Texas Instruments TMS320C6747DZKBA3
- Part No.:
- TMS320C6747DZKBA3
- Manufacturer:
- Texas Instruments
- Category:
- DSP (Digital Signal Processors)
- Package:
- 256-BGA
- Datasheet:
-
TMS320C6747DZKBA3.pdf
- Description:
- IC DSP FIX/FLOAT POINT 256BGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
TMS320C6747DZKBA3 from Texas Instruments is a fixed- and floating-point VLIW digital signal processor with a 456-MHz C674x core, 448KB on-chip RAM (32KB L1P, 32KB L1D, 256KB L2, +128KB shared), and integrated peripherals including USB 2.0 OTG, USB 1.1 OHCI host, 10/100 Ethernet MAC, LCD controller, and three McASPs - deployed in professional audio processing, networked A/V receivers, and automotive amplifier systems.
For engineers reviewing the TMS320C6747DZKBA3 datasheet, TMS320C6747DZKBA3 pinout, TMS320C6747DZKBA3 application, or TMS320C6747DZKBA3 equivalent, key selection considerations include its 256-ball PBGA (ZKB) package, 1.3-V core supply at 456 MHz, dual-USB capability (OTG + OHCI), real-time clock with 32-kHz oscillator, and PRUSS subsystem for offloading deterministic I/O tasks.
Technical Context
The TMS320C6747DZKBA3 implements a two-level cache hierarchy: 32KB L1P direct-mapped program cache, 32KB L1D 2-way set-associative data cache, and 256KB unified L2 RAM/cache configurable as mapped memory, cache, or hybrid - enabling deterministic DSP execution while supporting concurrent host access via dedicated 128KB shared RAM. Its C674x CPU executes up to 3648 MIPS and 2736 MFLOPS, with IEEE single- and double-precision floating-point support, mixed-precision multiply, and hardware-accelerated reciprocal/square-root approximation.
Peripheral integration includes EMAC with RMII and MDIO, three McASPs supporting TDM/I²S/DIT, eHRPWM/eCAP/eQEP modules for motor control, and a programmable PRUSS with two 32-bit RISC cores (4KB IRAM + 512B DRAM each) - all managed under a unified power/sleep controller with clock gating and PSC domains. The device supports boot from NAND, NOR, SPI flash, or UART, with JTAG debug and AET trace support.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | C674x VLIW DSP - superset of C64x+/C67x+ ISAs, enabling legacy code reuse and high-throughput signal processing. |
| Max Clock Frequency | 456 MHz at 1.3-V core supply - delivers 2736 MFLOPS for real-time floating-point audio algorithms. |
| On-Chip Memory | 448KB RAM: 32KB L1P, 32KB L1D, 256KB L2, +128KB shared - eliminates external RAM dependency for compact audio systems. |
| USB Interfaces | USB 2.0 OTG (high/full-speed device/host) + USB 1.1 OHCI host (full-speed) - enables dual-role connectivity without external transceivers. |
| Audio Peripherals | 3× McASP with FIFO, 6 clock zones, 28 serial pins - supports multi-channel I²S/TDM streaming to DACs, codecs, and digital amps. |
| Real-Time Subsystem | PRUSS with two independent 32-bit RISC cores - handles time-critical I/O (e.g., PWM sync, GPIO event capture) offloaded from DSP core. |
| Package & Thermal | 256-ball PBGA (ZKB), 17 mm × 17 mm, 1.0-mm pitch - industrial-grade thermal profile suitable for convection-cooled audio enclosures. |
Pinout & Package
256-ball Pb-free plastic ball grid array (PBGA) package with 1.0-mm ball pitch, 17.0 mm × 17.0 mm body size, and thermal pad for enhanced heat dissipation in audio amplifier applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_CVDD | Core Power Supply | 1.3-V regulated input powering C674x CPU and L1/L2 caches - requires low-noise regulation for jitter-sensitive audio processing. |
| VDD_3V3 | I/O Power Supply | 3.3-V LVCMOS interface rail - powers McASP, UART, SPI, I²C, EMAC, and GPIO; isolated from CVDD to prevent noise coupling. |
| CLKIN | External Clock Input | Accepts 24–50 MHz crystal or oscillator - feeds PLL to generate 456-MHz CPU clock and peripheral clocks. |
| USB0_DM / USB0_DP | USB 2.0 OTG Differential Pair | High-speed (480 Mbps) or full-speed (12 Mbps) differential signaling - supports OTG role negotiation and host/device mode switching. |
| USB1_DM / USB1_DP | USB 1.1 OHCI Host Differential Pair | Full-speed (12 Mbps) host-only interface - connects to USB audio class devices (e.g., mic arrays, HID controls) without hub. |
| EMAC_TXD[3:0] / RXD[3:0] | Ethernet MAC Data Bus | RMII-compliant 4-bit transmit/receive data path - enables 10/100 Mbps streaming to networked audio endpoints with minimal pin count. |
| MCASP0_AXR[0–15] | McASP0 Serial Data Pins | 16 configurable serializers for I²S/TDM - supports 8-channel output to DACs or 8-channel input from ADCs with independent frame sync. |
Key Features
| Feature | Design Value |
|---|---|
| Floating-Point Performance | 2736 MFLOPS at 456 MHz - enables real-time FIR/IIR filtering, FFT-based equalization, and psychoacoustic processing in A/V receivers. |
| Dual USB Integration | USB 2.0 OTG + USB 1.1 OHCI host - allows simultaneous connection to PC (device mode) and USB audio peripherals (host mode) without external PHYs. |
| 128KB Shared RAM | Dedicated memory accessible by host processors or DMA without impacting DSP L2 bandwidth - simplifies multi-processor audio system partitioning. |
| Real-Time Clock (RTC) | Integrated 32-kHz oscillator and separate power rail - maintains time/date/alarm during low-power standby, critical for scheduled audio playback. |
| Programmable Real-Time Unit (PRU) | Two independent 32-bit RISC cores with local IRAM/DRAM - executes deterministic PWM timing, GPIO event handling, or protocol bridging without CPU intervention. |
| Enhanced Audio Interface | 3× McASP with DIT-capable McASP2 - supports S/PDIF transmission and reception for digital audio interconnect in home theater systems. |
Applications
| Professional Audio Mixing Console | A/V Receiver with Network Streaming |
|---|---|
Use Scenario: Real-time multi-band dynamic range compression, channel delay alignment, and loudness normalization across 7.1 channels. IC Role / Device Role / Timing Role: Primary DSP engine executing low-latency audio algorithms with synchronized McASP I/O and eHRPWM-controlled analog gain stages. Use Value: 456-MHz C674x core and 3× McASP enable sub-1-ms processing latency and 192-kHz sample rate support for studio-grade fidelity. |
Use Scenario: Decoding and rendering of lossless FLAC/ALAC streams over Ethernet or Wi-Fi, with HDMI audio passthrough and room correction. IC Role / Device Role / Timing Role: Central media processor managing EMAC network stack, USB mass storage, McASP-to-HDMI bridge, and PRUSS-driven HDMI CEC control. Use Value: Integrated 10/100 EMAC + USB OTG + 128KB shared RAM eliminates external networking ICs and reduces BOM cost in premium consumer AVRs. |
| Automotive Digital Amplifier | Soundbar with Voice Assistant Integration |
Use Scenario: Class-D amplifier control with adaptive bass boost, cabin acoustic modeling, and CAN bus diagnostics integration. IC Role / Device Role / Timing Role: Audio DSP running FIR filters and speaker protection algorithms, with eQEP monitoring motorized grille position and CAN interface via PRUSS. Use Value: eQEP + eHRPWM + PRUSS co-processing enables precise PWM dead-time control and real-time feedback loop closure for EMI-optimized amplification. |
Use Scenario: Far-field voice pickup, wake-word detection, and multi-zone beamforming using microphone array inputs and Bluetooth LE audio output. IC Role / Device Role / Timing Role: Audio preprocessing unit capturing 8-channel PDM mic data via McASP, running neural net inference on C674x, and streaming processed audio via USB or I²S. Use Value: 32KB L1D cache + 256KB L2 + EDMA3 ensures zero-drop audio buffering for continuous voice interaction in noisy living room environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar fixed/floating-point DSP applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMS320C6745PTP | 176-pin TQFP, 375 MHz max, no LCD/USB1/HPI/RTC/128KB RAM - 128KB less on-chip memory and missing USB 1.1 OHCI host. | Limited to cost-sensitive audio endpoints without dual USB or real-time clock requirements. | Select when board space permits larger TQFP and system design does not require OTG+OHCI dual USB or RTC functionality. |
| OMAP-L138AZWT | ARM9 + C674x dual-core, 375 MHz, same peripheral set but adds ARM Linux support and video acceleration. | Suitable for multimedia gateways requiring GUI, web server, or video overlay alongside audio processing. | Choose when application demands embedded Linux, TCP/IP stack offload, or HDMI video compositing alongside DSP audio workloads. |
Compared with TMS320C6745PTP, TMS320C6747DZKBA3 provides higher clock frequency, dual USB, RTC, and 128KB shared RAM - making it optimal for feature-rich, space-constrained audio systems; versus OMAP-L138AZWT, it offers lower power and simpler BSP but lacks ARM-side OS capabilities.
Availability
TMS320C6747DZKBA3 is available at Aetrix Electronics and suitable for professional audio mixing consoles, networked A/V receivers, and automotive digital amplifiers requiring stable component supply, long-term industrial lifecycle support, and qualified production-grade silicon.
Supply support for TMS320C6747DZKBA3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog and embedded processing solutions for industrial, automotive, and consumer markets.
The TMS320C6747DZKBA3 belongs to TI's C6000™ DSP platform, designed specifically for low-power, high-performance audio, voice, and communications applications where deterministic real-time processing and rich peripheral integration are essential.
FAQ
What is the maximum operating frequency of the TMS320C6747DZKBA3 and what voltage is required?
The TMS320C6747DZKBA3 operates at a maximum frequency of 456 MHz when supplied with a 1.3-V core voltage (CVDD). At 1.2 V, the guaranteed maximum frequency is 375 MHz. Both voltage/frequency combinations are supported across commercial and industrial temperature ranges, with thermal derating specified in the datasheet's recommended operating conditions table.
Does the TMS320C6747DZKBA3 support both USB host and device modes simultaneously?
Yes, the TMS320C6747DZKBA3 supports simultaneous USB operation: USB 2.0 OTG (USB0) functions as a high/full-speed device or host, while USB 1.1 OHCI (USB1) operates exclusively as a full-speed host. This dual-USB architecture enables concurrent connection to a PC (as device) and USB audio peripherals (as host), without requiring external USB switches or hubs.
What audio interfaces are integrated into the TMS320C6747DZKBA3 and how many channels do they support?
The TMS320C6747DZKBA3 integrates three Multichannel Audio Serial Ports (McASPs), each supporting multiple serializers and FIFO buffers. McASP0 and McASP1 support up to 16 serializers; McASP2 adds DIT (S/PDIF transmit) capability. Collectively, they enable up to 28 serial data pins and support TDM, I²S, and other formats - sufficient for 8-channel input/output at 192 kHz in professional audio applications.
Is the 128KB shared RAM in the TMS320C6747DZKBA3 accessible by external hosts, and does it impact DSP performance?
Yes, the 128KB shared RAM in the TMS320C6747DZKBA3 is accessible by external processors or DMA controllers without contention on the DSP's L2 memory bus. It is physically separate from the 256KB L2 RAM/cache, ensuring that host access to shared RAM does not degrade DSP instruction or data throughput - a key advantage for multi-processor audio system architectures.
What is the role of the PRUSS subsystem in the TMS320C6747DZKBA3, and how is it used in audio applications?
The PRUSS in the TMS320C6747DZKBA3 consists of two independent 32-bit RISC cores with dedicated instruction and data RAM. In audio applications, it handles time-critical tasks such as GPIO-based button debouncing, PWM synchronization for analog gain control, or protocol translation (e.g., I²C-to-SPI), freeing the C674x DSP core to focus exclusively on computationally intensive signal processing algorithms.
TMS320C6747DZKBA3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- TMS320C674x
- Package/Case:
- 256-BGA
- Packaging:
- Tray
- Product Status:
- Active
- Type:
- Fixed/Floating Point
- Interface:
- EBI/EMI, Ethernet MAC, Host Interface, I2C, McASP, SPI, UART, USB
- Clock Rate:
- 375MHz
- Non-Volatile Memory:
- External
- On-Chip RAM:
- 448kB
- Voltage - I/O:
- 3.30V
- Voltage - Core:
- 1.20V
- Operating Temperature:
- -40°C ~ 105°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 256-BGA (17x17)
TMS320C6747DZKBA3 FAQ
1.How can I place an order for TMS320C6747DZKBA3 through Aetrix?
Please submit a Request for Quotation (RFQ) for TMS320C6747DZKBA3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TMS320C6747DZKBA3 reliable?
The price and inventory of TMS320C6747DZKBA3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMS320C6747DZKBA3 is usually 5 days.
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Once your TMS320C6747DZKBA3 order is processed, you will receive an email with the shipment details and tracking number.
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5.How can I obtain technical support or documentation for TMS320C6747DZKBA3?
For technical support, including TMS320C6747DZKBA3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMS320C6747DZKBA3 requirements.
6.How does Aetrix verify that TMS320C6747DZKBA3 is sourced from the original manufacturer or authorized distributors?
All TMS320C6747DZKBA3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMS320C6747DZKBA3 meets industry standards.
7.What is the process for return or replacement of TMS320C6747DZKBA3?
All TMS320C6747DZKBA3 units undergo pre-shipment inspection (PSI). If there is an issue with TMS320C6747DZKBA3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TMS320C6747DZKBA3 part is unused and in its original packaging.
Return procedure for TMS320C6747DZKBA3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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