Texas Instruments TMS320VC5510AZGW1

Overview

TMS320VC5510AZGW1 from Texas Instruments is a fixed-point digital signal processor (DSP) built on the C55x architecture, delivering 200-MHz operation at 5-ns instruction cycle time with dual 17×17 multipliers enabling up to 400 MMACS. It integrates 160K × 16-bit on-chip RAM (64K DARAM + 256K SARAM), 16K × 16-bit ROM, 24KB instruction cache, and supports glueless interface to SDRAM, SBSRAM, SRAM, and EPROM. It is used in real-time audio processing, voice codecs, and telecom baseband subsystems.

For engineers reviewing the TMS320VC5510AZGW1 datasheet, TMS320VC5510AZGW1 pinout, TMS320VC5510AZGW1 application, or TMS320VC5510AZGW1 equivalent, key selection criteria include its 240-ball ZGW BGA package, 3.3-V I/O / 1.6-V core supply, six-channel DMA, three McBSPs, EHPI host interface, and programmable DPLL clock generator - all critical for low-power embedded DSP system design.

Technical Context

The TMS320VC5510AZGW1 implements the C55x CPU core with a highly parallel bus architecture: one program bus, three data read buses, and two data write buses, enabling up to three simultaneous data reads and two writes per cycle. Its dual MAC units operate independently under instruction control, supported by a 40-bit ALU and auxiliary 16-bit ALU.

Peripherals include a 32-bit external memory interface (EMIF) supporting asynchronous and synchronous memory protocols, three full-duplex multichannel buffered serial ports (McBSPs) with SPI master/slave capability, a 16-bit enhanced host-port interface (EHPI) configurable in multiplexed or non-multiplexed mode, and a programmable digital phase-locked loop (DPLL) for flexible clock synthesis from external or internal sources.

Key Specifications

Pinout & Package

Package: 240-ball MicroStar BGA (ZGW), lead-free, 15 mm × 15 mm body, 0.8-mm ball pitch, bottom-side thermal pad.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar fixed-point DSP applications.

Compared with TMS320VC5510AZGW1, the TMS320VC5509APGE offers reduced integration and performance in a smaller package, while the TMS320C5517AZHH trades EHPI for USB 2.0 and doubles on-chip RAM - making each suitable only where their specific I/O or memory profile matches system architecture requirements.

Availability

TMS320VC5510AZGW1 is available at Aetrix Electronics and suitable for voice codec systems, telecom baseband processing, portable audio player DSP engines, and industrial motor control feedback loops requiring stable component supply across long-lifecycle embedded programs.

Supply support for TMS320VC5510AZGW1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and digital signal processing technologies, with over 50 years of innovation in high-reliability silicon solutions.

The TMS320C55x product line was designed for ultra-low-power, high-performance fixed-point DSP applications in portable audio, voice communications, and industrial control - emphasizing code density, parallel execution, and memory bandwidth efficiency.

FAQ

What is the maximum operating frequency of the TMS320VC5510AZGW1?

The TMS320VC5510AZGW1 operates at a maximum clock rate of 200 MHz, corresponding to a 5-ns instruction cycle time. This frequency is achieved using the on-chip digital phase-locked loop (DPLL) in lock mode, synthesizing from a lower-frequency external crystal or clock source. The DPLL supports multiple multiplication ratios and provides jitter specifications compliant with synchronous memory timing requirements for SDRAM and SBSRAM interfaces.

Does the TMS320VC5510AZGW1 support SDRAM interfacing?

Yes, the TMS320VC5510AZGW1 supports SDRAM interfacing directly through its 32-bit external memory interface (EMIF) without external glue logic. The EMIF provides dedicated SDRAM command signals (ACTV, REFR, MRS, DCAB) and timing control registers, with documented timing parameters for 100-MHz SDRAM operation. Section 5.7.3 of the SPRS076O datasheet specifies setup/hold, access, and refresh timing requirements for compatibility with standard JEDEC-compliant SDRAM devices.

What are the power supply requirements for the TMS320VC5510AZGW1?

The TMS320VC5510AZGW1 requires two separate supply voltages: a 1.6-V core supply (CVDD) for the CPU and internal logic, and a 3.3-V I/O supply (DVDD) for external interfaces including EMIF, McBSP, EHPI, and GPIO. Both supplies must be well-regulated and decoupled per the recommendations in Section 5.3 of the SPRS076O datasheet. The device implements programmable low-power control across six functional domains to reduce active and standby current consumption.

How many multichannel buffered serial ports (McBSPs) does the TMS320VC5510AZGW1 include?

The TMS320VC5510AZGW1 includes three fully independent multichannel buffered serial ports (McBSP0, McBSP1, McBSP2), each capable of full-duplex operation and supporting up to 128 individually enabled channels. Each McBSP supports TI-specific, I2S, SPI master/slave, and TDM protocols, with configurable clock polarity, frame sync, and data word length. Their register sets and DMA channel assignments are fully documented in Sections 3.2.4 and 3.16–3.18 of the SPRS076O datasheet.

Is the TMS320VC5510AZGW1 pin-compatible with other C55x-family devices?

No, the TMS320VC5510AZGW1 is not pin-compatible with other C55x-family devices due to its unique 240-ball ZGW BGA package and signal allocation optimized for its full peripheral set. While functionally related to devices like the TMS320VC5509A (144-pin LQFP), differences in ball count, power pin distribution, EMIF width, and peripheral mapping prevent direct PCB replacement. Migration requires board redesign and firmware adaptation to match register-level peripheral behavior.