Texas Instruments TMS320VC5510AGGWA2
- Part No.:
- TMS320VC5510AGGWA2
- Manufacturer:
- Texas Instruments
- Category:
- DSP (Digital Signal Processors)
- Package:
- 240-LFBGA
- Datasheet:
-
TMS320VC5510AGGWA2.pdf
- Description:
- IC FIXED POINT DSP 240-BGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
TMS320VC5510AGGWA2 from Texas Instruments is a fixed-point digital signal processor (DSP) based on the C55x CPU core, delivering 200-MHz operation at 5-ns instruction cycle time, dual 17×17 MAC units (400 MMACS), 160K × 16-bit on-chip RAM (64K DARAM + 256K SARAM), and 16K × 16-bit ROM - deployed in real-time audio processing, telecom baseband, and industrial motor control systems.
For engineers reviewing the TMS320VC5510AGGWA2 datasheet, TMS320VC5510AGGWA2 pinout, TMS320VC5510AGGWA2 application, or TMS320VC5510AGGWA2 equivalent, key selection considerations include EMIF glueless support for SDRAM/SBSRAM, three McBSPs with SPI master/slave capability, EHPI parallel host interface, DPLL clock synthesis, and 1.6-V core / 3.3-V I/O supply partitioning.
Technical Context
The TMS320VC5510AGGWA2 implements a highly parallel C55x architecture with one program bus, three data read buses, and two data write buses-enabling up to three simultaneous data reads and two writes per cycle. Its dual MAC units operate independently under instruction control, while the 40-bit ALU and auxiliary 16-bit ALU are managed by dedicated address and data units.
On-chip peripherals include a 32-bit external memory interface (EMIF) supporting asynchronous SRAM/EPROM and synchronous SDRAM/SBSRAM; three full-duplex McBSPs configurable as SPI masters or slaves; a 16-bit enhanced host-port interface (EHPI) in multiplexed or non-multiplexed mode; six-channel DMA; two 20-bit timers; eight GPIO pins; and a programmable digital PLL for clock generation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Clock Rate | 200 MHz - enables real-time execution of complex FIR/IIR filters and FFTs within strict latency budgets. |
| Instruction Cycle Time | 5 ns - defines minimum instruction latency and maximum deterministic throughput for time-critical DSP kernels. |
| MAC Throughput | 400 MMACS - supports dual 17×17 multiplies per cycle across two independent units for concurrent filter taps. |
| On-Chip RAM | 160K × 16-bit (64K DARAM + 256K SARAM) - provides zero-wait-state dual-access memory for coefficient/data buffers and single-access space for stack/variables. |
| On-Chip ROM | 16K × 16-bit - holds boot loader and fixed algorithms, reducing external memory dependency during startup. |
| External Memory Interface | 32-bit EMIF with glueless SDRAM/SBSRAM support - eliminates interface logic, simplifies PCB layout, and enables high-bandwidth streaming I/O. |
| Supply Voltages | 1.6-V core / 3.3-V I/O - separates low-power logic domain from noise-tolerant interface domain, enabling optimized power management. |
Pinout & Package
Package: 240-terminal MicroStar BGA (GGW suffix), 15 mm × 15 mm, 1.0-mm ball pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKIN | Primary clock input | Accepts external crystal or oscillator (1–20 MHz); feeds DPLL for internal 200-MHz generation. |
| CLKOUT | Clock output | Drives external logic or test equipment; voltage level matches I/O supply (3.3 V). |
| EMIF Address/Data Bus (A0–A22, D0–D31) | External memory interface | 32-bit multiplexed or non-multiplexed bus supporting asynchronous/synchronous memory protocols without glue logic. |
| McBSP0–McBSP2 (DX0–DX2, DR0–DR2, CLKX/CLKR, FSX/FSR) | Serial port signals | Three independent full-duplex channels; each supports TI, I2S, SPI, and TDM protocols with programmable frame sync and clock polarity. |
| EHPI[0–15], HCS, HR/W, HAS, HDS1/HDS2 | Enhanced host-port interface | 16-bit parallel bus enabling host CPU direct access to internal memory; supports non-multiplexed (address/data separate) or multiplexed (shared bus) modes. |
| GPIO0–GPIO7, XF | General-purpose I/O | Eight configurable bidirectional pins plus dedicated XF output for external interrupt signaling or system handshake. |
Key Features
| Feature | Design Value |
|---|---|
| Dual 17×17 MAC units | Enables concurrent multiply-accumulate operations for real-time FIR filtering, adaptive equalization, and echo cancellation without pipeline stalls. |
| 24K-byte instruction cache | Reduces external memory fetches for frequently executed code blocks, lowering system power and improving deterministic timing predictability. |
| Programmable DPLL clock generator | Allows flexible clock synthesis from low-frequency crystals (e.g., 12.288 MHz → 200 MHz), eliminating need for high-frequency external oscillators. |
| Glueless EMIF for SDRAM/SBSRAM | Integrates burst timing, refresh control, and bank management internally-no external logic required for high-density memory expansion. |
| IEEE 1149.1 JTAG boundary scan | Supports production test and debug via standardized scan chain, enabling structural verification and in-circuit emulation without physical probe access. |
Applications
| Audio Signal Processing | Telecom Baseband Processing |
|---|---|
Use Scenario: Real-time acoustic echo cancellation and noise suppression in VoIP handsets and conferencing systems. IC Role / Device Role / Timing Role: Primary DSP executing adaptive LMS algorithms with sub-100 µs loop latency using dual MACs and DARAM for coefficient storage. Use Value: Enables full-duplex communication with >45 dB echo return loss using on-chip resources-no external co-processor required. | Use Scenario: Channel coding/decoding (Viterbi, Turbo) and modulation/demodulation (QPSK, 16-QAM) in wireless infrastructure baseband units. IC Role / Device Role / Timing Role: Fixed-point accelerator handling symbol-rate processing with McBSPs interfacing to RF transceivers and EMIF accessing large lookup tables in SDRAM. Use Value: Achieves 200-MHz sustained throughput for convolutional decoding while maintaining thermal envelope via 1.6-V core voltage scaling. |
| Industrial Motor Control | Medical Imaging Front-End |
Use Scenario: Field-oriented control (FOC) of PMSM/BLDC motors in servo drives with real-time current/voltage sensing and PWM generation. IC Role / Device Role / Timing Role: Real-time controller executing Park/Clarke transforms, PI regulators, and space-vector modulation using timer-triggered interrupts and GPIO-driven PWM outputs. Use Value: Delivers <5-µs current-loop update time using on-chip DARAM for fast-access control variables and dual ALUs for parallel arithmetic. | Use Scenario: Ultrasound beamforming and digital demodulation in portable imaging devices requiring low power and compact form factor. IC Role / Device Role / Timing Role: High-throughput signal conditioner performing IQ demodulation, FIR filtering, and envelope detection on RF echo streams via McBSP-linked ADC/DAC interfaces. Use Value: Processes 128-channel beamformed data at 40 MSPS using DMA-driven McBSP transfers and cached FFT routines-enabling battery-powered operation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar fixed-point DSP applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMS320VC5509APGE | 144-pin LQFP package; 100-MHz max clock; 64K × 16-bit RAM; no SBSRAM support in EMIF. | Lower-cost, lower-pin-count solution for less demanding audio codecs or sensor fusion where SDRAM bandwidth is not required. | Select when board space allows LQFP and performance requirements fit within 100-MHz ceiling and 64K RAM limit. |
| TMS320C5517AZHH | 324-ball BGA; 200-MHz operation; 320K × 16-bit RAM; integrated USB 2.0 PHY; no EHPI. | Targeted at portable multimedia with host connectivity; replaces EHPI with USB for PC-based firmware updates and data streaming. | Choose when USB device functionality supersedes parallel host interface and larger RAM is needed for video buffering. |
Compared with TMS320VC5509APGE, the TMS320VC5510AGGWA2 delivers double clock rate, 2.5× more on-chip RAM, and SBSRAM/SDRAM support-making it suitable for higher-bandwidth streaming applications; versus TMS320C5517AZHH, it retains EHPI for legacy host integration but lacks USB, favoring industrial control over consumer multimedia.
Availability
TMS320VC5510AGGWA2 is available at Aetrix Electronics and suitable for industrial motor control, telecom baseband processing, medical ultrasound front-ends, and real-time audio signal processing requiring stable component supply and long-term lifecycle assurance.
Supply support for TMS320VC5510AGGWA2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and digital signal processing technologies.
The TMS320VC5510AGGWA2 belongs to the C55x fixed-point DSP product line, engineered for ultra-low-power, high-throughput signal processing in battery-constrained and thermally sensitive embedded systems.
FAQ
What is the maximum operating frequency of the TMS320VC5510AGGWA2?
The TMS320VC5510AGGWA2 operates at a maximum clock rate of 200 MHz, corresponding to a 5-ns instruction cycle time. This frequency is achieved using the on-chip digital phase-locked loop (DPLL) to synthesize the core clock from a lower-frequency external source (e.g., 12.288 MHz). The 200-MHz rating is validated across the specified temperature and voltage ranges per the SPRS076O datasheet.
Does the TMS320VC5510AGGWA2 support synchronous DRAM (SDRAM)?
Yes, the TMS320VC5510AGGWA2 supports SDRAM via its 32-bit external memory interface (EMIF) with built-in SDRAM controller logic. It handles row activation, precharge, refresh, and mode register setup autonomously-requiring no external glue logic. Timing compliance is verified per JEDEC standards, and configuration is controlled through EMIF registers (e.g., SDRAMCR, SDRAMPRE) defined in Section 3.12 of the SPRS076O manual.
How many multichannel buffered serial ports (McBSPs) does the TMS320VC5510AGGWA2 include?
The TMS320VC5510AGGWA2 integrates three independent multichannel buffered serial ports (McBSP0, McBSP1, McBSP2). Each supports full-duplex operation, TI-specific, I2S, SPI, and TDM protocols, with programmable clock polarity, frame sync width, and word length. All three McBSPs are fully functional in the TMS320VC5510AGGWA2 and documented in Sections 3.2.4 and 5.14 of SPRS076O.
What power supply voltages are required for the TMS320VC5510AGGWA2?
The TMS320VC5510AGGWA2 requires two distinct supply rails: a 1.6-V core supply (CVDD) for the CPU and internal logic, and a 3.3-V I/O supply (DVDD) for all external interface pins including EMIF, McBSPs, EHPI, and GPIO. These supplies must be sequenced correctly-CVDD must be stable before DVDD-and decoupled per TI's recommended layout in Section 6.2 of SPRS076O.
Is the TMS320VC5510AGGWA2 pin-compatible with other C55x family members?
No, the TMS320VC5510AGGWA2 is not pin-compatible with other C55x devices such as the TMS320VC5509A or TMS320C5517. It uses a unique 240-ball MicroStar BGA (GGW) package with specific ball assignments defined in Table 2−1 of SPRS076O. Pin mappings for EMIF, McBSPs, and EHPI differ across variants, and no official drop-in replacement documentation exists for this part.
TMS320VC5510AGGWA2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- TMS320C55x
- Package/Case:
- 240-LFBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Type:
- Fixed Point
- Interface:
- Host Interface, McBSP
- Clock Rate:
- 200MHz
- Non-Volatile Memory:
- ROM (32kB)
- On-Chip RAM:
- 344kB
- Voltage - I/O:
- 3.30V
- Voltage - Core:
- 1.60V
- Operating Temperature:
- -40°C ~ 85°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 240-BGA MICROSTAR (15x15)
TMS320VC5510AGGWA2 FAQ
1.How can I place an order for TMS320VC5510AGGWA2 through Aetrix?
Please submit a Request for Quotation (RFQ) for TMS320VC5510AGGWA2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TMS320VC5510AGGWA2 reliable?
The price and inventory of TMS320VC5510AGGWA2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TMS320VC5510AGGWA2 is usually 5 days.
3.What payment methods are accepted for TMS320VC5510AGGWA2?
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Once your TMS320VC5510AGGWA2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TMS320VC5510AGGWA2?
For technical support, including TMS320VC5510AGGWA2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TMS320VC5510AGGWA2 requirements.
6.How does Aetrix verify that TMS320VC5510AGGWA2 is sourced from the original manufacturer or authorized distributors?
All TMS320VC5510AGGWA2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TMS320VC5510AGGWA2 meets industry standards.
7.What is the process for return or replacement of TMS320VC5510AGGWA2?
All TMS320VC5510AGGWA2 units undergo pre-shipment inspection (PSI). If there is an issue with TMS320VC5510AGGWA2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TMS320VC5510AGGWA2 part is unused and in its original packaging.
Return procedure for TMS320VC5510AGGWA2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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