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Texas Instruments TMS320VC5509APGE

Part No.:
TMS320VC5509APGE
Manufacturer:
Texas Instruments
Category:
DSP (Digital Signal Processors)
Package:
144-LQFP
Datasheet:
AetrixTMS320VC5509APGE.pdf
Description:
IC DSP FIX PT 16-BIT 144-LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:186

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Product details

Overview

TMS320VC5509APGE from Texas Instruments is a fixed-point digital signal processor (DSP) featuring a 16-bit CPU core, 32-bit internal data bus, 128K × 16-bit on-chip RAM, 16M-word address space, and integrated peripherals including six-channel DMA, three 32-bit timers, and McBSP serial ports. It targets real-time audio processing in portable voice recorders and telephony endpoint devices.

For engineers reviewing the TMS320VC5509APGE datasheet, TMS320VC5509APGE pinout, TMS320VC5509APGE application, or TMS320VC5509APGE equivalent, key selection considerations include its 144-pin LQFP package, 12.5-ns instruction cycle time at 200 MHz CPU clock, 1.6-V core supply requirement, and support for external memory expansion via EMIF with 16-bit data bus width.

Technical Context

The TMS320VC5509APGE implements TI's C55x DSP architecture with dual-MAC, four-function ALU, and parallel execution of arithmetic and memory operations. It supports zero-overhead looping, conditional execution, and barrel shifting - enabling efficient implementation of FIR/IIR filters and FFT kernels.

Its memory subsystem includes 32K words of on-chip ROM (bootloader), 64K words of DARAM, and 64K words of SARAM, all accessible in single-cycle operation. The EMIF supports asynchronous SRAM, EPROM, and SDRAM interfaces with programmable wait-state control and chip-select timing.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreC55x fixed-point DSP core with dual MAC and four-function ALU - enables simultaneous multiply-accumulate and data path operations per cycle
Max Clock Frequency200 MHz - delivers 400 MIPS peak performance for real-time audio codec execution
On-Chip RAM128K × 16-bit (64K DARAM + 64K SARAM) - supports dual-access for coefficient/data separation in filter banks
External Memory Interface16-bit EMIF with four chip-selects - allows direct connection to external Flash, SRAM, or SDRAM without glue logic
Supply Voltage1.6 V core / 3.3 V I/O - requires separate low-noise LDOs; I/O compatibility with 3.3-V logic families
Package144-pin LQFP (PGE), 20 mm × 20 mm, 0.5-mm pitch - compatible with standard surface-mount reflow profiles

Pinout & Package

Package: PGE (S-PQFP-G144), 144-pin Low-profile Quad Flat Pack, JEDEC MS-026 compliant, 20 mm × 20 mm body, 0.5 mm lead pitch, 1.45 mm max height.

Pin/TerminalCircuit RoleDesign Meaning
CLKINInput clock sourceAccepts external crystal or oscillator (1–20 MHz); feeds PLL multiplier to generate internal 200-MHz CPU clock
CLKOUTOutput clock signalProvides buffered version of internal CPU clock or divided-down frequency for system synchronization
EMIF_A[0–19]Address bus20-bit multiplexed address lines for external memory access; supports up to 1-MB address range per chip-select
EMIF_D[0–15]Data bus16-bit bidirectional data path shared between external memory and peripherals; requires external transceivers for high-speed SDRAM
XFExternal flag outputProgrammable general-purpose output used for inter-DSP signaling or hardware handshake with external logic

Key Features

FeatureDesign Value
Dual-MAC architectureExecutes two 16×16-bit multiplies and four 16-bit additions per cycle - accelerates convolution and correlation in voice enhancement algorithms
Six-channel DMA controllerEnables concurrent background data movement between McBSP, EMIF, and RAM - frees CPU for algorithm computation
Three 32-bit general-purpose timersSupport precise timing for audio sample rate generation (e.g., 8/16/48 kHz), interrupt scheduling, and watchdog functions
Three McBSP serial portsEach supports TI-AIC, I2S, and SPI protocols - allows direct interface to stereo ADC/DAC, CODEC, or RF baseband ICs

Applications

Voice Recorder SystemsTelephony Endpoint Devices

Use Scenario: Portable digital voice recorder with onboard microphone, flash storage, and playback speaker.

IC Role / Device Role / Timing Role: Main audio processing engine executing ADPCM compression/decompression and real-time noise suppression.

Use Value: 128K RAM enables dual-buffered audio streams; McBSP interfaces directly to mono ADC and DAC; 200-MHz throughput sustains 48-kHz sampling with headroom.

Use Scenario: VoIP desk phone with echo cancellation, DTMF detection, and SIP stack execution.

IC Role / Device Role / Timing Role: Dedicated DSP coprocessor handling real-time acoustic echo cancellation (AEC) and G.729 codec.

Use Value: Dual-MAC and zero-overhead loops reduce AEC latency to <5 ms; EMIF connects to external 4-MB Flash for firmware storage.

Industrial Audio MonitoringMedical Voice Logger

Use Scenario: Ruggedized field recorder for equipment vibration analysis using broadband microphone array.

IC Role / Device Role / Timing Role: Real-time spectral analysis node performing FFT-based frequency binning and threshold-triggered logging.

Use Value: 32-bit timers synchronize multi-channel sampling; 64K DARAM stores 1024-point FFT twiddle tables and input buffers.

Use Scenario: HIPAA-compliant patient voice logger with encrypted SD card storage and tamper-evident timestamping.

IC Role / Device Role / Timing Role: Secure audio acquisition unit managing AES-128 encryption, secure boot, and real-time clock synchronization.

Use Value: On-chip ROM contains certified bootloader; McBSP links to secure audio codec; 1.6-V core reduces power for battery-backed operation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar fixed-point DSP applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
TMS320VC5502PGELower clock speed (100 MHz), 64K × 16-bit RAM, no EMIF - lacks external memory expansion capabilitySuitable only for self-contained algorithms with minimal memory footprint (e.g., simple DTMF generator)Select when cost sensitivity outweighs performance and memory needs; not suitable for audio codecs requiring external buffer storage
TMS320C5515PGFHigher integration: includes USB PHY, LCD controller, and 256K × 16-bit RAM; 120-pin BGA packageBetter suited for feature-rich human-interface devices (e.g., voice-enabled HMI panels) but requires PCB redesignChoose for new designs needing USB host capability and larger on-chip memory; incompatible pinout and voltage sequencing

Compared with TMS320VC5509APGE, the TMS320VC5502PGE offers lower cost and power at the expense of memory bandwidth and external interface flexibility, while the TMS320C5515PGF trades pin compatibility for higher peripheral integration and memory - making the TMS320VC5509APGE optimal for balanced audio DSP systems requiring expandability and proven LQFP manufacturability.

Availability

TMS320VC5509APGE is available at Aetrix Electronics and suitable for voice recorder systems, telephony endpoint devices, industrial audio monitoring, and medical voice logger applications requiring stable component supply and long-term production support.

Supply support for TMS320VC5509APGE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog, embedded processing, and connectivity solutions across industrial, automotive, and consumer markets.

The TMS320C55x DSP platform was designed for ultra-low-power, high-efficiency fixed-point signal processing in portable and battery-operated audio, speech, and sensor analytics applications.

FAQ

What is the maximum operating frequency of the TMS320VC5509APGE?

The TMS320VC5509APGE operates at a maximum CPU clock frequency of 200 MHz, achieving 400 million instructions per second (MIPS). This performance level is sustained under 1.6-V core supply and ambient temperatures up to 85°C. The internal PLL multiplies an external 10-MHz reference clock to generate the 200-MHz core clock. The TMS320VC5509APGE datasheet specifies timing margins for all internal buses and peripherals at this frequency.

Does the TMS320VC5509APGE support external SDRAM?

Yes, the TMS320VC5509APGE supports external SDRAM through its External Memory Interface (EMIF) with programmable timing registers. It requires external address multiplexing and control logic (e.g., TI's TSB12LV23 or discrete logic) to manage row/column addressing and refresh cycles. The TMS320VC5509APGE EMIF does not integrate SDRAM controller logic, so system-level design must implement refresh arbitration and bank management.

What development tools are officially supported for the TMS320VC5509APGE?

Texas Instruments officially supports Code Composer Studio v3.3 and later for the TMS320VC5509APGE, along with the XDS510-class JTAG emulators and the TMDSEVM5509 evaluation module. The TMS320VC5509APGE-specific compiler (C55x C/C++ Compiler v4.4.0) and DSP/BIOS real-time kernel are validated for use with this device. TI provides device-specific header files, linker command files, and peripheral driver libraries in the C55x IQMath library.

Can the TMS320VC5509APGE execute code from external Flash memory?

Yes, the TMS320VC5509APGE can execute code from external Flash memory mapped into its 16-Mword address space via the EMIF. Boot mode configuration (using GPIO pins at reset) determines whether the device boots from on-chip ROM or external memory. The TMS320VC5509APGE supports 8-bit and 16-bit Flash devices with configurable wait states and chip-select timing - enabling reliable execution of firmware stored in parallel NOR Flash.

Is the TMS320VC5509APGE pin-compatible with other C55x family members?

No, the TMS320VC5509APGE is not pin-compatible with other C55x devices such as the TMS320VC5502 or TMS320C5515. Its 144-pin PGE package has unique signal assignments for EMIF, McBSP, and timer peripherals. While functional blocks are architecturally similar across the C55x family, pin mappings differ significantly due to varying peripheral counts and memory interface widths. Migration requires PCB redesign and firmware adaptation for the TMS320VC5509APGE.

TMS320VC5509APGE Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
TMS320C55x
Package/Case:
144-LQFP
Packaging:
Tray
Product Status:
Active
Type:
Fixed Point
Interface:
Host Interface, I2C, McBSP
Clock Rate:
200MHz
Non-Volatile Memory:
ROM (64kB)
On-Chip RAM:
256kB
Voltage - I/O:
3.00V, 3.30V
Voltage - Core:
1.60V
Operating Temperature:
-40°C ~ 85°C (TC)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20x20)

TMS320VC5509APGE FAQ

1.How can I place an order for TMS320VC5509APGE through Aetrix?

Please submit a Request for Quotation (RFQ) for TMS320VC5509APGE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TMS320VC5509APGE reliable?

The price and inventory of TMS320VC5509APGE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMS320VC5509APGE is usually 5 days.

3.What payment methods are accepted for TMS320VC5509APGE?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TMS320VC5509APGE transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TMS320VC5509APGE?

TMS320VC5509APGE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TMS320VC5509APGE order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TMS320VC5509APGE?

For technical support, including TMS320VC5509APGE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMS320VC5509APGE requirements.

6.How does Aetrix verify that TMS320VC5509APGE is sourced from the original manufacturer or authorized distributors?

All TMS320VC5509APGE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMS320VC5509APGE meets industry standards.

7.What is the process for return or replacement of TMS320VC5509APGE?

All TMS320VC5509APGE units undergo pre-shipment inspection (PSI). If there is an issue with TMS320VC5509APGE, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TMS320VC5509APGE part is unused and in its original packaging.

Return procedure for TMS320VC5509APGE:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

TMS320VC5509APGE Tags

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