Texas Instruments TMS320VC5471ZHK

Overview

TMS320VC5471ZHK from Texas Instruments is a dual-core fixed-point digital signal processor integrating a 100-MIPS TMS320C54x DSP core and an ARM7TDMI RISC MCU core in a single 257-ball BGA package. It features 32 KB on-chip RAM, McBSP serial interface, DMA controller, Ethernet MAC (MII), UART, SPI, I²C, and programmable PLL clock generation. It targets real-time embedded systems requiring concurrent signal processing and host control, such as VoIP gateways and industrial communication nodes.

For engineers reviewing the TMS320VC5471ZHK datasheet, TMS320VC5471ZHK pinout, TMS320VC5471ZHK application, or TMS320VC5471ZHK equivalent, key selection considerations include dual-core memory partitioning, API bus arbitration between DSP and ARM subsystems, McBSP-to-SPI mode compatibility, SDRAM interface timing compliance, and industrial temperature operation (–40°C to 85°C).

Technical Context

The TMS320VC5471ZHK implements tightly coupled but functionally independent DSP and MCU subsystems sharing external memory via the ARM Port Interface (API) bus. The DSP core executes C54x instruction set at up to 100 MIPS with Harvard architecture, 40-bit ALU, and dual-operand read capability; the ARM7TDMI core runs at up to 60 MHz with 32-bit RISC execution and JTAG-based emulation support.

Inter-subsystem communication occurs through dedicated API registers, shared SRAM, and interrupt signaling (DSP_INT0–DSP_INT3, ARM_IRQ0–ARM_IRQ3). Memory mapping is configurable: DSP accesses internal RAM and external SDRAM via its EMIF; ARM accesses external SDRAM, flash, and peripherals via its own memory controller and MII/Ethernet interface.

Key Specifications

Pinout & Package

Package: 257-ball MicroStar BGA (GHK package, 1.27-mm pitch, 17 × 17 array), RoHS-compliant plastic ball grid array with thermal pad. Mechanical drawing specified in SPRS180C Section 7.1.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core DSP+MCU applications.

Compared with TMS320VC5471ZHK, the TMS320VC5409AZHL requires external MCU and PHY for networked functionality, while the LM3S8962-IQC50-A2 lacks hardware-accelerated filtering and sample-rate conversion - making the TMS320VC5471ZHK uniquely suited for mixed-signal edge nodes demanding concurrent real-time signal processing and protocol handling.

Availability

TMS320VC5471ZHK is available at Aetrix Electronics and suitable for industrial communications, VoIP infrastructure, and networked audio equipment requiring stable component supply, long-term lifecycle support, and verified industrial temperature performance.

Supply support for TMS320VC5471ZHK includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company founded in 1930, specializing in analog, embedded processing, and digital signal processing technologies with broad industrial and automotive qualification.

The TMS320VC5471ZHK belongs to TI's C5000™ DSP platform, designed specifically for cost-sensitive, power-efficient embedded systems requiring integrated signal processing and host control - bridging the gap between traditional DSPs and general-purpose MCUs.

FAQ

What is the maximum operating frequency of the DSP core in the TMS320VC5471ZHK?

The TMS320VC5471ZHK DSP core operates at a maximum frequency of 100 MHz, delivering 100 million instructions per second (MIPS). This speed is achieved using an internal PLL that multiplies the external CLKIN signal (10–20 MHz range). The TMS320VC5471ZHK datasheet specifies timing parameters under recommended operating conditions, including voltage (3.0–3.6 V) and industrial temperature (–40°C to +85°C).

Does the TMS320VC5471ZHK include an integrated Ethernet physical layer (PHY)?

No, the TMS320VC5471ZHK integrates only an Ethernet Media Access Controller (MAC) compliant with the MII standard. It requires an external PHY device (e.g., DP83848) to drive the 10/100BASE-TX physical layer. The TMS320VC5471ZHK provides MDIO/MDC signals for PHY register configuration and supports full-duplex operation with hardware flow control.

How is memory shared between the DSP and ARM cores in the TMS320VC5471ZHK?

Memory sharing in the TMS320VC5471ZHK occurs via the ARM Port Interface (API) bus, which connects the DSP and ARM subsystems. The 32 KB on-chip RAM can be partitioned or configured as shared memory; access arbitration is handled in hardware. External SDRAM is accessible by both cores but requires explicit address mapping and synchronization via API registers or interrupts to avoid contention.

Can the McBSP peripheral on the TMS320VC5471ZHK be used as a standard SPI interface?

Yes, the McBSP on the TMS320VC5471ZHK can be configured as an SPI master or slave by setting CLKSTP and CLKXP bits in the SPSTAT register. Timing tables in the TMS320VC5471ZHK datasheet (Sections 6.11.3) define valid SPI waveforms for CLKSTP = 10b/11b and CLKXP = 0/1, supporting standard 4-wire SPI with frame sync as chip select.

What packaging and thermal specifications apply to the TMS320VC5471ZHK?

The TMS320VC5471ZHK uses a 257-ball MicroStar BGA (GHK package) with 1.27-mm pitch and exposed thermal pad. Its thermal resistance (θ_JA) is 26.5°C/W, and θ_JC is 3.5°C/W, as measured per JEDEC JESD51 standards. The device is rated for industrial temperature operation (–40°C to +85°C) with validated electrical characteristics across this range.