Texas Instruments TMS320VC5503ZHH

Overview

TMS320VC5503ZHH from Texas Instruments is a fixed-point digital signal processor (DSP) featuring dual-MAC architecture, 192K × 16-bit on-chip RAM (64K DARAM + 128K ROM), 200-MHz operation at 1.6-V core voltage, 179-ball BGA (GHH) package, and integrated peripherals including three McBSPs, I²C, EHPI, and DMA controller - deployed in real-time audio codecs and telecom baseband processing.

For engineers reviewing the TMS320VC5503ZHH datasheet, TMS320VC5503ZHH pinout, TMS320VC5503ZHH application, or TMS320VC5503ZHH equivalent, key selection criteria include its 200-MHz fixed-point throughput, GHH package thermal profile, boot-from-parallel-flash capability, and McBSP-based multichannel serial interface timing compliance with TDM and SPI modes.

Technical Context

The TMS320VC5503ZHH implements a modified Harvard architecture with separate program and data buses, dual 17×17-bit MAC units enabling 400 MMACS peak performance, and memory-mapped register space for peripheral control. Its CPU supports conditional execution, circular buffering, and zero-overhead looping to optimize signal-processing kernels.

Peripherals include three independent Multichannel Buffered Serial Ports (McBSP0–2) supporting TDM, I²S, AC97, and SPI protocols; an Enhanced Host-Port Interface (EHPI) for host-DSP memory access; and configurable external memory interface supporting asynchronous SRAM, SDRAM, and flash with programmable wait-state control.

Key Specifications

Pinout & Package

179-ball BGA package (GHH) with 0.8-mm pitch, 12 mm × 12 mm body, and thermally enhanced exposed pad. Pinout defined per SPRS245J Section 2.2.1 and Table 2−1, supporting full multiplexed EMIF, McBSP, I²C, EHPI, and timer signals across ball rows A–R and columns 1–13.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar fixed-point DSP applications.

Compared with TMS320C5515ZAY, the TMS320VC5503ZHH delivers higher deterministic throughput and tighter thermal footprint but lacks USB/LCD; versus TMS320C5502PGF, it doubles clock rate and memory while shifting to BGA for improved signal integrity in high-speed EMIF designs.

Availability

TMS320VC5503ZHH is available at Aetrix Electronics and suitable for voice band modems, industrial audio analytics, telecom baseband processing, and medical ultrasound beamforming requiring stable component supply across extended product lifecycles.

Supply support for TMS320VC5503ZHH includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies with over 50 years of innovation in DSP architecture.

The TMS320VC5503ZHH belongs to TI's C55x fixed-point DSP family, designed specifically for ultra-low-power, high-MIPS-per-mW real-time signal processing in battery-operated and thermally constrained edge devices.

FAQ

What is the maximum operating frequency of the TMS320VC5503ZHH and under what voltage condition?

The TMS320VC5503ZHH operates at a maximum frequency of 200 MHz when supplied with CVDD = 1.6 V, as specified in SPRS245J Section 5.2.3. At this voltage, the device achieves 400 MMACS peak performance. Lower voltage options (1.35 V @ 144 MHz, 1.2 V @ 108 MHz) enable dynamic power scaling for thermal or energy-constrained deployments. The TMS320VC5503ZHH must not exceed absolute maximum ratings - including 1.8 V on CVDD - to ensure reliability.

Does the TMS320VC5503ZHH support booting from external flash memory, and which interface is used?

Yes, the TMS320VC5503ZHH supports booting from external parallel flash memory via its External Memory Interface (EMIF) using the boot mode pins (BOOTM[3:0]) configured for EMIF boot. This mode loads program code into on-chip RAM upon reset, enabling standalone operation without host intervention. The TMS320VC5503ZHH also supports alternative boot sources including HPI and UART, but EMIF boot is the most common for field-deployed signal-processing firmware.

How many McBSP peripherals does the TMS320VC5503ZHH integrate, and what protocols do they support?

The TMS320VC5503ZHH integrates three independent Multichannel Buffered Serial Ports (McBSP0, McBSP1, McBSP2), each supporting TDM, I²S, AC97, and SPI master/slave protocols. Each McBSP features programmable clock and frame sync polarity, sample rate generators, and automatic word length configuration. The TMS320VC5503ZHH McBSPs are fully compatible with TI audio codecs such as the AIC23 and TLV320AIC3101, enabling direct connection without level-shifting or protocol translation.

What package type and thermal characteristics apply to the TMS320VC5503ZHH?

The TMS320VC5503ZHH uses a 179-ball fine-pitch BGA package (GHH), measuring 12 mm × 12 mm with 0.8-mm ball pitch and an exposed thermal pad. Per SPRS245J Section 6.1, its junction-to-ambient thermal resistance (θ_JA) is 32.5°C/W under standard JEDEC 2-layer board conditions. This thermal profile allows sustained 200-MHz operation in industrial ambient temperatures up to +85°C when paired with moderate copper pour and airflow.

Can the TMS320VC5503ZHH interface directly with a 3.3-V host processor via its EHPI, and what signaling voltage is required?

Yes, the TMS320VC5503ZHH EHPI interface operates at I/OVDD = 3.3 V and is fully compatible with standard 3.3-V CMOS logic levels. All EHPI signals - including HD[15:0], HCS, HDS1/HDS2, HRS, HWR, HRW, and HSTROBE - are 3.3-V tolerant and require no level translation when interfacing with ARM9, Cortex-M4, or FPGA hosts. The TMS320VC5503ZHH EHPI supports both non-multiplexed and multiplexed (HPID) modes with auto-increment addressing, enabling efficient host-side memory-mapped access to DSP internal RAM and registers.