Texas Instruments TMS320C6748BZCEA3

Overview

TMS320C6748BZCEA3 from Texas Instruments is a fixed- and floating-point digital signal processor (DSP) based on the C674x VLIW core, operating at 456 MHz with 32KB L1P cache, 32KB L1D RAM/cache, and 256KB unified L2 RAM/cache. It integrates EMAC, USB 2.0 OTG + USB 1.1 OHCI, SATA I/II, McASP, dual McBSPs, and PRUSS for real-time offload - deployed in biometric identification systems requiring deterministic low-latency signal processing.

For engineers reviewing the TMS320C6748BZCEA3 datasheet, TMS320C6748BZCEA3 pinout, TMS320C6748BZCEA3 application, or TMS320C6748BZCEA3 equivalent, key selection criteria include its 456-MHz C674x DSP performance (2746 MFLOPS), dual DDR2/mDDR memory controller support, TI Basic Secure Boot with AES-128/SHA-256, and 361-ball 0.65-mm-pitch NFBGA (ZCE) package compatibility with industrial temperature range operation.

Technical Context

The TMS320C6748BZCEA3 implements a two-level cache hierarchy: L1P (32KB direct-mapped program cache) and L1D (32KB 2-way set-associative data cache), backed by 256KB unified L2 RAM/cache configurable as mapped memory, cache, or hybrid. Its C674x core supports IEEE single- and double-precision floating-point arithmetic, mixed-precision multiply operations (e.g., 2 SP×SP→SP per cycle), and byte-addressable 8-/16-/32-/64-bit data access with overflow protection and bit-field manipulation.

Peripheral subsystems are tightly coupled via high-bandwidth switch fabric: EDMA3 (64 independent channels + 16 QDMA), PRUSS (dual 32-bit RISC PRU cores with 4KB IRAM + 512B DRAM each), and security-critical boot flow using hardware root-of-trust, JTAG lockdown, and encrypted boot image validation - enabling secure firmware updates over Ethernet without compromising runtime integrity.

Key Specifications

Pinout & Package

Package: 361-ball Pb-free plastic ball grid array (NFBGA), ZCE suffix, 13.0 mm × 13.0 mm body size, 0.65 mm ball pitch, industrial temperature grade.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar fixed/floating-point DSP applications.

Compared with TMS320C6748BZCEA3, the C6747 offers reduced cost and power at lower performance and peripheral count, while the OMAP-L138 trades pure DSP throughput for heterogeneous compute flexibility - making the TMS320C6748BZCEA3 optimal for standalone, security-critical, high-throughput DSP workloads without ARM overhead.

Availability

TMS320C6748BZCEA3 is available at Aetrix Electronics and suitable for biometric identification terminals, currency inspection systems, and low-end machine vision cameras requiring stable component supply, long-term industrial temperature support, and secure firmware lifecycle management.

Supply support for TMS320C6748BZCEA3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog and embedded processing solutions across industrial, automotive, and communications markets since 1930.

The TMS320C6748BZCEA3 belongs to TI's C6000™ DSP platform, designed specifically for low-power, high-performance signal processing in resource-constrained embedded systems where deterministic real-time behavior and hardware-enforced security are mandatory.

FAQ

What is the maximum operating frequency of the TMS320C6748BZCEA3 and what voltage is required?

The TMS320C6748BZCEA3 operates at a maximum frequency of 456 MHz, which requires a core supply voltage (VDD_CORE) of 1.3 V. This voltage level is specified in the recommended operating conditions section of the datasheet and must be maintained within ±3% tolerance to ensure stable timing margins and thermal performance under full computational load.

Does the TMS320C6748BZCEA3 support secure boot, and what cryptographic algorithms are used?

Yes, the TMS320C6748BZCEA3 implements TI Basic Secure Boot using AES-128 for boot image encryption and SHA-256 for signature validation. The process relies on a device-specific 128-bit cipher key generated by an NIST-800-22 certified RNG, ensuring that only authenticated, encrypted firmware images can execute - a requirement for TMS320C6748BZCEA3 deployments in regulated biometric and financial inspection systems.

What package type and ball pitch does the TMS320C6748BZCEA3 use?

The TMS320C6748BZCEA3 uses a 361-ball Pb-free plastic ball grid array (NFBGA) package with ZCE suffix, measuring 13.0 mm × 13.0 mm with 0.65 mm ball pitch. This package is distinct from the ZWT variant (0.80 mm pitch, 16 mm × 16 mm), and PCB layout must strictly follow TI's ZCE land pattern and thermal pad guidelines to ensure signal integrity and thermal reliability.

Can the TMS320C6748BZCEA3 interface directly with DDR2 SDRAM, and what is the supported address space?

Yes, the TMS320C6748BZCEA3 integrates a dedicated DDR2/Mobile DDR memory controller supporting 16-bit bus width and up to 256 MB address space. It complies with JEDEC DDR2 standards and supports programmable timing parameters including tRCD, tRP, and tRFC - enabling direct connection to common DDR2-400/533 components without external PHY or level-shifting circuitry.

What real-time offload capabilities does the TMS320C6748BZCEA3 provide beyond the main DSP core?

The TMS320C6748BZCEA3 includes a Programmable Real-Time Unit Subsystem (PRUSS) with two independent 32-bit RISC PRU cores, each with 4KB instruction RAM and 512 bytes data RAM. These cores operate autonomously with dedicated interrupt controller and clock-gating domain, enabling precise PWM generation, GPIO event handling, and protocol bridging - freeing the C674x DSP core for computationally intensive signal processing tasks in TMS320C6748BZCEA3-based designs.