Texas Instruments TMS320VC5507ZHH

Overview

TMS320VC5507ZHH from Texas Instruments is a fixed-point digital signal processor (DSP) optimized for low-power, high-performance audio and telecom applications. It operates at up to 200 MHz (CVDD = 1.6 V), integrates 320 KB on-chip memory (128 KB DARAM + 64 KB SARAM + 128 KB ROM), supports dual-external memory interfaces (EMIF + EHPI), and features three multichannel buffered serial ports (McBSPs), I²C, USB 1.1, and real-time clock oscillator - deployed in voice codecs, VoIP gateways, and portable medical signal analyzers.

For engineers reviewing the TMS320VC5507ZHH datasheet, TMS320VC5507ZHH pinout, TMS320VC5507ZHH application, or TMS320VC5507ZHH equivalent, key selection criteria include its 179-ball BGA (GHH) package, 1.2–1.6 V core voltage scalability, 200-MHz peak instruction rate (400 MIPS), integrated USB PHY timing control, and boot-from-parallel-flash capability via EHPI or EMIF.

Technical Context

The TMS320VC5507ZHH implements a dual-MAC, 16-bit fixed-point architecture with Harvard memory bus structure and six-level pipeline. Its memory subsystem includes configurable DARAM blocks supporting simultaneous read/write access and SDRAM/ASRAM interfacing via 16-bit EMIF with programmable wait-state control.

Peripherals include three McBSPs supporting TI-AIC, I²S, and SPI protocols; an enhanced host-port interface (EHPI) operating in non-multiplexed or multiplexed mode; USB 1.1 controller with internal PLL clock synthesis; and dual 16-bit general-purpose timers with capture/compare functionality - all managed through memory-mapped registers and interrupt-driven DMA transfers.

Key Specifications

Pinout & Package

The TMS320VC5507ZHH is housed in a 179-terminal ball grid array (GHH) package with 0.8 mm pitch and 12 mm × 12 mm body size. Thermal resistance θ_JA = 32.5°C/W (JEDEC Std 51-7, 4-layer board).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar fixed-point DSP applications.

Compared with TMS320VC5509A and ADSP-21992, the TMS320VC5507ZHH offers superior memory bandwidth (320 KB total), native USB 1.1, and 200-MHz operation in a compact BGA - making it optimal for space-constrained, feature-rich portable audio systems requiring field-upgradable firmware and multi-peripheral concurrency.

Availability

TMS320VC5507ZHH is available at Aetrix Electronics and suitable for voice-over-IP gateways, portable hearing aid processors, and industrial audio analyzers requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for TMS320VC5507ZHH includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies with over 50 years of innovation in DSP design.

The TMS320VC5507 belongs to TI's C55x fixed-point DSP product line, engineered for ultra-low-power, high-efficiency signal processing in portable and battery-operated audio, telecom, and medical devices.

FAQ

What is the maximum operating frequency of the TMS320VC5507ZHH and under what conditions?

The TMS320VC5507ZHH achieves a maximum operating frequency of 200 MHz when powered with CVDD = 1.6 V and operating within the recommended case temperature range (0°C to 90°C). This condition delivers 400 MIPS peak performance. At CVDD = 1.35 V, it runs up to 144 MHz (288 MIPS); at CVDD = 1.2 V, up to 108 MHz (216 MIPS). All configurations maintain full peripheral functionality and timing compliance per SPRS244J.

Does the TMS320VC5507ZHH support USB device functionality without external components?

Yes, the TMS320VC5507ZHH integrates a full-speed USB 1.1 transceiver (12 Mbps) with on-chip pull-up resistors and clock synthesis logic. When connected to a standard USB Type-A receptacle via USB_DP and USB_DM pins, it operates as a USB device without external PHY or termination components - enabling direct firmware updates, audio streaming, or HID-class communication.

How does the TMS320VC5507ZHH handle boot configuration and memory initialization?

The TMS320VC5507ZHH supports multiple boot modes selected by GPIO pins at reset: parallel flash (EMIF or EHPI), serial EEPROM (I²C), or HPI. Boot ROM initializes internal memory maps, configures PLL, and copies boot table from external media into DARAM/SARAM. The process is fully deterministic and documented in Section 3.1.5 and Table 3−3 of SPRS244J.

What are the thermal characteristics and PCB layout requirements for the TMS320VC5507ZHH GHH package?

The TMS320VC5507ZHH in the 179-ball GHH package has θ_JA = 32.5°C/W (JEDEC Std 51-7, 4-layer board) and requires a minimum 4-layer PCB with dedicated ground/power planes. Thermal vias under the exposed die pad (ball A1–P17) are mandatory; recommended footprint follows TI's SZZA010B guidelines. Layout rules for CLKIN, USB, and McBSP traces are specified in Sections 5.6.2 and 5.17 of SPRS244J.

Can the TMS320VC5507ZHH operate with different I/O and core voltage supplies simultaneously?

Yes, the TMS320VC5507ZHH supports independent voltage domains: CVDD (core, 1.2–1.6 V) and DVDD (I/O, 3.3 V). This allows dynamic core voltage scaling for power optimization while maintaining 3.3-V-compatible peripheral signaling. Power sequencing must follow CVDD ramp before DVDD, with hold times defined in Section 5.2 of SPRS244J - ensuring reliable startup and avoiding latch-up.