Texas Instruments TMS320VC5471GHKA

Overview

TMS320VC5471GHKA from Texas Instruments is a dual-core fixed-point digital signal processor integrating a 100-MIPS TMS320C54x DSP core and an ARM7TDMI RISC MCU core on a single die, operating at 100 MHz with 32 KB on-chip RAM, 8-bit parallel I/O, and McBSP serial interface. It targets real-time embedded systems requiring concurrent signal processing and host control, such as VoIP gateways and industrial communication nodes.

For engineers reviewing the TMS320VC5471GHKA datasheet, TMS320VC5471GHKA pinout, TMS320VC5471GHKA application, or TMS320VC5471GHKA equivalent, key selection considerations include dual-core boot sequencing, API bus arbitration between DSP and ARM subsystems, SDRAM interface timing compliance, and industrial temperature operation (–40°C to 85°C).

Technical Context

The TMS320VC5471GHKA implements a tightly coupled dual-subsystem architecture: the C54x DSP core executes signal-processing algorithms with 40-bit ALU, 24-bit address bus, and hardware loop support, while the ARM7TDMI MCU core handles system management, Ethernet MAC control, and peripheral interfacing via dedicated APB and AHB bridges. Both cores share access to external memory through independent but synchronized bus interfaces.

Core interaction occurs via the ARM Port Interface (API), a 16-bit synchronous bus supporting configurable wait-state generation, priority-based arbitration, and interrupt forwarding. The device supports three boot modes-DSP-only, ARM-only, and API-boot-with memory mapping controlled by DSP_APIBN and ABMDIS pins, enabling flexible firmware partitioning across heterogeneous execution domains.

Key Specifications

Pinout & Package

Package: 257-ball MicroStar BGA (GHK), 17 mm × 17 mm, 1.0 mm ball pitch, RoHS-compliant plastic body. Thermal pad on underside requires solder paste stencil design per TI SZZA019.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core signal processing and control applications.

Compared with TMS320VC5471GHKA, the TMS320C6713BZDHA offers higher computational throughput for math-heavy workloads but lacks integrated system control capability, whereas the LPC2478FBD208 provides broader peripheral integration at the expense of real-time signal processing performance and deterministic latency.

Availability

TMS320VC5471GHKA is available at Aetrix Electronics and suitable for industrial automation, telecom infrastructure, and audio test equipment requiring stable component supply, long-term lifecycle assurance, and traceable sourcing from authorized channels.

Supply support for TMS320VC5471GHKA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, specializing in analog, embedded processing, and wireless technologies with over 50 years of innovation in DSP and microcontroller architectures.

The TMS320VC5471GHKA belongs to TI's C5000™ DSP platform, designed specifically for cost-sensitive, power-efficient embedded systems requiring integrated signal processing and host control functionality in a single package.

FAQ

What is the maximum SDRAM capacity supported by the TMS320VC5471GHKA?

The TMS320VC5471GHKA supports up to 64 MB of SDRAM via its 16-bit SDRAM controller with row/column address multiplexing. This is achieved using a 12-bit row address, 8-bit column address, and 2-bit bank select, compliant with JEDEC Standard No. 21-C. The controller implements auto-refresh, precharge, and mode-register programming required for standard SDRAM operation. TMS320VC5471GHKA timing parameters are specified for CAS latency 2 and 3 configurations in Section 6.12 of the SPRS180C datasheet.

Does the TMS320VC5471GHKA support JTAG debugging for both cores simultaneously?

The TMS320VC5471GHKA provides IEEE 1149.1-compliant JTAG TAP controllers for both the DSP and ARM7TDMI cores, but they operate on separate TAP chains. Debug access requires sequential selection via instruction register coding (IR length: 5 bits for ARM, 4 bits for DSP). Simultaneous breakpoint setting is not supported; however, cross-triggering between cores is enabled via the API bus interrupt forwarding mechanism. TMS320VC5471GHKA documentation confirms this in Sections 2.3 and 4.6.3 of SPRS180C.

How does the ARM Port Interface (API) resolve bus contention between the DSP and ARM subsystems?

The TMS320VC5471GHKA implements hardware arbitration on the API bus using a fixed-priority scheme where the ARM core has higher priority than the DSP core during shared memory accesses. Arbitration is transparent to software and occurs at the cycle level, with bus grants resolved within one clock cycle. The API bus supports burst transfers and wait-state insertion per transaction, ensuring deterministic latency for time-critical DSP operations. This behavior is documented in Section 3.4.3 of SPRS180C.

Can the McBSP on the TMS320VC5471GHKA interface directly with an I2S audio codec?

Yes, the McBSP on the TMS320VC5471GHKA supports native I2S protocol operation through programmable clock and frame sync polarity settings (CLKXP, FSXP bits) and automatic word-length alignment (16-, 20-, 24-, or 32-bit). It generates left/right justified and I2S-standard frame sync signals with adjustable delay, enabling direct connection to TI PCM3002, AKM AK4552, or Cirrus CS4272 codecs without level-shifting or format conversion. Configuration details appear in Table 3–7 and Section 3.4.1 of SPRS180C.

What are the power supply requirements for the TMS320VC5471GHKA?

The TMS320VC5471GHKA requires a single 3.3-V supply for both core logic and I/O, with separate analog and digital ground planes recommended. Total typical current draw is 420 mA at 100 MHz (280 mA DSP + 140 mA ARM), as specified in Section 6.2 of SPRS180C. Decoupling requires 100 nF ceramic capacitors per power ball plus bulk capacitance ≥10 μF near the package; TI recommends using two 0.1-μF X7R capacitors per VDD ball in the GHK layout.