Texas Instruments TMS320VC5510AGGWA1

Overview

TMS320VC5510AGGWA1 from Texas Instruments is a fixed-point digital signal processor (DSP) built on the C55x architecture, delivering 200-MHz operation at 1.6-V core voltage with dual 17×17 multipliers enabling up to 400 MMACS, used in real-time audio processing, telecom baseband, and industrial control systems.

For engineers reviewing the TMS320VC5510AGGWA1 datasheet, TMS320VC5510AGGWA1 pinout, TMS320VC5510AGGWA1 application, or TMS320VC5510AGGWA1 equivalent, key selection criteria include its 240-ball MicroStar BGA (GGW) package, 160K × 16-bit on-chip RAM split across DARAM/SARAM, 32-bit EMIF supporting SDRAM/SBSRAM, and integrated EHPI, McBSPs, and DPLL clock generator.

Technical Context

The TMS320VC5510AGGWA1 implements a highly parallel C55x CPU with one program bus, three data read buses, and two data write buses-enabling up to three simultaneous data reads and two writes per cycle. Its dual MAC units operate independently under instruction control, while the 40-bit ALU and auxiliary 16-bit ALU support optimized arithmetic flow.

Peripherals include a 32-bit external memory interface (EMIF) with glueless support for asynchronous SRAM/EPROM and synchronous SDRAM/SBSRAM; three full-duplex McBSPs with SPI master/slave capability; a 16-bit enhanced host-port interface (EHPI) configurable in multiplexed or non-multiplexed mode; and a programmable digital phase-locked loop (DPLL) for flexible clock synthesis.

Key Specifications

Pinout & Package

Package: 240-terminal MicroStar BGA (GGW), 15 mm × 15 mm, 1.0-mm ball pitch, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar fixed-point DSP applications.

Compared with TMS320VC5510AGGWA1, the TMS320VC5509APGE trades memory scalability and SDRAM capability for package simplicity and lower cost, while the TMS320C5517AZHH extends on-chip resources and memory interface capability for more demanding signal processing workloads - neither is pin-compatible, requiring PCB redesign.

Availability

TMS320VC5510AGGWA1 is available at Aetrix Electronics and suitable for audio signal processing, telecom baseband, and industrial motor control applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for TMS320VC5510AGGWA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and digital signal processing technologies with over 50 years of innovation in high-performance computing and low-power design.

The TMS320VC5510AGGWA1 belongs to the C55x DSP product line, engineered for ultra-low-power, high-efficiency fixed-point signal processing in portable and thermally constrained systems.

FAQ

What is the maximum operating frequency of the TMS320VC5510AGGWA1?

The TMS320VC5510AGGWA1 operates at a maximum clock rate of 200 MHz, corresponding to a 5-ns instruction cycle time. This frequency is achieved using the on-chip digital phase-locked loop (DPLL) with an external 10-MHz crystal input in lock mode. The device supports both bypass and lock modes for clock generation, with timing specifications fully characterized across the recommended operating temperature range.

Does the TMS320VC5510AGGWA1 support SDRAM interfacing?

Yes, the TMS320VC5510AGGWA1 supports glueless interface to synchronous DRAM via its 32-bit external memory interface (EMIF). Section 5.7.3 of the SPRS076O datasheet specifies timing parameters for SDRAM commands including ACTV, REFR, MRS, and data transfers. The EMIF provides dedicated control signals (SDCKE, SDWE, SD CAS, SD RAS) and supports programmable latency and burst length configurations.

What type of package does the TMS320VC5510AGGWA1 use?

The TMS320VC5510AGGWA1 uses a 240-terminal MicroStar BGA (GGW) package, measuring 15 mm × 15 mm with 1.0-mm ball pitch. This RoHS-compliant, lead-free package is documented in Section 6.2 of the SPRS076O datasheet and features thermal resistance characteristics optimized for conduction-cooled industrial applications.

How much on-chip RAM does the TMS320VC5510AGGWA1 include?

The TMS320VC5510AGGWA1 integrates 160K × 16-bit (320 KB total) of on-chip RAM: eight 4K × 16-bit dual-access RAM (DARAM) blocks totaling 64 KB, and thirty-two 4K × 16-bit single-access RAM (SARAM) blocks totaling 256 KB. This memory architecture enables concurrent instruction fetch and data access critical for high-efficiency DSP kernel execution.

What peripherals are integrated into the TMS320VC5510AGGWA1?

The TMS320VC5510AGGWA1 integrates a 32-bit EMIF, three McBSPs, a 16-bit enhanced host-port interface (EHPI), six-channel DMA, two 20-bit timers, eight GPIO pins, a dedicated XF output, and a programmable DPLL clock generator. All peripherals are register-mapped and accessible via the C55x memory map, with detailed register descriptions provided in Sections 3.2–3.4 of SPRS076O.