Texas Instruments TMS320VC5510AGGW2

Overview

TMS320VC5510AGGW2 from Texas Instruments is a fixed-point digital signal processor (DSP) based on the C55x architecture, delivering 200-MHz operation at 5-ns instruction cycle time with dual 17×17 multipliers enabling up to 400 MMACS. It integrates 160K × 16-bit on-chip RAM (64KB DARAM + 256KB SARAM), 16K × 16-bit ROM, and a 24KB instruction cache. It targets real-time audio processing, voice communications, and portable embedded signal analysis systems.

For engineers reviewing the TMS320VC5510AGGW2 datasheet, TMS320VC5510AGGW2 pinout, TMS320VC5510AGGW2 application, or TMS320VC5510AGGW2 equivalent, key selection considerations include its 240-ball MicroStar BGA (GGW) package, 3.3-V I/O / 1.6-V core supply, EHPI host interface, three McBSPs for multichannel serial I/O, and programmable DPLL clock generation for flexible system timing.

Technical Context

The TMS320VC5510AGGW2 implements the C55x CPU core with a highly parallel bus architecture: one program bus, three data read buses, and two data write buses-enabling up to three simultaneous data reads and two writes per cycle. Its dual MAC units operate independently under full instruction set control, supported by a 40-bit ALU and auxiliary 16-bit ALU.

Peripherals include a 32-bit external memory interface (EMIF) supporting glueless connection to SDRAM, SBSRAM, SRAM, and EPROM; three full-duplex McBSPs configurable as SPI masters/slaves; a 16-bit enhanced host-port interface (EHPI) in multiplexed or non-multiplexed mode; and a six-channel DMA controller capable of two 16-bit transfers per cycle without CPU intervention.

Key Specifications

Pinout & Package

The TMS320VC5510AGGW2 is housed in a 240-ball MicroStar BGA (GGW) package with 1.0 mm ball pitch and 15 mm × 15 mm body size. Thermal resistance (θ_JA) is 32.5°C/W under JEDEC JESD51-2 conditions.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar fixed-point DSP applications.

Compared with TMS320VC5509APGE, the TMS320VC5510AGGW2 delivers double clock speed and 2.5× more on-chip RAM for complex filter banks; versus TMS320C5517AZHH, it offers identical DSP performance at lower package density and cost, but lacks USB/LCD peripherals needed for HMI-rich designs.

Availability

TMS320VC5510AGGW2 is available at Aetrix Electronics and suitable for voice communications terminals, portable audio decoders, industrial motor control monitors, and medical signal analyzers requiring stable component supply across long-lifecycle embedded programs.

Supply support for TMS320VC5510AGGW2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and digital signal processing technologies with over 50 years of innovation in high-reliability silicon design.

The TMS320VC5510AGGW2 belongs to the C55x DSP product line, engineered for ultra-low-power, high-efficiency fixed-point signal processing in battery-constrained and thermally sensitive applications such as portable audio, voice, and industrial sensing.

FAQ

What is the maximum operating frequency of the TMS320VC5510AGGW2?

The TMS320VC5510AGGW2 supports a maximum clock rate of 200 MHz, corresponding to a 5-ns instruction cycle time. This rating is validated under recommended operating conditions: 3.3-V I/O supply, 1.6-V core supply, and case temperature range of –40°C to 105°C. The DPLL must be configured in lock mode to achieve this frequency from a lower-frequency crystal input. Operation above 200 MHz is not supported and may cause functional failure or timing violations in the TMS320VC5510AGGW2.

Does the TMS320VC5510AGGW2 support SDRAM interfacing?

Yes, the TMS320VC5510AGGW2 supports SDRAM interfacing via its 32-bit external memory interface (EMIF). The device provides dedicated SDRAM command timing (ACTV, REFR, MRS) and supports burst lengths of 1, 2, 4, and 8. Electrical specifications in Section 5.7.3 of the SPRS076O datasheet define setup/hold times, clock-to-output delays, and refresh intervals required for reliable SDRAM operation with the TMS320VC5510AGGW2.

How many McBSPs does the TMS320VC5510AGGW2 integrate, and what protocols do they support?

The TMS320VC5510AGGW2 integrates three independent multichannel buffered serial ports (McBSP0–McBSP2). Each supports TI-AIC, I2S, left-justified, right-justified, and TDM formats. All three can be configured as SPI masters or slaves (with CLKSTP = 10b or 11b) and support general-purpose I/O mode. Timing tables 5−21 through 5−32 in the SPRS076O datasheet specify exact SPI and I2S waveforms achievable with the TMS320VC5510AGGW2.

What power supply voltages are required for the TMS320VC5510AGGW2?

The TMS320VC5510AGGW2 requires two separate supply rails: a 3.3-V I/O supply (DVDD_IO) for all external interface pins including EMIF, McBSP, and EHPI, and a 1.6-V core supply (CVDD) for the CPU, memory, and internal logic. Both supplies must meet ripple and sequencing requirements specified in Section 5.3 of the SPRS076O datasheet to ensure stable operation of the TMS320VC5510AGGW2 under full load.

Is the TMS320VC5510AGGW2 pin-compatible with other C55x family members?

No, the TMS320VC5510AGGW2 is not pin-compatible with other C55x devices due to its unique 240-ball MicroStar BGA (GGW) footprint and signal assignment. While functionally similar to the ZGW variant (lead-free), it differs electrically and mechanically from LQFP-packaged parts like the TMS320VC5509APGE. Migration requires PCB redesign; no drop-in replacement exists for the TMS320VC5510AGGW2 within the C55x family.