Texas Instruments TMS320VC5503PGE
- Part No.:
- TMS320VC5503PGE
- Manufacturer:
- Texas Instruments
- Category:
- DSP (Digital Signal Processors)
- Package:
- 144-LQFP
- Datasheet:
-
TMS320VC5503PGE.pdf
- Description:
- IC FIXED-POINT DSP 144-LQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
TMS320VC5503PGE from Texas Instruments is a fixed-point digital signal processor (DSP) optimized for low-power, high-performance embedded audio and voice processing. It features a 16-bit dual-MAC CPU core, 320 KB on-chip memory (192 KB DARAM + 128 KB ROM), 144-pin LQFP package, and operates up to 200 MHz at 1.6 V CVDD. It supports real-time audio codecs, echo cancellation, and speech enhancement in portable communication devices.
For engineers reviewing the TMS320VC5503PGE datasheet, TMS320VC5503PGE pinout, TMS320VC5503PGE application, or TMS320VC5503PGE equivalent, key selection criteria include its 200-MHz fixed-point throughput, integrated McBSPs for codec interfacing, EHPI host-port interface for system-level control, and low-voltage operation down to 1.2 V for battery-powered designs.
Technical Context
The TMS320VC5503PGE implements a modified Harvard architecture with separate program and data buses, enabling simultaneous instruction fetch and dual-data access. Its CPU includes two 17×17-bit MAC units, a 40-bit ALU, and a 40-bit barrel shifter - all supporting single-cycle execution of common DSP instructions like FIR, IIR, and FFT kernels.
It integrates three multichannel buffered serial ports (McBSP0–2) supporting TI-AIC, I2S, and SPI protocols; an enhanced host-port interface (EHPI) for external master access to internal memory and registers; and configurable external memory interfaces supporting asynchronous SRAM, SDRAM, and ROM expansion up to 8 MB.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | 16-bit fixed-point TMS320C55x DSP core with dual MAC, 40-bit ALU, and 6-stage pipeline |
| Max Clock Frequency | 200 MHz at 1.6 V CVDD - enables 400 MMAC/s sustained throughput for real-time audio filtering |
| On-Chip Memory | 192 KB dual-access RAM (DARAM) + 128 KB ROM - supports zero-wait-state execution and dual-operand fetches |
| Peripherals | 3 × McBSP (I2S/SPI/TI-AIC), 1 × I²C, 1 × EHPI, 3 × 16-bit timers, GPIO, and DMA controller with 6 channels |
| Package | 144-pin LQFP (PGE), 20 mm × 20 mm, 0.5 mm pitch - compatible with standard surface-mount assembly processes |
| Supply Voltage | CVDD = 1.2 V (108 MHz), 1.35 V (144 MHz), or 1.6 V (200 MHz); I/O voltage = 3.3 V - enables dynamic voltage scaling |
| Operating Temperature | –40°C to +85°C case temperature - qualified for industrial and automotive cabin applications |
Pinout & Package
The TMS320VC5503PGE is housed in a 144-pin Low-Profile Quad Flatpack (LQFP) package (PGE), measuring 20 mm × 20 mm with 0.5 mm lead pitch. Thermal resistance θJA is 36.5°C/W, supporting convection-cooled PCB layouts without heatsinks in typical audio processing loads.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKIN | External clock input or crystal oscillator connection | Accepts 1–20 MHz crystal or CMOS clock; feeds internal DPLL for frequency synthesis up to 200 MHz |
| CLKOUT | System clock output | Drives external logic or clock distribution; configurable as divided-by-1, -2, or -4 version of internal CLK |
| XF | External flag output | General-purpose synchronous output for inter-DSP signaling or peripheral handshaking |
| HINT | Host interrupt input | Active-low signal indicating host (e.g., ARM MCU) requests service via EHPI interface |
| EMIF_A[19:0] | External memory address bus | 20-bit multiplexed address/data bus supporting 1-MB external memory space (expandable to 8 MB with bank switching) |
| EMIF_D[15:0] | External memory data bus | 16-bit bidirectional bus with keepers enabled at reset - eliminates need for external pull-ups in idle state |
Key Features
| Feature | Design Value |
|---|---|
| Dual-MAC Architecture | Two independent 17×17-bit multipliers deliver 400 MMAC/s at 200 MHz - accelerates convolution, correlation, and adaptive filtering |
| On-Chip DARAM | 192 KB of dual-access RAM allows simultaneous read/write of two operands per cycle - critical for zero-overhead loop execution |
| Enhanced Host-Port Interface (EHPI) | 16-bit parallel interface enabling external masters to directly read/write internal memory and registers without CPU intervention |
| Three McBSPs | Each supports I2S, SPI, or TI-AIC modes with independent clocks and frame sync - enables concurrent connection to stereo codec, flash memory, and sensor interface |
| Dynamic Power Management | Supports IDLE, STANDBY, and power-down modes with wake-up via timer, external interrupt, or HINT - extends battery life in portable voice recorders |
Applications
| Voice Communication Terminal | Portable Audio Player |
|---|---|
Use Scenario: Full-duplex VoIP terminal with acoustic echo cancellation and noise suppression. IC Role / Device Role / Timing Role: Primary DSP executing real-time AEC, NS, and G.729/G.722 codec algorithms with deterministic sub-10-ms latency. Use Value: On-chip DARAM and dual-MAC enable concurrent 2-channel 16-kHz processing at ≤50% CPU load, freeing host MCU for UI and network stack. | Use Scenario: Battery-powered MP3/WMA player with EQ, bass boost, and crossfade. IC Role / Device Role / Timing Role: Dedicated audio co-processor handling decode, sample-rate conversion, and effects - offloads main application processor. Use Value: 200-MHz fixed-point performance delivers >20× real-time decode margin for 128-kbps MP3, while 1.2-V low-power mode extends playback to 18+ hours. |
| Industrial Voice Recorder | Smart Home Speaker Controller |
Use Scenario: Ruggedized field recorder capturing and compressing voice notes in noisy environments. IC Role / Device Role / Timing Role: Standalone DSP managing microphone preamp gain control, AGC, ADPCM compression, and SD card write buffering. Use Value: Integrated McBSP and EMIF allow direct connection to analog front-end and SDIO/SDMMC interface - no external glue logic required. | Use Scenario: Compact speaker with far-field wake-word detection and local voice command processing. IC Role / Device Role / Timing Role: Edge-processing DSP running keyword spotting (KWS) and beamforming before sending audio to cloud ASR. Use Value: Low-voltage operation (1.2 V @ 108 MHz) and IDLE-mode wake-on-voice reduce average power to <5 mW during listening - enabling always-on capability. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar fixed-point DSP applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMS320VC5502PGE | Same architecture but max 144 MHz at 1.35 V; 128 KB DARAM + 64 KB ROM - 33% less on-chip memory | Suitable for lower-complexity codecs (e.g., G.723.1) or single-channel processing only | Select when cost sensitivity outweighs need for 200-MHz headroom or dual-channel real-time processing |
| ADSP-21992BSTZ | Analog Devices SHARC-based 32-bit floating-point DSP; higher precision but larger footprint and higher power | Better suited for high-fidelity audio synthesis or complex matrix math where fixed-point quantization causes audible artifacts | Choose for applications requiring >96 dB SNR or IEEE-754 compliance - not a drop-in replacement |
Compared with TMS320VC5502PGE, the TMS320VC5503PGE delivers 39% higher MAC throughput and 50% more on-chip memory, enabling richer feature sets in voice terminals; versus ADSP-21992BSTZ, it offers lower BOM cost and power but requires fixed-point algorithm porting.
Availability
TMS320VC5503PGE is available at Aetrix Electronics and suitable for voice communication terminals, portable audio players, industrial voice recorders, and smart home speaker controllers requiring stable component supply across extended product lifecycles.
Supply support for TMS320VC5503PGE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of DSP innovation rooted in the TMS320 family.
The TMS320VC5503 belongs to TI's C55x ultra-low-power fixed-point DSP product line, designed specifically for battery-operated voice, audio, and sensor-edge applications demanding high MIPS/Watt efficiency.
FAQ
What is the maximum operating frequency of the TMS320VC5503PGE?
The TMS320VC5503PGE supports three operating points: 108 MHz at 1.2 V CVDD, 144 MHz at 1.35 V CVDD, and 200 MHz at 1.6 V CVDD. The 200-MHz rating is specified over the full industrial temperature range (–40°C to +85°C) and requires proper decoupling and thermal layout per TI's PCB guidelines in SPRS245J Section 6.2.
Does the TMS320VC5503PGE support external memory expansion?
Yes, the TMS320VC5503PGE includes a configurable external memory interface (EMIF) supporting asynchronous SRAM, ROM, and SDRAM. It provides 20-bit address lines (A[19:0]) and 16-bit data lines (D[15:0]), enabling up to 8 MB of external memory space using bank switching - verified in SPRS245J Sections 3.5 and 5.7.
How many serial interfaces does the TMS320VC5503PGE integrate?
The TMS320VC5503PGE integrates three multichannel buffered serial ports (McBSP0, McBSP1, McBSP2), each configurable for I2S, SPI, or TI-AIC protocols, plus one dedicated I²C module. All McBSPs support independent clock and frame-sync generation - confirmed in SPRS245J Sections 3.4 and 3.14.
What power-saving modes are available on the TMS320VC5503PGE?
The TMS320VC5503PGE supports IDLE, STANDBY, and power-down modes. IDLE halts CPU clocks while preserving register and memory contents; STANDBY disables PLL and most peripherals; power-down shuts down all clocks and supplies except RTC. Wake-up is supported via timer, external interrupt, or HINT signal - detailed in SPRS245J Section 3.10.3.
Is the TMS320VC5503PGE pin-compatible with other C55x family members?
No, the TMS320VC5503PGE is not pin-compatible with earlier C55x devices such as the TMS320VC5501 or TMS320VC5502 due to differences in peripheral mapping, power pin allocation, and EMIF signal routing. Pin assignments for the PGE package are unique to this device and documented in Table 2–2 of SPRS245J.
TMS320VC5503PGE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- TMS320C55x
- Package/Case:
- 144-LQFP
- Packaging:
- Bulk
- Product Status:
- Active
- Type:
- Fixed Point
- Interface:
- Host Interface, I2C, McBSP
- Clock Rate:
- 200MHz
- Non-Volatile Memory:
- ROM (64kB)
- On-Chip RAM:
- 64kB
- Voltage - I/O:
- 3.00V, 3.30V
- Voltage - Core:
- 1.60V
- Operating Temperature:
- -40°C ~ 85°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 144-LQFP (20x20)
TMS320VC5503PGE FAQ
1.How can I place an order for TMS320VC5503PGE through Aetrix?
Please submit a Request for Quotation (RFQ) for TMS320VC5503PGE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TMS320VC5503PGE reliable?
The price and inventory of TMS320VC5503PGE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMS320VC5503PGE is usually 5 days.
3.What payment methods are accepted for TMS320VC5503PGE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMS320VC5503PGE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TMS320VC5503PGE?
TMS320VC5503PGE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TMS320VC5503PGE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TMS320VC5503PGE?
For technical support, including TMS320VC5503PGE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMS320VC5503PGE requirements.
6.How does Aetrix verify that TMS320VC5503PGE is sourced from the original manufacturer or authorized distributors?
All TMS320VC5503PGE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMS320VC5503PGE meets industry standards.
7.What is the process for return or replacement of TMS320VC5503PGE?
All TMS320VC5503PGE units undergo pre-shipment inspection (PSI). If there is an issue with TMS320VC5503PGE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TMS320VC5503PGE part is unused and in its original packaging.
Return procedure for TMS320VC5503PGE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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