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Texas Instruments TMS320VC5501GZZ300

Part No.:
TMS320VC5501GZZ300
Manufacturer:
Texas Instruments
Category:
DSP (Digital Signal Processors)
Package:
201-LFBGA
Datasheet:
AetrixTMS320VC5501GZZ300.pdf
Description:
IC FXD-PNT DSP 600 MIPS 201-BGA
Quantity:
Payment:
Payment
Shipping:
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Inventory:2,454

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Product details

Overview

TMS320VC5501GZZ300 from Texas Instruments is a fixed-point digital signal processor (DSP) with 300 MHz CPU clock, 128K × 16-bit on-chip dual-access RAM (DARAM), 64K × 16-bit on-chip ROM, and integrated peripherals including McBSP, UART, I²C, HPI, and DMA. It targets real-time audio processing, voice recognition, and telecom baseband applications requiring deterministic low-latency execution.

For engineers reviewing the TMS320VC5501GZZ300 datasheet, TMS320VC5501GZZ300 pinout, TMS320VC5501GZZ300 application, or TMS320VC5501GZZ300 equivalent, key selection criteria include its 201-ball BGA (GZZ) package, 3.3-V I/O compatibility, 1.6-V core voltage, PLL-based clock generation up to 300 MHz, and support for asynchronous/synchronous external memory interfaces.

Technical Context

The TMS320VC5501GZZ300 implements a dual-MAC, 16-bit fixed-point VLIW architecture optimized for power-efficient signal processing. Its memory subsystem includes separate program/data buses, instruction cache, and configurable external memory interface (EMIF) supporting SDRAM, SRAM, and flash.

Peripherals are tightly coupled via internal buses: the multichannel buffered serial port (McBSP) supports TDM, I²S, and SPI modes; the host-port interface (HPI) enables direct host access to internal memory; and the DMA controller offloads data movement from the CPU across multiple channels with chaining support.

Key Specifications

ParameterValue and Actual Design Meaning
CPU Clock Speed300 MHz - enables real-time execution of 16-bit fixed-point algorithms with cycle-accurate timing control.
Core Voltage1.6 V - reduces dynamic power consumption while maintaining performance in portable/embedded systems.
I/O Voltage3.3 V - ensures interoperability with standard logic families and peripheral ICs without level-shifting.
On-Chip RAM128K × 16-bit DARAM - provides zero-wait-state dual-access memory for simultaneous instruction fetch and data read/write.
On-Chip ROM64K × 16-bit - stores boot code and common DSP routines, eliminating need for external boot ROM.
External Memory InterfaceProgrammable EMIF - supports asynchronous SRAM/flash and synchronous SDRAM with configurable wait states and burst modes.
PeripheralsMcBSP, UART, I²C, HPI, 2× Timers, GPIO, DMA - enables full-system integration without external glue logic.

Pinout & Package

Package: 201-ball micro-BGA (GZZ), 12 mm × 12 mm, 0.8-mm pitch, RoHS-compliant, thermally enhanced bottom-side thermal pad.

Pin/TerminalCircuit RoleDesign Meaning
VDD_CORECore power supply1.6-V supply for CPU and internal logic; requires local decoupling for noise-sensitive operation.
VDD_IOI/O power supply3.3-V supply for all digital I/O pins; independent from core rail for mixed-voltage system design.
CLKINExternal clock inputAccepts crystal or external clock source (1–20 MHz) for PLL-based internal clock generation.
XRSActive-low reset inputAsynchronous reset that initializes CPU, peripherals, and memory controllers; asserted during power-up sequencing.
HPI_HD[7:0]Host-port data bus8-bit multiplexed bidirectional data path for host CPU access to internal memory space.
XFExternal flag outputProgrammable general-purpose output used for interprocessor signaling or external device synchronization.

Key Features

FeatureDesign Value
Dual 16-bit MAC unitExecutes two multiply-accumulate operations per cycle - essential for FIR/IIR filtering and FFT kernels in audio/voice processing.
Instruction cache (4K words)Reduces external memory accesses for repeated code segments, improving effective throughput in loop-intensive algorithms.
Configurable EMIF with SDRAM supportEnables cost-effective expansion using industry-standard SDRAM, with programmable timing registers for JEDEC-compliant initialization.
McBSP with I²S/TDM/SPI modesDirect interface to audio codecs, ADC/DACs, and digital audio transceivers without external protocol translation logic.
HPI-8 host portAllows external microcontroller or FPGA to read/write internal memory without CPU intervention - critical for firmware updates and real-time data injection.

Applications

Voice Recognition SystemTelecom Baseband Processing

Use Scenario: Embedded voice command engine in smart speaker or IVR system performing keyword spotting and feature extraction.

IC Role / Device Role / Timing Role: Real-time front-end signal conditioning, MFCC computation, and neural network inference accelerator.

Use Value: 300-MHz deterministic execution delivers sub-20-ms latency for acoustic event detection with 128K DARAM enabling full frame buffering and coefficient storage.

Use Scenario: Channel coding/decoding and modulation/demodulation in GSM/EDGE base station remote units.

IC Role / Device Role / Timing Role: Dedicated baseband processor handling convolutional decoding, interleaving, and GMSK modulation in real time.

Use Value: Dual-MAC architecture achieves >200 MIPS at 1.6-V core, meeting ETSI latency requirements while minimizing thermal footprint in fanless enclosures.

Industrial Audio AnalyticsMedical Ultrasound Beamforming

Use Scenario: Vibration analysis and anomaly detection in predictive maintenance sensors deployed on rotating machinery.

IC Role / Device Role / Timing Role: Real-time spectral analysis engine computing FFTs and envelope detection on streaming sensor data.

Use Value: On-chip 64K ROM contains optimized FFT libraries; McBSP interfaces directly to sigma-delta ADCs for synchronized multi-channel acquisition.

Use Scenario: Portable ultrasound probe performing digital beamforming and RF signal processing before image reconstruction.

IC Role / Device Role / Timing Role: Time-aligned FIR filtering and delay compensation across 16+ receive channels.

Use Value: Dual-access RAM allows simultaneous coefficient loading and sample processing; 3.3-V I/O simplifies interface to high-speed analog front-end ASICs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar fixed-point DSP applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
TMS320VC5502GZZ300Same architecture, 320K × 16-bit DARAM (2× more on-chip RAM), identical pinout and package.Supports larger algorithm footprints (e.g., wideband speech codecs, multi-band acoustic echo cancellation).Select when application requires >128K on-chip RAM without external memory latency penalties.
TMS320C5515ZAYSuccessor generation with higher integration (on-chip ADC, USB PHY), 200-MHz max clock, 128-pin BGA.Targets newer portable designs where mixed-signal integration and lower power are prioritized over raw MIPS.Choose for new designs needing analog interface or USB connectivity; not pin-compatible with TMS320VC5501GZZ300.

Compared with TMS320VC5501GZZ300, the TMS320VC5502GZZ300 offers double on-chip RAM for complex filter banks, while the TMS320C5515ZAY trades raw speed for integrated peripherals and lower active power - making the former ideal for memory-bound legacy upgrades and the latter for greenfield mixed-signal applications.

Availability

TMS320VC5501GZZ300 is available at Aetrix Electronics and suitable for voice recognition systems, telecom baseband modules, industrial audio analytics, and medical ultrasound beamforming requiring stable component supply and long-term obsolescence management.

Supply support for TMS320VC5501GZZ300 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and digital signal processing technologies with over 50 years of innovation in high-reliability silicon design.

The TMS320C55x™ DSP platform was engineered for ultra-low-power, high-efficiency fixed-point signal processing in battery-operated and thermally constrained embedded systems.

FAQ

What is the maximum operating frequency of the TMS320VC5501GZZ300?

The TMS320VC5501GZZ300 operates at a maximum CPU clock frequency of 300 MHz, achieved via its on-chip PLL synthesizing from a 1–20 MHz external clock source. This frequency is guaranteed under recommended operating conditions (1.6-V core, 3.3-V I/O, –40°C to +85°C ambient). The TMS320VC5501GZZ300's architecture sustains this rate with zero-wait-state access to on-chip DARAM and instruction cache, enabling deterministic real-time performance in audio and telecom workloads.

Does the TMS320VC5501GZZ300 support SDRAM interfacing?

Yes, the TMS320VC5501GZZ300 supports SDRAM interfacing through its External Memory Interface (EMIF), with dedicated control signals (RAS, CAS, WE, CS) and programmable timing registers compliant with JEDEC standards. The TMS320VC5501GZZ300 datasheet specifies SDRAM command timings including ACTV, REFR, MRS, and CAS latency configurations. Users must initialize SDRAM via software-controlled EMIF registers before enabling burst reads/writes.

What is the function of the HPI interface on the TMS320VC5501GZZ300?

The Host Port Interface (HPI) on the TMS320VC5501GZZ300 is an 8-bit parallel bus (HPI_HD[7:0]) that allows an external host processor to directly read from and write to the TMS320VC5501GZZ300's internal memory map without CPU intervention. It supports both multiplexed and non-multiplexed addressing modes, and is commonly used for firmware loading, real-time parameter updates, and debug access. The TMS320VC5501GZZ300 implements HPI-8 mode exclusively.

Can the TMS320VC5501GZZ300 operate with a 1.8-V I/O supply?

No, the TMS320VC5501GZZ300 requires a nominal 3.3-V I/O supply (VDD_IO) across its entire specified operating range; operation at 1.8 V violates absolute maximum ratings and will result in undefined I/O behavior or permanent damage. The TMS320VC5501GZZ300's I/O buffers are designed for 3.3-V LVTTL/LVCMOS compatibility, and no internal level-shifting is provided. External voltage translators are required for interfacing with 1.8-V peripherals.

How much on-chip memory does the TMS320VC5501GZZ300 include?

The TMS320VC5501GZZ300 integrates 128K × 16-bit dual-access RAM (DARAM) and 64K × 16-bit mask-programmed ROM. The DARAM is organized into four 32K-word blocks, each supporting simultaneous read and write operations - critical for pipelined DSP algorithms. The ROM contains boot loader code and fixed-function routines. No additional on-chip SRAM or Flash is present; external memory expansion is managed via the EMIF. This memory configuration is fixed for the TMS320VC5501GZZ300 and cannot be altered by configuration bits.

TMS320VC5501GZZ300 Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
TMS320C55x
Package/Case:
201-LFBGA
Packaging:
Tube
Product Status:
Obsolete
Type:
Fixed Point
Interface:
Host Interface, I2C, McBSP, UART
Clock Rate:
300MHz
Non-Volatile Memory:
ROM (32kB)
On-Chip RAM:
48kB
Voltage - I/O:
3.30V
Voltage - Core:
1.26V
Operating Temperature:
-40°C ~ 85°C (TC)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
201-BGA MICROSTAR (15x15)

TMS320VC5501GZZ300 FAQ

1.How can I place an order for TMS320VC5501GZZ300 through Aetrix?

Please submit a Request for Quotation (RFQ) for TMS320VC5501GZZ300 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TMS320VC5501GZZ300 reliable?

The price and inventory of TMS320VC5501GZZ300 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMS320VC5501GZZ300 is usually 5 days.

3.What payment methods are accepted for TMS320VC5501GZZ300?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMS320VC5501GZZ300 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TMS320VC5501GZZ300?

TMS320VC5501GZZ300 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TMS320VC5501GZZ300 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TMS320VC5501GZZ300?

For technical support, including TMS320VC5501GZZ300 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMS320VC5501GZZ300 requirements.

6.How does Aetrix verify that TMS320VC5501GZZ300 is sourced from the original manufacturer or authorized distributors?

All TMS320VC5501GZZ300 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMS320VC5501GZZ300 meets industry standards.

7.What is the process for return or replacement of TMS320VC5501GZZ300?

All TMS320VC5501GZZ300 units undergo pre-shipment inspection (PSI). If there is an issue with TMS320VC5501GZZ300, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TMS320VC5501GZZ300 part is unused and in its original packaging.

Return procedure for TMS320VC5501GZZ300:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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