Texas Instruments TMS320VC5510AGPHA2

Overview

TMS320VC5510AGPHA2 from Texas Instruments is a fixed-point digital signal processor (DSP) built on the C55x architecture, delivering 200-MHz operation at 5-ns instruction cycle time with dual 17×17-bit MAC units (400 MMACS), 160K × 16-bit on-chip RAM (64K DARAM + 256K SARAM), and 16K × 16-bit ROM. It integrates three McBSPs, six-channel DMA, two 20-bit timers, and a programmable DPLL for real-time audio and telecom baseband processing.

For engineers reviewing the TMS320VC5510AGPHA2 datasheet, TMS320VC5510AGPHA2 pinout, TMS320VC5510AGPHA2 application, or TMS320VC5510AGPHA2 equivalent, key selection criteria include its 240-ball MicroStar BGA (GGW) package, 3.3-V I/O / 1.6-V core supply, glueless EMIF support for SDRAM/SBSRAM, EHPI host interface, and JTAG-compliant IEEE 1149.1 debug infrastructure.

Technical Context

The TMS320VC5510AGPHA2 implements a highly parallel C55x CPU with one program bus, three data read buses, and two data write buses-enabling up to three simultaneous data reads and two writes per cycle. Its dual MAC units operate independently under full instruction control, supported by a 40-bit ALU and auxiliary 16-bit ALU for optimized arithmetic throughput in signal processing loops.

On-chip memory hierarchy includes 24K-byte instruction cache, eight 4K×16-bit DARAM blocks (dual-access for zero-wait-state loop execution), and thirty-two 4K×16-bit SARAM blocks. The EMIF supports asynchronous SRAM/EPROM, SDRAM (with ACTV/REFR/MRS command timing), and SBSRAM with configurable burst lengths and wait states.

Key Specifications

Pinout & Package

Package: 240-terminal MicroStar BGA (GGW suffix), 15 mm × 15 mm, 0.8-mm ball pitch, RoHS-compliant lead-free construction.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar fixed-point DSP applications.

Compared with TMS320VC5510AGPHA2, the VC5509APGE offers lower cost and simpler layout but sacrifices SDRAM capability and half the computational throughput; the C5517AZCHA12 adds USB and LCD features at the expense of reduced clock speed and incompatible packaging - neither is pin-compatible, and both require PCB redesign and firmware adaptation.

Availability

TMS320VC5510AGPHA2 is available at Aetrix Electronics and suitable for voice-over-IP gateways, portable audio decoders, and industrial motor control systems requiring stable component supply across extended production lifecycles.

Supply support for TMS320VC5510AGPHA2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and digital signal processing technologies, with decades of DSP innovation and broad industrial design support.

The TMS320VC5510AGPHA2 belongs to TI's C55x fixed-point DSP product line, engineered for ultra-low-power, high-throughput signal processing in portable and battery-operated equipment where computational density and energy efficiency are critical.

FAQ

What is the maximum operating frequency of the TMS320VC5510AGPHA2?

The TMS320VC5510AGPHA2 operates at a maximum clock rate of 200 MHz, corresponding to a 5-ns instruction cycle time. This frequency is achieved using the on-chip digital phase-locked loop (DPLL) with an external 10-MHz reference clock, and is validated across the full recommended operating temperature range (–40°C to 85°C). The TMS320VC5510AGPHA2 must be powered with 1.6-V core and 3.3-V I/O supplies to sustain this performance level.

Does the TMS320VC5510AGPHA2 support SDRAM interfacing?

Yes, the TMS320VC5510AGPHA2 supports glueless SDRAM interfacing via its 32-bit external memory interface (EMIF). It implements all required SDRAM command sequences-including ACTV (activate), REFR (refresh), MRS (mode register set), and DCAB (precharge)-with fully programmable timing registers (SDCTL, SDTIM, SDCFG) to match JEDEC-standard SDRAM parts. The TMS320VC5510AGPHA2 datasheet specifies timing parameters for 100-MHz SDRAM operation with 3–7 ns row-to-column delays.

What package type is used for the TMS320VC5510AGPHA2?

The TMS320VC5510AGPHA2 uses a 240-terminal MicroStar BGA package with GGW suffix, measuring 15 mm × 15 mm with 0.8-mm ball pitch. This RoHS-compliant, lead-free package features a thermal pad on the underside for enhanced heat dissipation and is mechanically identical to the ZGW variant except for Pb-free finish. Pin assignments and thermal resistance values (θ_JA = 32.5°C/W, θ_JC = 3.2°C/W) are documented in Section 6 of the SPRS076O datasheet.

How many multichannel buffered serial ports (McBSPs) does the TMS320VC5510AGPHA2 include?

The TMS320VC5510AGPHA2 integrates three independent full-duplex multichannel buffered serial ports (McBSP0, McBSP1, McBSP2), each supporting TDM, I2S, SPI, and AC97 protocols. Each McBSP provides separate DX/DR data lines, CLKX/CLKR clocks, and FSX/FSR frame syncs, with configurable word length (8–32 bits), clock polarity, and frame synchronization. Together they support up to 128 individually enabled time slots for multichannel audio or telecom applications.

Is the TMS320VC5510AGPHA2 compatible with Code Composer Studio development tools?

Yes, the TMS320VC5510AGPHA2 is fully supported by Texas Instruments' Code Composer Studio (CCS) v3.x and later, including C compiler, assembler, linker, simulator, and real-time debugger. CCS integrates with XDS510-class JTAG emulators for full visibility into CPU registers, memory, and peripherals. The TMS320VC5510AGPHA2 also supports DSP/BIOS kernel, Chip Support Libraries (CSL), and eXpressDSP Algorithm Standard for rapid development of production-grade signal processing firmware.