Texas Instruments TMS32C6415EGLZ5E0

Overview

TMS32C6415EGLZ5E0 from Texas Instruments is a fixed-point digital signal processor (DSP) built on the VelociTI.2™ VLIW architecture, delivering 500 MHz clock rate, 4000 MIPS performance, and 8 instructions/cycle execution. It integrates dual external memory interfaces (64-bit EMIFA + 16-bit EMIFB), PCI 2.2 interface, UTOPIA Level 2 slave ATM controller, and three multichannel buffered serial ports (McBSPs). It targets high-channel-density telecom infrastructure such as voice-over-IP gateways and baseband processing in wireless access equipment.

For engineers reviewing the TMS32C6415EGLZ5E0 datasheet, TMS32C6415EGLZ5E0 pinout, TMS32C6415EGLZ5E0 application, or TMS32C6415EGLZ5E0 equivalent, key selection criteria include its 532-pin GLZ BGA package, 1.2-V core / 3.3-V I/O voltage configuration, PCI and UTOPIA peripheral enablement, and compatibility with C6414/C6416 in shared-peripheral mode for migration flexibility.

Technical Context

The TMS32C6415EGLZ5E0 implements an eight-functional-unit VelociTI.2™ DSP core with six ALUs and two multipliers-each multiplier supporting four 16×16-bit or eight 8×8-bit operations per cycle. Its L1/L2 memory hierarchy includes 16KB direct-mapped L1P cache, 16KB 2-way set-associative L1D cache, and 1024KB unified L2 RAM/cache with flexible allocation.

Peripheral integration includes a 32-bit/33-MHz PCI master/slave interface compliant with PCI Specification 2.2, an 8-bit UTOPIA Level 2 slave controller operating up to 50 MHz per direction, and three McBSPs supporting T1/E1 framing, AC97, and SPI protocols. All peripherals are multiplexed with GPIO pins and require explicit configuration via bootmode and terminal function settings.

Key Specifications

Pinout & Package

532-pin plastic ball grid array (GLZ) package with 0.8-mm ball pitch, 23 × 23 mm footprint, and Pb-free solder balls. Pinout follows TI's standardized C64x BGA mapping with dedicated power/ground ball arrays, differential clock inputs, and multiplexed peripheral/GPIO signals.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar fixed-point DSP applications.

Compared with TMS32C6415EGLZ5E0, the C6416GLZ7E3 delivers 44% higher MIPS and integrated channel decoders but requires 16.7% higher core voltage and adds silicon cost; the C6414GLZ5E0 removes telecom-specific peripherals while retaining identical compute and memory subsystems-enabling drop-in replacement where those interfaces are unused.

Availability

TMS32C6415EGLZ5E0 is available at Aetrix Electronics and suitable for telecom infrastructure, industrial video analytics, voice gateway, and wireless baseband applications requiring stable component supply across extended production lifecycles.

Supply support for TMS32C6415EGLZ5E0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, specializing in analog, embedded processing, and connectivity technologies for industrial, automotive, and communications markets.

The TMS320C64x™ DSP product line was designed for high-throughput, low-latency fixed-point signal processing in multichannel telecom and multimedia systems-emphasizing architectural efficiency, peripheral integration, and software compatibility across generations.

FAQ

What is the core clock frequency and instruction throughput of the TMS32C6415EGLZ5E0?

The TMS32C6415EGLZ5E0 operates at a guaranteed 500 MHz core clock frequency, delivering 4000 million instructions per second (MIPS) and executing up to eight 32-bit instructions per cycle. Its 2-ns instruction cycle time and VelociTI.2™ VLIW architecture ensure deterministic real-time performance for telecom and multimedia workloads. This specification is validated under recommended operating conditions with 1.2-V core and 3.3-V I/O supplies.

Does the TMS32C6415EGLZ5E0 support PCI and UTOPIA interfaces simultaneously?

Yes, the TMS32C6415EGLZ5E0 integrates both a 32-bit/33-MHz PCI 2.2-compliant interface and an 8-bit UTOPIA Level 2 slave controller, and they operate concurrently. Unlike the C6414, the C6415 variant enables both peripherals without pin conflict-making TMS32C6415EGLZ5E0 uniquely suited for hybrid backplane designs requiring PCI-based system management and UTOPIA-based ATM cell transport.

What package type and pin count does the TMS32C6415EGLZ5E0 use?

The TMS32C6415EGLZ5E0 uses a 532-pin plastic ball grid array (GLZ) package with 0.8-mm ball pitch and a 23 × 23 mm footprint. It is pin-compatible with the C6414 and C6416 in GLZ packaging, provided peripheral selection modes align-specifically, PCI and UTOPIA must be enabled for full functional equivalence on TMS32C6415EGLZ5E0.

How does the TMS32C6415EGLZ5E0 handle memory hierarchy and cache configuration?

The TMS32C6415EGLZ5E0 implements a two-level memory architecture: 16KB direct-mapped L1P program cache, 16KB 2-way set-associative L1D data cache, and 1024KB unified L2 memory/cache. The L2 space is flexibly allocatable between mapped RAM and cache (up to 256KB), allowing developers to tune latency-bandwidth trade-offs-for example, dedicating 768KB to RAM for large coefficient tables and 256KB to cache for hot code regions.

Is the TMS32C6415EGLZ5E0 software-compatible with earlier C62x or C6414 devices?

Yes, the TMS32C6415EGLZ5E0 is fully software-compatible with the C62x™ family and pin-compatible with the TMS320C6414 and TMS320C6416 in the same GLZ package. Code written for C62x devices runs unmodified on TMS32C6415EGLZ5E0, and application binaries targeting C6414 can be reused-provided peripheral initialization accounts for the presence of PCI and UTOPIA on TMS32C6415EGLZ5E0.