Texas Instruments TMS320VC5510AZGW2

Overview

TMS320VC5510AZGW2 from Texas Instruments is a fixed-point digital signal processor (DSP) built on the C55x architecture, delivering 200-MHz operation at 5-ns instruction cycle time with dual 17×17 multipliers enabling up to 400 MMACS. It integrates 160K × 16-bit on-chip RAM (64KB DARAM + 256KB SARAM), 16K × 16-bit ROM, and a 24KB instruction cache. It targets real-time audio processing, voice recognition, and telecom baseband in embedded systems requiring deterministic low-latency signal flow.

For engineers reviewing the TMS320VC5510AZGW2 datasheet, TMS320VC5510AZGW2 pinout, TMS320VC5510AZGW2 application, or TMS320VC5510AZGW2 equivalent, key selection criteria include its 240-ball MicroStar BGA (ZGW) package, 3.3-V I/O / 1.6-V core supply, glueless EMIF support for SDRAM/SBSRAM, triple McBSPs for multichannel serial I/O, and programmable DPLL clock generation.

Technical Context

The TMS320VC5510AZGW2 implements a highly parallel CPU architecture with one program bus, three data read buses, and two data write buses-enabling up to three simultaneous data reads and two writes per cycle. Its dual MAC units operate independently under instruction control, while the 40-bit ALU and auxiliary 16-bit ALU are managed by dedicated address and data units.

Peripherals include a 32-bit external memory interface (EMIF) supporting asynchronous SRAM/EPROM and synchronous SDRAM/SBSRAM; three full-duplex McBSPs configurable as SPI masters/slaves; a 16-bit enhanced host-port interface (EHPI) in multiplexed or non-multiplexed mode; six-channel DMA; two 20-bit timers; eight GPIO pins; and a programmable digital PLL for flexible clock synthesis from external or internal sources.

Key Specifications

Pinout & Package

240-ball MicroStar BGA (ZGW) package, 1.0-mm ball pitch, 15 × 15 mm body size, lead-free finish. Thermal resistance θ_JA = 32.5°C/W (JEDEC Std 51-2, 4-layer board).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar fixed-point DSP applications.

Compared with TMS320VC5509APGE, the TMS320VC5510AZGW2 delivers double clock speed, SDRAM compatibility, and triple McBSPs - essential for multichannel telecom and professional audio. Against TMS320C5517AZHH, it trades USB integration and extra RAM for lower package complexity and proven qualification in legacy industrial deployments.

Availability

TMS320VC5510AZGW2 is available at Aetrix Electronics and suitable for voice-over-IP endpoints, industrial voice recognition terminals, and wireless baseband processors requiring stable component supply across extended product lifecycles.

Supply support for TMS320VC5510AZGW2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and digital signal processing technologies.

The TMS320C55x DSP product line was designed for ultra-low-power, high-performance fixed-point signal processing in portable and battery-operated applications including audio, voice, and communications infrastructure.

FAQ

What is the maximum operating frequency of the TMS320VC5510AZGW2?

The TMS320VC5510AZGW2 operates at a maximum clock rate of 200 MHz, corresponding to a 5-ns instruction cycle time. This frequency is achieved using the on-chip digital phase-locked loop (DPLL) to multiply a lower-frequency external reference clock. The device's electrical specifications guarantee timing compliance and thermal stability at this rate under recommended operating conditions (1.6-V core, 3.3-V I/O, ≤85°C case temperature).

Does the TMS320VC5510AZGW2 support SDRAM interfacing?

Yes, the TMS320VC5510AZGW2 supports glueless interface to synchronous DRAM (SDRAM) via its 32-bit external memory interface (EMIF). The datasheet specifies full timing compliance for SDRAM commands including ACTV, REFR, MRS, and burst reads/writes. This capability enables large off-chip buffers for streaming audio, video, or baseband data without external address latches or timing logic.

How many McBSPs does the TMS320VC5510AZGW2 include, and what protocols do they support?

The TMS320VC5510AZGW2 integrates three independent multichannel buffered serial ports (McBSP0–McBSP2). Each supports TI-specific, I2S, AC97, and SPI master/slave modes. Configuration registers allow frame synchronization, clock polarity, and data length control. These interfaces enable concurrent connection to audio codecs, modems, and sensors - critical for voice and telecom applications requiring multiple synchronized serial data streams.

What power supply voltages are required for the TMS320VC5510AZGW2?

The TMS320VC5510AZGW2 requires two separate supply rails: 1.6 V ± 0.08 V for the core logic (CVDD) and 3.3 V ± 0.3 V for I/O buffers (DVDD). These are specified in Section 5.3 ("Recommended Operating Conditions") of the SPRS076O datasheet. Proper decoupling with 100-nF ceramic capacitors near each power ball is mandatory to maintain signal integrity and meet EMI requirements.

Is the TMS320VC5510AZGW2 pin-compatible with other C55x-family devices?

No, the TMS320VC5510AZGW2 is not pin-compatible with other C55x devices such as the TMS320VC5509A or TMS320C5517. Its 240-ball ZGW BGA footprint, ball assignment, and power/ground distribution are unique to the VC5510/5510A family. Migration requires PCB redesign. Functional compatibility exists at the software level via the C55x instruction set and peripheral register map, but hardware interface changes are unavoidable.