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Texas Instruments TMS320VC5502ZZZ300
- Part No.:
- TMS320VC5502ZZZ300
- Manufacturer:
- Texas Instruments
- Category:
- DSP (Digital Signal Processors)
- Package:
- 201-LFBGA
- Datasheet:
-
TMS320VC5502ZZZ300.pdf
- Description:
- IC FIXED POINT DSP 201-BGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,658
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Product details
Overview
TMS320VC5502ZZZ300 from Texas Instruments is a fixed-point digital signal processor (DSP) with 300 MHz CPU clock, 128K × 16-bit on-chip dual-access RAM (DARAM), and integrated peripherals including two multichannel buffered serial ports (McBSP), UART, I²C, HPI-8, and DMA controller - used in real-time audio processing, telecom baseband, and industrial motor control systems.
For engineers reviewing the TMS320VC5502ZZZ300 datasheet, TMS320VC5502ZZZ300 pinout, TMS320VC5502ZZZ300 application, or TMS320VC5502ZZZ300 equivalent, key selection considerations include its BGA-201 ZZZ package, 3.3-V I/O with 1.6-V core supply, PLL-based clock generation supporting 300-MHz operation, and boot-from-external-memory capability via EMIF.
Technical Context
The TMS320VC5502ZZZ300 implements a dual-MAC, 16-bit fixed-point C55x CPU architecture with instruction cache and parallel execution units optimized for low-power, deterministic signal processing. It supports multiple clock domains - C55x subsystem, fast peripherals, slow peripherals, and EMIF - each independently configurable via PLLDIV and CLKMD registers.
Its memory subsystem includes 32K × 16-bit on-chip ROM, 128K × 16-bit DARAM, and programmable external memory interface (EMIF) with asynchronous/synchronous DRAM support. Peripherals are accessed via memory-mapped registers and support autonomous operation via DMA and IDLE power management modes (IDLE2/IDLE3).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Clock Speed | 300 MHz - enables real-time execution of 10–20 MIPS per MHz for audio codec or filter algorithms. |
| Core Voltage | 1.6 V - reduces dynamic power consumption during high-throughput DSP computation. |
| I/O Voltage | 3.3 V - compatible with standard logic families and external memory interfaces without level-shifting. |
| On-Chip RAM | 128K × 16-bit dual-access RAM - allows simultaneous read/write access for coefficient/data buffering in FIR/IIR filters. |
| External Bus | 16-bit EMIF with programmable wait states - supports NOR flash, SRAM, and SDRAM for boot and data storage expansion. |
| Serial Interfaces | 2 × McBSP + UART + I²C - enables multi-channel audio streaming, host communication, and sensor configuration in embedded systems. |
| Power Modes | IDLE2 and IDLE3 with oscillator disable - reduces active current to <5 mA while retaining register context and enabling wake-up via GPIO or peripheral interrupt. |
Pinout & Package
The TMS320VC5502ZZZ300 uses a 201-ball microBGA (package code ZZZ) with 0.8-mm pitch, thermally enhanced construction for industrial temperature operation (–40°C to 85°C). Ball assignment follows TI's GZZ/ZZZ ball map (SPRS166K, Figure 2-1).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKIN | Input clock source | Accepts 1–20 MHz crystal or external oscillator; feeds PLL for internal 300-MHz SYSCLK generation. |
| CLKOUT | System clock output | Drives external logic or test equipment at selectable frequency (SYSCLK/2, /4, or /8) via CLKOUTSR register. |
| HCS, HR/W, HCNTL[1:0], HD[7:0] | HPI-8 host port interface | Enables 8-bit parallel host access to internal memory and registers without CPU intervention. |
| XF, FSX/FSR, DX/DR | McBSP control and data | Supports TDM, I²S, SPI, and AC97 protocols for stereo audio or multi-channel data transfer. |
| GPIO0–GPIO7 | General-purpose I/O | Configurable as inputs/outputs with interrupt capability; used for system reset coordination, status signaling, or mode selection. |
Key Features
| Feature | Design Value |
|---|---|
| Dual MAC Architecture | Executes two 16×16-bit multiply-accumulates per cycle - accelerates FIR filtering, FFT butterfly operations, and correlation tasks. |
| Instruction Cache (4K words) | Reduces external memory fetches for tight loops - improves code execution efficiency in real-time control firmware. |
| Programmable EMIF Timings | Independent setup/hold/wait controls per memory region - simplifies interface to diverse external memories without glue logic. |
| Auto-Wakeup from IDLE | McBSP and DMA can trigger wake-up without CPU involvement - enables ultra-low-power listening modes in voice-activated devices. |
| JTAG Boundary Scan (IEEE 1149.1) | Full IEEE-compliant test access port - supports production board-level testing and debug trace via XDS510 emulators. |
Applications
| Voice-Activated Remote Control | Industrial Motor Drive Controller |
|---|---|
Use Scenario: Low-power remote processes wake-word detection using FFT and energy thresholding before full-system activation. IC Role / Device Role / Timing Role: TMS320VC5502ZZZ300 acts as real-time audio front-end processor with McBSP receiving microphone data and DMA offloading samples to DARAM. Use Value: IDLE3 mode with oscillator disabled cuts standby current to <5 mA while maintaining GPIO-triggered wake-up latency under 10 µs. | Use Scenario: Closed-loop field-oriented control (FOC) of 3-phase PMSM motors with PWM generation and current sensing feedback. IC Role / Device Role / Timing Role: TMS320VC5502ZZZ300 executes FOC algorithm at 10–20 kHz update rate, synchronizing PWM outputs via GPIO and reading ADC via McBSP or EMIF. Use Value: Dual-MAC and 300-MHz clock enable sub-1-µs loop execution time, meeting IEC 61800-5 safety timing constraints. |
| Telecom Line Card Baseband | Portable Medical Ultrasound Front-End |
Use Scenario: DSL or VoIP line card performs echo cancellation, packetization, and jitter buffering in edge infrastructure. IC Role / Device Role / Timing Role: TMS320VC5502ZZZ300 serves as dedicated baseband processor interfacing to analog front-end via McBSP and to network controller via HPI-8. Use Value: 128K DARAM provides sufficient buffer space for 64-ms jitter buffer plus coefficient storage for 128-tap NLMS echo canceller. | Use Scenario: Battery-powered ultrasound device digitizes and beamforms RF echo signals from phased-array transducers. IC Role / Device Role / Timing Role: TMS320VC5502ZZZ300 performs real-time digital beamforming using delay-and-sum algorithm on 16-channel input streams. Use Value: Dual-access RAM allows concurrent McBSP data ingestion and MAC-based delay calculation - sustaining >100 million MACs/sec throughput. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar fixed-point DSP applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMS320VC5509APGE | 200-MHz CPU, 64K DARAM, 144-pin LQFP package - lower performance, higher pin count, no ZZZ BGA option. | Limited memory bandwidth for multi-channel beamforming; lacks IDLE3 oscillator disable for ultra-low-power listen modes. | Select when PCB layout requires QFP or cost-sensitive designs tolerate reduced throughput and memory. |
| TMS320C5515AZHH | 120-MHz CPU, 320K DARAM, 196-pin BGA - newer C55+ ISA, USB OTG, but lower clock speed and different peripheral set. | No HPI-8 or McBSP2; USB replaces one serial port - unsuitable for legacy host-processor co-designs requiring HPI. | Choose only if migrating to USB-connected audio endpoints and accepting 40% lower MAC throughput. |
Compared with TMS320VC5502ZZZ300, the TMS320VC5509APGE offers simpler packaging but sacrifices 33% clock speed and half the on-chip RAM, while the TMS320C5515AZHH trades raw compute density for modern connectivity - neither matches the TMS320VC5502ZZZ300's balance of 300-MHz deterministic processing, HPI-8 integration, and ultra-low-power IDLE3 mode in a compact BGA.
Availability
TMS320VC5502ZZZ300 is available at Aetrix Electronics and suitable for voice-activated consumer electronics, industrial motor drives, telecom line cards, and portable medical imaging systems requiring stable component supply across extended product lifecycles.
Supply support for TMS320VC5502ZZZ300 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, specializing in analog, embedded processing, and digital signal processing technologies for industrial, automotive, and communications markets.
The TMS320C55x DSP platform - including the TMS320VC5502ZZZ300 - was engineered for ultra-low-power, high-efficiency fixed-point signal processing in battery-constrained and thermally sensitive embedded systems.
FAQ
What is the maximum operating frequency of the TMS320VC5502ZZZ300?
The TMS320VC5502ZZZ300 operates at a maximum CPU clock frequency of 300 MHz, achieved using its on-chip PLL with an external 12.288-MHz crystal or other supported input frequencies. This rating is specified under recommended operating conditions (1.6-V core, 3.3-V I/O, –40°C to 85°C) and validated per SPRS166K electrical characteristics tables.
Does the TMS320VC5502ZZZ300 support boot from external memory?
Yes, the TMS320VC5502ZZZ300 supports boot from external memory via its EMIF, configured through GPIO6/GPIO7 strap pins at reset. Supported boot sources include 8-/16-bit asynchronous memory (NOR flash, EPROM) and synchronous DRAM, with boot loader executing from on-chip ROM before copying application code into DARAM.
What power-saving modes does the TMS320VC5502ZZZ300 provide?
The TMS320VC5502ZZZ300 implements IDLE2 and IDLE3 modes. IDLE3 disables the internal oscillator and reduces current draw to under 5 mA while preserving register and memory contents. Wake-up is supported via GPIO, McBSP activity, or DMA completion - all documented in Section 3.11 of SPRS166K.
Is the TMS320VC5502ZZZ300 pin-compatible with other C55x family members?
No, the TMS320VC5502ZZZ300 in its ZZZ 201-ball BGA package is not pin-compatible with other C55x variants such as the VC5509A (LQFP) or C5515 (different BGA layout). Pin assignments, power sequencing, and ball functions are specific to the ZZZ mechanical footprint and electrical design requirements outlined in SPRS166K Section 2.2.1.
What development tools are officially supported for the TMS320VC5502ZZZ300?
Texas Instruments officially supports Code Composer Studio v3.3 (legacy) with C55x compiler v4.2.x, XDS510-class JTAG emulators, and the TMS320VC5502 EVM (Evaluation Module). TI's C55x DSP/BIOS real-time kernel and IQMath library are also validated for the TMS320VC5502ZZZ300 per SPRS166K documentation and application notes.
TMS320VC5502ZZZ300 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- TMS320C55x
- Package/Case:
- 201-LFBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Type:
- Fixed Point
- Interface:
- Host Interface, I2C, McBSP, UART
- Clock Rate:
- 300MHz
- Non-Volatile Memory:
- ROM (32kB)
- On-Chip RAM:
- 80kB
- Voltage - I/O:
- 3.30V
- Voltage - Core:
- 1.26V
- Operating Temperature:
- -40°C ~ 85°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 201-BGA MICROSTAR (15x15)
TMS320VC5502ZZZ300 FAQ
1.How can I place an order for TMS320VC5502ZZZ300 through Aetrix?
Please submit a Request for Quotation (RFQ) for TMS320VC5502ZZZ300 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TMS320VC5502ZZZ300 reliable?
The price and inventory of TMS320VC5502ZZZ300 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMS320VC5502ZZZ300 is usually 5 days.
3.What payment methods are accepted for TMS320VC5502ZZZ300?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMS320VC5502ZZZ300 transactions.
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4.How is shipping managed for TMS320VC5502ZZZ300?
TMS320VC5502ZZZ300 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TMS320VC5502ZZZ300 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TMS320VC5502ZZZ300?
For technical support, including TMS320VC5502ZZZ300 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMS320VC5502ZZZ300 requirements.
6.How does Aetrix verify that TMS320VC5502ZZZ300 is sourced from the original manufacturer or authorized distributors?
All TMS320VC5502ZZZ300 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMS320VC5502ZZZ300 meets industry standards.
7.What is the process for return or replacement of TMS320VC5502ZZZ300?
All TMS320VC5502ZZZ300 units undergo pre-shipment inspection (PSI). If there is an issue with TMS320VC5502ZZZ300, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TMS320VC5502ZZZ300 part is unused and in its original packaging.
Return procedure for TMS320VC5502ZZZ300:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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