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Texas Instruments TMS320VC5503GHH
- Part No.:
- TMS320VC5503GHH
- Manufacturer:
- Texas Instruments
- Category:
- DSP (Digital Signal Processors)
- Package:
- 179-LFBGA
- Datasheet:
-
TMS320VC5503GHH.pdf
- Description:
- IC FIXED-POINT DSP 179-BGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,100
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Product details
Overview
TMS320VC5503GHH from Texas Instruments is a fixed-point digital signal processor (DSP) optimized for low-power, real-time signal processing in embedded audio, voice, and communications systems. It operates at up to 200 MHz (CVDD = 1.6 V), integrates 320 KB on-chip memory (64 KB DARAM + 256 KB ROM), supports dual-operand MAC, 16-bit parallel McBSPs, I²C, EHPI, and GPIO, and targets portable voice recorders, VoIP terminals, and industrial sensor analytics.
For engineers reviewing the TMS320VC5503GHH datasheet, TMS320VC5503GHH pinout, TMS320VC5503GHH application, or TMS320VC5503GHH equivalent, key selection criteria include its 179-ball BGA (GHH) package, 200-MHz peak performance with 1.6-V supply, dual-McBSP interface for multi-channel audio streaming, boot-from-external-memory capability, and integrated real-time clock oscillator support.
Technical Context
The TMS320VC5503GHH implements a modified Harvard architecture with separate program and data buses, enabling simultaneous instruction fetch and data access. Its CPU core features two 40-bit accumulators, dual 16×16-bit MAC units, and a 16-bit ALU with barrel shifter - supporting single-cycle execution of common DSP operations including FIR/IIR filtering and FFT butterfly stages.
Memory subsystem includes 64 KB on-chip dual-access RAM (DARAM) partitioned into four 16-KB blocks for concurrent read/write access, plus 256 KB mask-programmed ROM containing boot loader and standard math functions. External memory interface supports asynchronous SRAM, EPROM, and synchronous SDRAM with programmable timing control via EMIF registers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Type | Fixed-point C55x DSP core with dual-MAC, 40-bit accumulators, and 16-bit ALU - enables efficient execution of real-time audio codecs and control algorithms. |
| Max Clock Frequency | 200 MHz at CVDD = 1.6 V - delivers 400 MIPS peak performance suitable for multi-channel voice processing without external acceleration. |
| On-Chip Memory | 64 KB DARAM + 256 KB ROM - eliminates need for external boot ROM and reduces latency-critical data access in filter banks and buffer management. |
| Peripherals | Three multichannel buffered serial ports (McBSP0–2), I²C, enhanced host-port interface (EHPI), 16-bit GPIO, and two 32-bit timers - supports simultaneous audio I/O, host co-processor communication, and system supervision. |
| Package | 179-ball BGA (GHH, 12 mm × 12 mm, 0.8-mm pitch) - compact footprint compatible with high-density portable PCB layouts and thermal constraints under 1.2-W typical power dissipation. |
| Supply Voltage | CVDD = 1.2 V / 1.35 V / 1.6 V (configurable) - enables dynamic voltage scaling to balance performance vs. battery life in portable applications. |
| Boot Options | Supports boot from internal ROM, external parallel memory (8/16-bit), or serial EEPROM via I²C - simplifies firmware update and field reconfiguration without JTAG dependency. |
Pinout & Package
Package: 179-ball BGA (GHH), 12 mm × 12 mm, 0.8-mm pitch, RoHS-compliant, thermally enhanced bottom-side thermal pad.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKIN | External clock input or crystal oscillator connection | Accepts 1–20 MHz crystal or CMOS clock source; feeds internal PLL/DPLL for system clock generation up to 200 MHz. |
| CLKOUT | System clock output | Provides buffered 200-MHz clock for synchronizing external peripherals such as ADCs or SDRAM controllers. |
| D[15:0] | 16-bit bidirectional data bus | Used for parallel memory access (EMIF) and EHPI host interface; bus keepers enabled at reset to prevent floating states. |
| A[22:0] | 23-bit address bus | Drives external memory and peripheral address space; supports up to 8-MB external memory mapping with configurable wait-state control. |
| XF | External flag output | General-purpose output signal for inter-processor signaling or hardware handshake with external logic or FPGAs. |
| MCBSP0 DX/DR | Serial data transmit/receive | Full-duplex audio/data interface supporting TI-specific framing, I²S, and SPI-compatible modes for codec interfacing. |
Key Features
| Feature | Design Value |
|---|---|
| Dual 16×16-bit MAC units | Enables single-cycle execution of two multiply-accumulate operations - critical for real-time FIR filtering and adaptive noise cancellation. |
| 64 KB on-chip dual-access RAM | Allows simultaneous read and write to same memory block - eliminates pipeline stalls during coefficient/data buffering in FFT or convolution kernels. |
| Three independent McBSPs | Supports concurrent stereo audio capture (McBSP0), playback (McBSP1), and auxiliary control channel (McBSP2) - ideal for full-duplex VoIP endpoints. |
| Enhanced Host-Port Interface (EHPI) | 16-bit parallel slave interface with auto-increment addressing - enables seamless firmware loading and real-time parameter updates from ARM or microcontroller hosts. |
| Real-time clock oscillator support | Dedicated RTC crystal input (32.768 kHz) with internal oscillator circuit - provides accurate timekeeping for timestamping sensor events or scheduling periodic tasks. |
Applications
| Voice-over-IP Terminal | Industrial Audio Analytics |
|---|---|
Use Scenario: Real-time G.729/G.723.1 speech encoding/decoding with echo cancellation in SIP-based desk phones. IC Role / Device Role / Timing Role: Primary DSP executing codec algorithms, managing McBSP-linked audio codecs, and handling packetized data via EHPI-hosted Ethernet controller. Use Value: 200-MHz processing headroom ensures sub-15-ms algorithm latency while maintaining <100-mW active power draw under CVDD = 1.35 V. | Use Scenario: Vibration signature analysis in predictive maintenance systems using MEMS accelerometers and FFT-based spectral decomposition. IC Role / Device Role / Timing Role: Real-time preprocessing engine capturing 16-bit sensor streams via McBSP0, performing windowed FFTs in DARAM, and forwarding results via I²C to MCU host. Use Value: On-chip 64 KB DARAM eliminates external SRAM, reducing BOM cost and board area while sustaining 10-kHz sampling throughput. |
| Portable Voice Recorder | Smart Home Audio Hub |
Use Scenario: High-fidelity voice recording with AGC, noise suppression, and MP3 encoding in handheld devices powered by single-cell Li-ion. IC Role / Device Role / Timing Role: Standalone audio processor handling analog front-end (AFE) interface, digital gain control, and compressed file generation stored on SD card via EMIF. Use Value: Dynamic voltage scaling (1.2 V @ 108 MHz) extends battery life to >10 hours while preserving 16-bit linear PCM fidelity. | Use Scenario: Multi-microphone beamforming and wake-word detection in always-on smart speaker platforms. IC Role / Device Role / Timing Role: Low-latency preprocessing unit receiving eight-channel PDM microphone inputs via McBSP0/1, applying delay-and-sum beamforming, and passing clean audio to application processor. Use Value: Dual-MAC architecture executes 8-channel FIR filters in <200 µs per frame - meeting strict 10-ms response window for keyword spotting. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar fixed-point DSP applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMS320VC5502GHH | Same GHH package, but max 144 MHz (CVDD = 1.35 V), 128 KB ROM, no RTC oscillator support. | Lacks real-time clock and lower frequency limits use in time-synchronized sensor networks or long-duration recording. | Select when cost-sensitive designs require reduced performance headroom and omit RTC functionality. |
| TMS320VC5509APGE | 144-pin LQFP (PGE) package, identical core/peripherals, but different pinout and thermal profile; supports same 200-MHz operation. | Requires PCB redesign due to incompatible footprint and routing; less suitable for space-constrained portable designs. | Choose only if legacy PGE-layout compatibility or hand-soldering requirements outweigh BGA assembly advantages. |
Compared with TMS320VC5502GHH, the TMS320VC5503GHH adds RTC support and 56 MHz higher peak frequency; versus TMS320VC5509APGE, it offers superior thermal performance and smaller footprint in the same functional family - making it optimal for next-generation portable audio edge nodes.
Availability
TMS320VC5503GHH is available at Aetrix Electronics and suitable for voice-over-IP terminals, portable voice recorders, and industrial audio analytics requiring stable component supply across extended production lifecycles.
Supply support for TMS320VC5503GHH includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies with over 50 years of innovation in DSP architecture and low-power design.
The TMS320C55x™ DSP platform was engineered for ultra-low-power, high-efficiency fixed-point signal processing in battery-operated and thermally constrained embedded systems - emphasizing real-time determinism and peripheral integration.
FAQ
What is the maximum operating frequency of the TMS320VC5503GHH and under what conditions?
The TMS320VC5503GHH achieves a maximum operating frequency of 200 MHz when supplied with CVDD = 1.6 V and operated within the recommended case temperature range. This rating is validated per Section 5.2.3 of the SPRS245J datasheet and requires proper decoupling and thermal management to sustain continuous operation. The TMS320VC5503GHH supports lower frequencies (144 MHz at 1.35 V, 108 MHz at 1.2 V) for dynamic power scaling.
Does the TMS320VC5503GHH support booting from external memory, and which interfaces are available?
Yes, the TMS320VC5503GHH supports booting from external memory via its external memory interface (EMIF), configured for 8-bit or 16-bit parallel access to SRAM, EPROM, or Flash. It also supports I²C boot from serial EEPROM, as documented in Section 3.1.4 and Table 3−2 of the SPRS245J datasheet. The TMS320VC5503GHH does not support SPI or UART boot modes.
How many multichannel buffered serial ports (McBSPs) does the TMS320VC5503GHH integrate, and what protocols do they support?
The TMS320VC5503GHH integrates three independent multichannel buffered serial ports (McBSP0, McBSP1, and McBSP2), each supporting TI-specific framing, I²S, left-justified, right-justified, and SPI master/slave modes. All McBSPs operate at programmable bit clocks up to 50 MHz and include dedicated CLKX/CLKR, FSX/FSR, and DX/DR signals - confirmed in Sections 3.4 and Tables 3−22 through 3−24 of SPRS245J. The TMS320VC5503GHH does not support TDM slot counts beyond 32 per frame.
What is the on-chip memory configuration of the TMS320VC5503GHH, and how is it allocated?
The TMS320VC5503GHH contains 64 KB of on-chip dual-access RAM (DARAM), organized as four 16-KB blocks (0–3), and 256 KB of mask-programmed ROM. DARAM supports simultaneous read/write access to different blocks, enabling zero-wait-state execution of tight loops and coefficient/data buffering. ROM stores the boot loader, C runtime library, and optimized math functions - detailed in Sections 3.1.1–3.1.2 and Table 3−1 of SPRS245J. The TMS320VC5503GHH has no cache or instruction RAM.
Is the TMS320VC5503GHH pin-compatible with other C55x-family devices such as the TMS320VC5509A?
No, the TMS320VC5503GHH is not pin-compatible with the TMS320VC5509A. While both share the same C55x core and peripheral set, the TMS320VC5503GHH uses a 179-ball BGA (GHH) package, whereas the TMS320VC5509A uses a 144-pin LQFP (PGE) package with entirely different pin assignments and signal routing - as shown in Figures 2−1 and 2−2 and Tables 2−1 and 2−2 of SPRS245J. Board-level substitution requires full layout redesign.
TMS320VC5503GHH Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- TMS320C55x
- Package/Case:
- 179-LFBGA
- Packaging:
- Tube
- Product Status:
- Obsolete
- Type:
- Fixed Point
- Interface:
- Host Interface, I2C, McBSP
- Clock Rate:
- 200MHz
- Non-Volatile Memory:
- ROM (64kB)
- On-Chip RAM:
- 64kB
- Voltage - I/O:
- 3.00V, 3.30V
- Voltage - Core:
- 1.60V
- Operating Temperature:
- -40°C ~ 85°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 179-BGA MicroStar (12x12)
TMS320VC5503GHH FAQ
1.How can I place an order for TMS320VC5503GHH through Aetrix?
Please submit a Request for Quotation (RFQ) for TMS320VC5503GHH on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TMS320VC5503GHH reliable?
The price and inventory of TMS320VC5503GHH are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMS320VC5503GHH is usually 5 days.
3.What payment methods are accepted for TMS320VC5503GHH?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMS320VC5503GHH transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TMS320VC5503GHH?
TMS320VC5503GHH orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TMS320VC5503GHH order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TMS320VC5503GHH?
For technical support, including TMS320VC5503GHH datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMS320VC5503GHH requirements.
6.How does Aetrix verify that TMS320VC5503GHH is sourced from the original manufacturer or authorized distributors?
All TMS320VC5503GHH products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMS320VC5503GHH meets industry standards.
7.What is the process for return or replacement of TMS320VC5503GHH?
All TMS320VC5503GHH units undergo pre-shipment inspection (PSI). If there is an issue with TMS320VC5503GHH, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TMS320VC5503GHH part is unused and in its original packaging.
Return procedure for TMS320VC5503GHH:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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