM SRAM via the Multicore Shared Memory Controller (MSMC), which enforces memory protection for both MSM SRAM and DDR3_EMIF.
Its system-level interconnect comprises the non-blocking TeraNet switch fabric, Multicore Navigator with 8192 hardware queues and packet-based DMA, and HyperLink supporting 50 Gbaud chip-to-chip communication. The Network Coprocessor includes separate Packet Accelerator and Security Accelerator engines, enabling wire-speed IPsec/GTP-U/SCTP processing and up to 2.8 Gbps encryption throughput.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Count & Type | Eight C66x DSP cores, each capable of 1.4 GHz fixed/floating-point execution with IEEE 754 compliance and 90 new vector/math instructions. |
| Compute Performance | 44.8 GMAC/core @ 1.4 GHz (fixed-point); 22.4 GFLOP/core @ 1.4 GHz (single-precision floating-point). |
| On-Chip Memory | 32 KB L1P + 32 KB L1D per core; 512 KB L2 per core; 4096 KB shared MSM SRAM with ECC and memory protection. |
| External Memory Interface | 64-bit DDR3-1600 EMIF supporting 8 GB addressable space with ECC DRAM support. |
| High-Speed I/O | Four-lane SRIO 2.1 (up to 5 GBaud/lane), PCIe Gen2 (1–2 lanes), HyperLink (50 Gbaud full-duplex), dual SGMII GbE ports. |
| Accelerators | Packet Accelerator: 1.5 Mpackets/s L2–L4 classification, checksum, QoS; Security Accelerator: AES/SHA/DES/3DES/Kasumi/SNOW3G up to 2.8 Gbps. |
| Operating Temperature | Extended range: –40°C to +100°C; commercial range: 0°C to +85°C - validated for industrial and telecom base station environments. |
Pinout & Package
The TMS320C6678XCYPA is housed in a 841-pin FC-BGA package (package code: XCYPA), measuring 35 mm × 35 mm with 0.8 mm pitch and RoHS-compliant lead-free finish. Thermal design requires exposed thermal pad soldering to PCB ground plane.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKIN | Reference clock input | Accepts differential LVDS or single-ended CMOS clock (typically 100 MHz) for MAIN PLL synchronization. |
| DDR3_DQ[63:0] | Data bus | 64-bit bidirectional DDR3 data interface with on-die termination and per-byte DQS strobes for timing alignment. |
| SRIO_LANE[3:0]_N/P | Serial RapidIO physical layer | Differential pairs supporting 1.24/2.5/3.125/5 GBaud per lane; configurable as 1×, 2×, or 4× links. |
| PCIe_RX/TX_N/P | PCIe Gen2 physical interface | Differential receiver/transmitter pair supporting 5 GT/s; configurable for x1 or x2 link width. |
| HYPERLINK_TX/RX_N/P | Chip-to-chip interconnect | Full-duplex 50-Gbaud differential interface enabling low-latency, high-bandwidth SoC clustering. |
| SGMII0/1_CLK/REF | Gigabit Ethernet PHY interface | Provides reference clocks and control signals for two independent SGMII PHYs supporting 10/100/1000 Mbps operation. |
Key Features
| Feature | Design Value |
|---|---|
| Backward Software Compatibility | Fully code-compatible with legacy C6000 fixed- and floating-point DSPs, enabling reuse of existing C64x+/C67x software assets without recompilation. |
| Hardware Task Dispatch | Multicore Navigator manages 8192 queues and performs zero-overhead packet-based DMA, eliminating CPU polling and reducing inter-core latency. |
| Integrated Network Offload | Network Coprocessor handles L2–L4 packet classification, checksum insertion/verification, and QoS tagging - freeing all eight DSP cores for application logic. |
| Memory Coherency Support | MSMC provides cache-coherent access to shared MSM SRAM and enforces memory protection across all eight cores and peripherals. |
| Security Acceleration | Dedicated Security Accelerator supports 20+ cryptographic algorithms (AES-GCM, SHA-256, HMAC-SHA1, Kasumi, SNOW3G) at up to 2.8 Gbps, offloading cipher operations from DSP cores. |
Applications
| Wireless Baseband Processing | Medical Imaging Reconstruction |
|---|---|
Use Scenario: Real-time LTE-Advanced and 5G NR physical layer processing including FFT, channel estimation, MIMO detection, and LDPC decoding in macrocell and small-cell base stations. IC Role / Device Role / Timing Role: Primary baseband processor executing time-critical PHY-layer kernels across eight C66x cores with deterministic latency via EDMA3 and Multicore Navigator. Use Value: Delivers 11.2 GHz aggregate DSP performance and hardware-accelerated packet routing to sustain >1 Gbps air-interface throughput with sub-100 µs scheduling latency. | Use Scenario: Parallel reconstruction of CT/MRI volumetric datasets using iterative algorithms (e.g., FBP, OSEM) requiring high-precision floating-point computation and large local memory bandwidth. IC Role / Device Role / Timing Role: High-throughput computational accelerator interfacing with FPGA-based acquisition front-end and DDR3-backed frame buffers. Use Value: 22.4 GFLOP/core floating-point capability and 512 KB L2 per core enable rapid convergence of reconstruction kernels; MSM SRAM reduces DDR3 bottlenecks during multi-slice processing. |
| Industrial Video Analytics Edge Node | Defense Radar Signal Processing |
Use Scenario: On-premise AI inference and multi-stream H.264/H.265 video analytics (object detection, motion tracking) deployed in factory-floor vision systems with strict thermal and power constraints. IC Role / Device Role / Timing Role: Embedded vision processor running OpenVX/DSP-optimized CNN inference pipelines while managing Gigabit Ethernet camera inputs and PCIe-connected storage. Use Value: Integrated GbE switch and packet accelerator enable direct camera stream ingestion and metadata tagging; eight cores allow concurrent encoding, analytics, and control tasks without external SoC. | Use Scenario: Pulse-Doppler radar beamforming, STAP, and CFAR processing in airborne and naval platforms where SWaP-C and real-time determinism are critical. IC Role / Device Role / Timing Role: Mission-critical signal processor executing time-synchronized, phase-coherent DSP chains across all eight cores with deterministic EDMA3 transfers and hardware timer synchronization. Use Value: TeraNet fabric ensures contention-free movement of radar IQ samples between cores and accelerators; extended temperature rating (–40°C to +100°C) supports harsh environmental deployment. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multicore DSP applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMS320C6670ACYPA | Four-core variant with identical C66x architecture, same package footprint, but half the compute density (5.6 GHz cumulative vs. 11.2 GHz) and 2 MB MSM SRAM. | Suitable for mid-tier wireless infrastructure or cost-sensitive imaging systems where full eight-core capacity is unnecessary. | Select when BOM cost reduction and lower power consumption (<12 W typical) outweigh peak throughput requirements. |
| TMS320C6657CZHA | Two-core C66x device in 361-pin BGA; lacks Network Coprocessor, HyperLink, and MSM SRAM; supports only DDR2 and PCIe x1. | Targeted at compact embedded DSP tasks (motor control, audio processing) without packet acceleration or chip-scale clustering needs. | Choose for space-constrained designs requiring C66x ISA compatibility but not multicore networking or large shared memory. |
Compared with TMS320C6670ACYPA and TMS320C6657CZHA, the TMS320C6678XCYPA delivers double the core count and integrated network acceleration - making it uniquely suited for scalable, high-throughput communications and real-time media infrastructure where hardware offload and inter-core coherence are mandatory.
Availability
TMS320C6678XCYPA is available at Aetrix Electronics and suitable for wireless infrastructure, medical imaging systems, and defense radar platforms requiring stable component supply, long-term lifecycle assurance, and traceable sourcing for safety-critical deployments.
Supply support for TMS320C6678XCYPA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 50 years of innovation in DSP and real-time signal processing solutions.
The TMS320C6678XCYPA belongs to TI's KeyStone multicore DSP product line, designed specifically for high-performance, low-latency signal processing in mission-critical communications, radar, and imaging systems demanding hardware-accelerated packet and security offload.
FAQ
What is the maximum operating frequency of the TMS320C6678XCYPA?
The TMS320C6678XCYPA operates at up to 1.4 GHz per C66x core, delivering 44.8 GMAC/core (fixed-point) and 22.4 GFLOP/core (floating-point) performance. This frequency is validated under extended temperature conditions (–40°C to +100°C) with appropriate thermal management and voltage regulation per TI's SPRS691E datasheet specifications.
Does the TMS320C6678XCYPA support backward compatibility with older C6000 DSP code?
Yes, the TMS320C6678XCYPA is fully backward code-compatible with TI's prior-generation C6000 fixed- and floating-point DSPs, including C64x+ and C67x devices. Existing assembly and C code can be reused without modification, significantly shortening software migration timelines for applications upgrading to the C66x architecture.
What memory interfaces does the TMS320C6678XCYPA provide?
The TMS320C6678XCYPA integrates 32 KB L1P and 32 KB L1D cache per core, 512 KB configurable L2 memory per core, and 4096 KB shared MSM SRAM. It also features a 64-bit DDR3-1600 external memory interface supporting 8 GB addressable space with ECC DRAM support and a 16-bit EMIF for legacy parallel memory expansion.
How does the Network Coprocessor in the TMS320C6678XCYPA improve system efficiency?
The Network Coprocessor in the TMS320C6678XCYPA consists of independent Packet and Security Accelerator engines. It offloads L2–L4 packet classification, checksum calculation, QoS tagging, and cryptographic operations (AES, SHA, Kasumi) from the eight DSP cores - reducing CPU load by up to 40% in packet-intensive applications like wireless baseband and secure media transport.
What development tools are supported for the TMS320C6678XCYPA?
Texas Instruments provides a complete toolchain for the TMS320C6678XCYPA, including the C6000 Code Generation Tools (C compiler, assembler, linker), Code Composer Studio IDE with multicore debug visibility, SYS/BIOS RTOS, and KeyStone-specific drivers and libraries. TI also offers the TMDXEVM6678L evaluation module for hardware validation and benchmarking.
TMS320C6678XCYPA Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- TMS320C66x
- Package/Case:
- 841-BFBGA, FCBGA
- Packaging:
- Tube
- Product Status:
- Discontinued at Digi-Key
- Type:
- Fixed/Floating Point
- Interface:
- EBI/EMI, I2C, PCIe, SPI, TSIP, UART, 10/100/1000 Ethernet
- Clock Rate:
- 1GHz
- Non-Volatile Memory:
- ROM (128kB)
- On-Chip RAM:
- 8.5MB
- Voltage - I/O:
- 1.0V, 1.5V, 1.8V
- Voltage - Core:
- 1.00V
- Operating Temperature:
- -40°C ~ 100°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 841-FCBGA (24x24)
TMS320C6678XCYPA FAQ
1.How can I place an order for TMS320C6678XCYPA through Aetrix?
Please submit a Request for Quotation (RFQ) for TMS320C6678XCYPA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TMS320C6678XCYPA reliable?
The price and inventory of TMS320C6678XCYPA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMS320C6678XCYPA is usually 5 days.
3.What payment methods are accepted for TMS320C6678XCYPA?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMS320C6678XCYPA transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TMS320C6678XCYPA?
TMS320C6678XCYPA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TMS320C6678XCYPA order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TMS320C6678XCYPA?
For technical support, including TMS320C6678XCYPA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMS320C6678XCYPA requirements.
6.How does Aetrix verify that TMS320C6678XCYPA is sourced from the original manufacturer or authorized distributors?
All TMS320C6678XCYPA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMS320C6678XCYPA meets industry standards.
7.What is the process for return or replacement of TMS320C6678XCYPA?
All TMS320C6678XCYPA units undergo pre-shipment inspection (PSI). If there is an issue with TMS320C6678XCYPA, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TMS320C6678XCYPA part is unused and in its original packaging.
Return procedure for TMS320C6678XCYPA:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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