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Texas Instruments TMS320F2812GBBS
- Part No.:
- TMS320F2812GBBS
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 179-LFBGA
- Datasheet:
-
TMS320F2812GBBS.pdf
- Description:
- IC MCU 32BIT 256KB FLSH 179NFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:227
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Product details
Overview
TMS320F2812GBBS from Texas Instruments is a 150-MHz C28x-based digital signal processor with 128K × 16 flash, 18K × 16 SARAM, dual 16-channel 12-bit ADC (80 ns conversion), and integrated motor control peripherals including two Event Managers (EVA/EVB) - deployed in industrial motor drives and EV powertrain control systems.
For engineers reviewing the TMS320F2812GBBS datasheet, TMS320F2812GBBS pinout, TMS320F2812GBBS application, or TMS320F2812GBBS equivalent, key selection criteria include external memory interface support (XINTF), 179-ball MicroStar BGA package compatibility, 1.8-V/1.9-V core voltage operation, eCAN and McBSP serial connectivity, and code-security module protection for firmware IP.
Technical Context
The TMS320F2812GBBS implements a Harvard-architecture 32-bit C28x CPU with atomic instructions, 4M linear address space, and unified memory model enabling efficient C/C++ execution. It integrates dual 16-channel 12-bit ADCs with simultaneous sampling, two independent Event Managers for PWM generation and QEP capture, and a 45-interrupt PIE block routed to three 32-bit CPU timers.
Its system-level timing architecture includes an on-chip oscillator, PLL-based clock module (configurable SYSCLKOUT up to 150 MHz), watchdog timer, and low-power modes (IDLE/STANDBY/HALT). The device supports little-endian data format and features JTAG IEEE 1149.1 boundary-scan for debug and test.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | TMS320C28x 32-bit fixed-point DSP, 150 MHz (6.67-ns cycle time) |
| Flash Memory | 128K × 16 on-chip flash with four 8K + six 16K sectors; supports in-field reprogramming |
| RAM | 18K × 16 total SARAM: L0/L1 (4K each), H0 (8K), M0/M1 (1K each) |
| ADC | Two independent 12-bit ADCs, 16 channels total, 80 ns conversion time (12.5 MSPS) |
| External Interface | XINTF with 19-bit address / 16-bit data bus, three chip selects, programmable wait states and strobe timing |
| Security | 128-bit password lock protecting flash, OTP, and L0/L1 SARAM against unauthorized read/write access |
| Package | 179-ball MicroStar BGA (GHH/ZHH), 12.0 mm × 12.0 mm, 0.8-mm pitch |
Pinout & Package
Package: 179-ball MicroStar BGA (GHH/ZHH), 12.0 mm × 12.0 mm, 0.8-mm pitch, RoHS-compliant. Designed for high-density PCB layouts with thermal pad under die for enhanced heat dissipation in motor control applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| XA[0]–XA[18] | XINTF Address Bus | 19-bit multiplexed address lines for external memory mapping across six XINTF zones |
| XD[0]–XD[15] | XINTF Data Bus | 16-bit bidirectional data path supporting burst reads/writes and glueless interface to SRAM/ROM/FPGA |
| XZCS0AND1, XZCS2, XZCS6AND7 | Chip Select Outputs | Active-low zone-select signals enabling independent timing configuration per memory region |
| XRD, XWE, XR/W | Strobe Control | Programmable read/write strobes with configurable lead/active/trail timing via XTIMING registers |
| XREADY | Asynchronous Ready Input | Allows variable-latency peripheral handshaking; supports both synchronous and asynchronous wait-state insertion |
Key Features
| Feature | Design Value |
|---|---|
| Dual Event Managers (EVA/EVB) | Each provides 16 PWM outputs, 6 capture/QEP inputs, and trip-zone protection for IGBT gate drivers in motor inverters |
| eCAN Module | Full CAN 2.0B protocol compliance with 32 message objects, mailbox buffering, and bit-rate up to 1 Mbps for real-time vehicle bus communication |
| McBSP Interface | Full-duplex multichannel buffered serial port supporting TI-AIC codecs, TDM, and I²S for audio/sensor data streaming |
| Boot ROM & OTP | 4K × 16 boot ROM with math tables and software boot modes; 1K × 16 one-time-programmable ROM for calibration constants or security keys |
| Low-Power Modes | IDLE, STANDBY, HALT modes with individual peripheral clock gating to reduce active current below 50 mA at 150 MHz |
Applications
| Industrial Motor Drives | Electric Vehicle Powertrain |
|---|---|
|
Use Scenario: Closed-loop field-oriented control (FOC) of 3-phase PMSM/induction motors in HVAC compressors and industrial pumps. IC Role / Device Role / Timing Role: Real-time execution of FOC algorithms, PWM waveform generation, and ADC-synchronized current sensing at 10–20 kHz switching frequencies. Use Value: Dual 12-bit ADCs enable simultaneous phase-current sampling; EVA/EVB provide hardware-accelerated PWM dead-time insertion and fault-triggered shutdown. |
Use Scenario: Traction inverter control and battery management coordination in 48V–400V mild-hybrid and BEV systems. IC Role / Device Role / Timing Role: High-speed torque calculation, CAN-based vehicle network messaging, and analog monitoring of DC-link voltage/current/temperature. Use Value: eCAN interface meets automotive networking requirements; 128-bit security lock prevents firmware tampering in safety-critical subsystems. |
| Grid-Tied Solar Inverters | Advanced Test & Measurement Equipment |
|
Use Scenario: MPPT tracking and grid-synchronization in single-phase and three-phase photovoltaic inverters. IC Role / Device Role / Timing Role: Execution of PID-based MPPT, PLL-based grid phase-locking, and reactive power control using ADC-sampled AC waveforms. Use Value: 150-MHz CPU delivers sub-microsecond interrupt latency for fast grid-fault response; XINTF enables external FPGA co-processing for harmonic filtering. |
Use Scenario: High-precision waveform generation and analysis in automated test equipment (ATE) for power electronics validation. IC Role / Device Role / Timing Role: Real-time signal processing of captured voltage/current transients, FFT computation, and SPI-controlled DAC output for stimulus generation. Use Value: McBSP and SPI interfaces allow seamless integration with high-speed DACs/ADCs; 18K SARAM buffers multi-cycle acquisition data without DMA bottlenecks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar digital signal processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMS320F28335PGFA | Floating-point C28x CPU (200 MHz), dual 12-bit ADCs (16 ch each), CLA coprocessor, 512K flash, 68K RAM | Higher computational throughput for complex control laws (e.g., predictive control); supports floating-point math natively | Select when algorithm complexity exceeds fixed-point capability of F2812 or when CLA offloading improves loop performance. |
| TMS320F280049CPMQR | C28x + CLA, 100 MHz, 256K flash, 36K RAM, 16-bit sigma-delta filter interface, enhanced PWM resolution | Optimized for high-resolution current sensing and GaN/SiC gate driving; lacks XINTF and legacy eCAN | Prefer for new designs targeting wide-bandgap power stages where external memory expansion is unnecessary. |
Compared with TMS320F28335PGFA and TMS320F280049CPMQR, the TMS320F2812GBBS offers mature, cost-optimized fixed-point control with full XINTF and eCAN support - ideal for established motor drive platforms requiring long-term supply stability and minimal firmware migration.
Availability
TMS320F2812GBBS is available at Aetrix Electronics and suitable for industrial motor drives, electric vehicle powertrain controllers, and grid infrastructure systems requiring stable component supply over extended production lifecycles.
Supply support for TMS320F2812GBBS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and digital signal processing technologies for industrial, automotive, and communications markets.
The TMS320F2812GBBS belongs to the C2000™ real-time microcontroller family, designed specifically for high-performance closed-loop control in power electronics, motor drives, and renewable energy systems.
FAQ
What is the maximum operating frequency of the TMS320F2812GBBS?
The TMS320F2812GBBS operates at a maximum CPU frequency of 150 MHz, achieving a 6.67-ns instruction cycle time. This speed is supported by a 1.9-V core supply voltage; at 1.8-V core, the maximum rated frequency is 135 MHz. The device's PLL allows flexible clock configuration from internal oscillator or external crystal sources.
Does the TMS320F2812GBBS support external memory expansion?
Yes, the TMS320F2812GBBS includes a dedicated External Interface (XINTF) supporting over 1M × 16 external memory space. It provides 19-bit address and 16-bit data buses, three independent chip selects, programmable wait states, and configurable read/write strobe timing - enabling direct connection to SRAM, Flash, or FPGA logic without external glue logic.
How does the code-security module function on the TMS320F2812GBBS?
The TMS320F2812GBBS implements a 128-bit password lock that protects on-chip flash, OTP ROM, and L0/L1 SARAM from unauthorized read or write access. Once enabled, the security module prevents JTAG-based firmware extraction and blocks debugger access to protected memory regions - safeguarding proprietary motor control algorithms and calibration data.
What ADC capabilities does the TMS320F2812GBBS offer?
The TMS320F2812GBBS integrates two independent 12-bit analog-to-digital converters, each with 8 input channels (16 total), two sample-and-hold circuits, and selectable single or simultaneous conversion modes. Its fastest conversion rate is 80 ns (12.5 MSPS), enabling precise current/voltage sampling synchronized to PWM events in high-frequency motor control loops.
Is the TMS320F2812GBBS pin-compatible with other F281x devices?
No - the TMS320F2812GBBS uses the 179-ball GHH/ZHH MicroStar BGA package, while the F2810 and F2811 use the 128-pin PBK LQFP. Although functional peripherals are consistent across the F281x family, the TMS320F2812GBBS is not pin-compatible with F2810/F2811 variants due to differing pin counts, ball/pin assignments, and inclusion of XINTF signals exclusive to the F2812.
TMS320F2812GBBS Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 179-LFBGA
- Series:
- C2000™ C28x Fixed-Point
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- C28x
- Core Size:
- 32-Bit Single-Core
- Speed:
- 150MHz
- Connectivity:
- CANbus, EBI/EMI, McBSP, SCI, SPI, UART/USART
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- 56
- Program Memory Size:
- 256KB (128K x 16)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 18K x 16
- Voltage - Supply (Vcc/Vdd):
- 1.81V ~ 2V
- Data Converters:
- A/D 16x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TMS320F2812GBBS FAQ
1.How can I place an order for TMS320F2812GBBS through Aetrix?
Please submit a Request for Quotation (RFQ) for TMS320F2812GBBS on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TMS320F2812GBBS reliable?
The price and inventory of TMS320F2812GBBS are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMS320F2812GBBS is usually 5 days.
3.What payment methods are accepted for TMS320F2812GBBS?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMS320F2812GBBS transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TMS320F2812GBBS?
TMS320F2812GBBS orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TMS320F2812GBBS order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TMS320F2812GBBS?
For technical support, including TMS320F2812GBBS datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMS320F2812GBBS requirements.
6.How does Aetrix verify that TMS320F2812GBBS is sourced from the original manufacturer or authorized distributors?
All TMS320F2812GBBS products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMS320F2812GBBS meets industry standards.
7.What is the process for return or replacement of TMS320F2812GBBS?
All TMS320F2812GBBS units undergo pre-shipment inspection (PSI). If there is an issue with TMS320F2812GBBS, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TMS320F2812GBBS part is unused and in its original packaging.
Return procedure for TMS320F2812GBBS:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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