Texas Instruments TMS320F28377DGWTEP

Overview

TMS320F28377DGWTEP from Texas Instruments is a radiation-tolerant, extended-temperature dual-core C28x floating-point microcontroller designed for real-time motor control and power conversion in harsh environments. It integrates two 200-MHz C28x CPUs with IEEE 754 FPU, TMU, VCU-II, two CLA coprocessors, 1MB ECC-protected Flash, 204KB RAM, four 16-bit ADCs (1.1 MSPS each), 24 ePWM channels (16 HRPWM), and dual CAN 2.0B interfaces - deployed in EV/HEV powertrain inverters and industrial servo drives.

For engineers reviewing the TMS320F28377DGWTEP datasheet, TMS320F28377DGWTEP pinout, TMS320F28377DGWTEP application, or TMS320F28377DGWTEP equivalent, key selection criteria include dual-core deterministic latency, on-chip analog subsystem consolidation (ADC+DAC+comparators+SDFM), HRPWM dead-band precision, CLA offload capability for torque-loop execution, and -55°C to +125°C operation with defense-grade traceability.

Technical Context

The TMS320F28377DGWTEP implements a tightly coupled dual-C28x architecture where each core runs at 200 MHz with independent FPU, TMU, and VCU-II accelerators - enabling simultaneous high-fidelity position/speed tracking and current/torque loop control. Its two CLAs operate concurrently at 200 MHz, responding to peripheral triggers without CPU intervention to execute time-critical algorithms like field-oriented control (FOC) inner loops.

Analog subsystem integration includes four independent 16-bit ADCs with differential inputs, hardware post-processing (offset calibration, error-from-setpoint, zero-crossing detection), eight windowed comparators with 12-bit DAC references, three buffered 12-bit DAC outputs, and SDFM modules supporting isolated shunt-current sensing - all synchronized to PWM timing with sub-nanosecond jitter tolerance.

Key Specifications

Pinout & Package

Package: 337-ball nFBGA (ZWT suffix), 16.0 mm × 16.0 mm body size, 0.8 mm ball pitch, thermally enhanced with exposed die pad connected to VSS.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core real-time control applications.

Compared with TMS320F28379D and TMS320F28076, the TMS320F28377DGWTEP uniquely delivers radiation-hardened dual-core determinism, -55°C to +125°C operation, and full analog subsystem consolidation - making it the sole option for mission-critical aerospace, defense, and downhole energy applications requiring guaranteed long-term availability and traceability.

Availability

TMS320F28377DGWTEP is available at Aetrix Electronics and suitable for electric vehicle powertrain inverters, industrial servo motor drives, and grid infrastructure converters requiring stable component supply across 15+ year production lifecycles.

Supply support for TMS320F28377DGWTEP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies - with over 50 years of innovation in real-time control silicon.

The TMS320F28377DGWTEP belongs to TI's Delfino™ EP (Enhanced Performance) microcontroller family, engineered specifically for deterministic, high-precision closed-loop control in safety-critical, extended-temperature environments such as aerospace avionics and defense electronics.

FAQ

What is the operating temperature range of the TMS320F28377DGWTEP?

The TMS320F28377DGWTEP is rated for continuous operation from –55°C to +125°C ambient temperature. This extended range is achieved through controlled baseline manufacturing, single-fab/single-test-site traceability, and rigorous screening - making it suitable for downhole oil/gas tools, satellite power systems, and military vehicle electronics where commercial-grade MCUs fail.

Does the TMS320F28377DGWTEP support hardware-accelerated field-oriented control (FOC)?

Yes, the TMS320F28377DGWTEP supports hardware-accelerated FOC via its dual C28x CPUs with integrated TMU (Trigonometric Math Unit) and VCU-II (Viterbi/Complex Math Unit), plus two CLA coprocessors. These units execute Park/Clarke transforms, PI regulators, and space-vector modulation in hardware - reducing FOC loop latency to under 800 ns and freeing CPU cycles for higher-layer diagnostics and communication in the TMS320F28377DGWTEP.

How many independent ADCs does the TMS320F28377DGWTEP integrate, and what are their key specifications?

The TMS320F28377DGWTEP integrates four independent 16-bit analog-to-digital converters, each capable of 1.1 MSPS sampling rate (4.4 MSPS aggregate throughput). Each ADC supports differential inputs, hardware post-processing (offset calibration, error-from-setpoint), and trigger-to-sample delay capture - enabling precise, synchronized current/voltage acquisition critical for high-fidelity motor control in the TMS320F28377DGWTEP.

What package type and pin count does the TMS320F28377DGWTEP use?

The TMS320F28377DGWTEP uses a 337-ball New Fine Pitch Ball Grid Array (nFBGA) package with ZWT suffix, measuring 16.0 mm × 16.0 mm with 0.8 mm ball pitch. The package features an exposed thermal pad connected to VSS for enhanced heat dissipation - essential for sustained 200-MHz dual-core operation in compact, convection-cooled enclosures housing the TMS320F28377DGWTEP.

Is the TMS320F28377DGWTEP pin-compatible with other devices in the F2837xD family?

No, the TMS320F28377DGWTEP is not pin-compatible with non-EP variants such as the TMS320F28377D (GWT) or TMS320F28379D (PTP). While functionally similar, the TMS320F28377DGWTEP uses the ZWT nFBGA package (337 balls), whereas GWT and PTP denote different packages (nFBGA and HLQFP respectively) with distinct pinouts, power delivery schemes, and thermal pad configurations - requiring unique PCB layouts for the TMS320F28377DGWTEP.