Texas Instruments TMS320F28375DZWTS
- Part No.:
- TMS320F28375DZWTS
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 337-LFBGA
- Datasheet:
-
TMS320F28375DZWTS.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 337NFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:270
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TMS320F28375DZWTS from Texas Instruments is a dual-core 32-bit real-time microcontroller with two 200MHz C28x CPUs, IEEE 754 FPU, TMU, VCU-II, and two independent 200MHz CLA coprocessors. It integrates four 16-/12-bit ADCs (up to 4.4MSPS system throughput), 24 ePWM channels (16 HRPWM), dual CAN, USB 2.0, and 169 GPIOs - deployed in traction inverter motor control and solar power optimizers.
For engineers reviewing the TMS320F28375DZWTS datasheet, TMS320F28375DZWTS pinout, TMS320F28375DZWTS application, or TMS320F28375DZWTS equivalent, key selection criteria include dual-CPU real-time determinism, on-chip analog subsystem performance (ADC/DAC/CMPSS/SDFM), functional safety certification (ISO 26262 ASIL B, IEC 61508 SIL 2), and nFBGA-337 thermal/power integrity for high-density industrial power conversion designs.
Technical Context
The TMS320F28375DZWTS implements a tightly coupled dual-C28x architecture with interprocessor communication (IPC) and shared memory, enabling deterministic task partitioning - e.g., one core handling torque/current loops while the other manages communications and diagnostics. Each CPU includes dedicated FPU, TMU, and VCU-II for fast trigonometric and complex math operations critical in motor control transforms.
Its analog subsystem features four independent ADCs with hardware post-processing (offset calibration, windowed compare, trigger-to-sample capture), three 12-bit buffered DACs, eight windowed comparators with DAC references, and eight SDFM input channels supporting isolated shunt current sensing - all synchronized to PWM timing for precise closed-loop actuation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU cores | Two independent 32-bit C28x CPUs, each running at 200MHz for parallel real-time control execution |
| Floating-point unit | IEEE 754 single-precision FPU per CPU, enabling high-accuracy mathematical computation without software emulation |
| Control Law Accelerators | Two CLA coprocessors, each operating at 200MHz and executing floating-point code independently of main CPUs |
| Flash memory | 512KB (256KW) ECC-protected flash, split across two secure zones for dual-zone code protection |
| RAM | 172KB (86KW) total RAM: 72KB dedicated/local shared + 96KB global shared + 4KB message RAM |
| ADC subsystem | Four 16-/12-bit ADCs: 1.1MSPS (16-bit) or 3.5MSPS (12-bit) per converter, differential or single-ended inputs, hardware post-processing |
| Enhanced PWM | 24 ePWM channels with dead-band support; 16 HRPWM channels offering sub-nanosecond resolution on A/B outputs |
| Functional safety | Hardware integrity certified to ISO 26262 ASIL B and IEC 61508 SIL 2 by TÜV SÜD |
Pinout & Package
Package: 337-ball New Fine Pitch Ball Grid Array (nFBGA), ZWT suffix, 16mm × 16mm body size, lead-free/green compliant, rated for –40°C to 125°C junction temperature (S-grade).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDIO, VDDA, VDDOSC | Power supply rails | Differentiated 1.2V core, 3.3V I/O, analog, and oscillator supplies enable noise isolation and precision analog operation |
| VSS, VSSA, VSSOSC | GND references | Separate digital, analog, and oscillator ground planes minimize coupling noise in mixed-signal operation |
| X1/X2 | Clock input | Crystal oscillator pins supporting external 1–20MHz crystal or direct clock injection for system timing flexibility |
| GPIO0–GPIO168 | Configurable I/O | 169 multiplexed GPIOs with input filtering, supporting peripheral functions including ePWM, eCAP, eQEP, SPI, CAN, and USB |
| ADCINA0–ADCINA5, ADCINB0–ADCINB5, ADCINC0–ADCINC5, ADCIND0–ADCIND5 | Analog inputs | 24 dedicated ADC input pins mapped to four independent ADC modules, supporting differential (12-channel) or single-ended (24-channel) acquisition |
| CANTXA/CANRXA, CANTXB/CANRXB | CAN transceiver interface | Dual ISO 11898-1/CAN 2.0B-compliant interfaces with pin-bootable configuration for automotive and industrial networking |
| USBDP/USBDM | USB 2.0 physical layer | Integrated USB 2.0 MAC + PHY enables direct host/device connectivity without external transceiver |
Key Features
| Feature | Design Value |
|---|---|
| Dual C28x+CLA architecture | Enables true parallel processing: CLAs handle time-critical control law execution while CPUs manage system-level tasks like comms and diagnostics |
| Hardware-accelerated math units | TMU accelerates sine/cosine/tangent for field-oriented control; VCU-II speeds up FFTs and complex vector operations in encoded applications |
| Integrated analog signal chain | Four ADCs + three 12-bit DACs + eight windowed comparators + SDFM form a complete isolated current/voltage sensing and protection subsystem |
| Secure boot and code protection | Dual-zone security with DCSM allows third-party development in isolated flash/RAM regions while protecting proprietary algorithms |
| High-resolution PWM with dead-band | 16 HRPWM channels deliver <150ps resolution on both A/B outputs, enabling precise gate drive timing for SiC/GaN inverters |
| Configurable Logic Block (CLB) | Four CLB tiles provide FPGA-like logic for custom peripheral augmentation - e.g., position manager, custom encoder interface, or fault logic |
Applications
| Traction Inverter Motor Control | Solar Power Optimizer |
|---|---|
Use Scenario: Real-time torque and flux control in EV/HEV traction inverters using SiC MOSFETs with fast switching and tight thermal constraints. IC Role / Device Role / Timing Role: Dual-core MCU performs concurrent FOC inner-loop (current/torque) and outer-loop (speed/position) control with sub-µs jitter; CLA offloads PWM update and ADC post-processing. Use Value: 200MHz dual-CPU + HRPWM + SDFM enable <500ns current loop update, reducing torque ripple and improving efficiency at high switching frequencies (>50kHz). | Use Scenario: Per-module MPPT and DC-DC regulation in residential solar arrays with partial shading mitigation and rapid fault isolation. IC Role / Device Role / Timing Role: Manages isolated current sensing (via SDFM), high-speed ADC sampling, and adaptive MPPT algorithm execution across multiple PV strings. Use Value: Four independent ADCs + hardware post-processing allow simultaneous voltage/current sampling and real-time error-from-setpoint calculation, achieving <10ms MPPT convergence under dynamic irradiance. |
| Energy Storage PCS | Industrial AC-DC Converter |
Use Scenario: Bi-directional power conversion in battery energy storage systems requiring grid synchronization, harmonic suppression, and state-of-charge balancing. IC Role / Device Role / Timing Role: Coordinates dual 3-phase PWM generation, grid-side PLL tracking, battery-side current regulation, and CAN-based BMS communication. Use Value: Dual EMIFs support external SDRAM for waveform buffering; dual CAN interfaces enable redundant communication with grid controller and battery rack management units. | Use Scenario: High-efficiency, digitally controlled AC-DC front-end with PFC and LLC resonant stages in server PSUs and telecom rectifiers. IC Role / Device Role / Timing Role: Executes dual-loop PFC control (voltage outer, current inner) and resonant LLC timing control with adaptive frequency modulation. Use Value: TMU + FPU accelerate RMS voltage/current calculations and phase-locked loop convergence; 16-bit ADCs resolve <0.1% line voltage variation for stable regulation across wide input range. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar real-time control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMS320F28377DZWTS | 1MB flash (vs. 512KB), 204KB RAM (vs. 172KB), same dual-core/CLA/ADC/peripheral set | Supports larger firmware (e.g., multi-stage charging algorithms, OTA updates) and more complex data logging buffers | Select when firmware footprint exceeds 512KB or extended SRAM for real-time analytics is required |
| TMS320F28379DZWTS | Same 1MB flash/204KB RAM as F28377D, plus enhanced analog: 24 ADC input pins (vs. 20), full 8 CMPSS modules (vs. 4), CLB tile count increased to 4 (vs. 4 in F28375D) | Better suited for ultra-high-precision current sensing and multi-axis servo drives requiring extra comparator protection channels | Select when full 8-CMPSS capability or maximum ADC channel count is needed for redundant sensing architectures |
Compared with TMS320F28377DZWTS and TMS320F28379DZWTS, the TMS320F28375DZWTS delivers identical dual-core real-time determinism and peripheral feature set at optimized cost and power for mid-tier industrial inverters where 512KB flash and 4-CMPSS are sufficient for functional requirements.
Availability
TMS320F28375DZWTS is available at Aetrix Electronics and suitable for traction inverter motor control, solar power optimizers, and energy storage power conversion systems requiring stable component supply, long-term industrial lifecycle support, and AEC-Q100-aligned thermal reliability.
Supply support for TMS320F28375DZWTS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and connectivity technologies, with leadership in real-time control MCUs for power electronics.
The TMS320F28375DZWTS belongs to TI's C2000™ Premium performance MCU product line, designed specifically for high-fidelity closed-loop control in industrial motor drives, renewable energy inverters, EV powertrain systems, and digital power conversion.
FAQ
What is the operating temperature range for the TMS320F28375DZWTS?
The TMS320F28375DZWTS is rated for –40°C to 125°C junction temperature (S-grade), validated for continuous operation in high-thermal environments such as enclosed traction inverters and outdoor solar power optimizers. This rating aligns with AEC-Q100 stress test conditions for automotive-grade reliability, though the part itself is not Q100-certified.
Does the TMS320F28375DZWTS support functional safety certification?
Yes, the TMS320F28375DZWTS is hardware-integrity certified to ISO 26262 ASIL B and IEC 61508 SIL 2 by TÜV SÜD. Safety documentation - including FMEDA reports, safety manuals, and diagnostic coverage analysis - is available from Texas Instruments to support system-level compliance up to ASIL D and SIL 3.
How many ADC modules does the TMS320F28375DZWTS integrate, and what are their key capabilities?
The TMS320F28375DZWTS integrates four independent 16-/12-bit ADCs. Each supports 1.1MSPS (16-bit) or 3.5MSPS (12-bit) conversion, differential or single-ended inputs, hardware post-processing (offset calibration, windowed compare, trigger-to-sample delay capture), and synchronization to PWM events - enabling precise, low-latency current/voltage sensing in multi-phase power converters.
What package type and ball count does the TMS320F28375DZWTS use?
The TMS320F28375DZWTS uses the ZWT package: a 337-ball New Fine Pitch Ball Grid Array (nFBGA) with 16mm × 16mm body size, lead-free/green construction, and thermal pad design optimized for high-power density PCB layouts in industrial and automotive power electronics.
Can the TMS320F28375DZWTS execute code independently on both CPU cores and CLAs simultaneously?
Yes, the TMS320F28375DZWTS supports true concurrent execution: both C28x CPUs run independent firmware threads, and each CLA executes floating-point control law code triggered by peripheral events (e.g., PWM sync, ADC EOC) - all without CPU intervention. This architecture enables deterministic sub-microsecond loop closure in demanding real-time control applications.
TMS320F28375DZWTS Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 337-LFBGA
- Series:
- C2000™ C28x Delfino™, Functional Safety (FuSa)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- C28x
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 200MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- 169
- Program Memory Size:
- 1MB (512K x 16)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 102K x 16
- Voltage - Supply (Vcc/Vdd):
- 1.14V ~ 3.47V
- Data Converters:
- A/D 24x12b; D/A 3x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
TMS320F28375DZWTS FAQ
1.How can I place an order for TMS320F28375DZWTS through Aetrix?
Please submit a Request for Quotation (RFQ) for TMS320F28375DZWTS on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TMS320F28375DZWTS reliable?
The price and inventory of TMS320F28375DZWTS are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMS320F28375DZWTS is usually 5 days.
3.What payment methods are accepted for TMS320F28375DZWTS?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMS320F28375DZWTS transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TMS320F28375DZWTS?
TMS320F28375DZWTS orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TMS320F28375DZWTS order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TMS320F28375DZWTS?
For technical support, including TMS320F28375DZWTS datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMS320F28375DZWTS requirements.
6.How does Aetrix verify that TMS320F28375DZWTS is sourced from the original manufacturer or authorized distributors?
All TMS320F28375DZWTS products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMS320F28375DZWTS meets industry standards.
7.What is the process for return or replacement of TMS320F28375DZWTS?
All TMS320F28375DZWTS units undergo pre-shipment inspection (PSI). If there is an issue with TMS320F28375DZWTS, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TMS320F28375DZWTS part is unused and in its original packaging.
Return procedure for TMS320F28375DZWTS:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TMS320F28375DZWTS Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

