Texas Instruments TMS32C6416DGLZ7E3

Overview

TMS32C6416DGLZ7E3 from Texas Instruments is a high-performance fixed-point digital signal processor (DSP) built on the VelociTI.2™ VLIW architecture, delivering 5760 MIPS at 720 MHz with eight 32-bit instructions/cycle and dual 16-bit/quad 8-bit arithmetic per functional unit. It integrates Viterbi and Turbo decoder coprocessors (VCP/TCP), 1024 KB L2 unified RAM/cache, and dual external memory interfaces (64-bit EMIFA + 16-bit EMIFB) for wireless baseband processing in 3GPP-compliant infrastructure.

For engineers reviewing the TMS32C6416DGLZ7E3 datasheet, TMS32C6416DGLZ7E3 pinout, TMS32C6416DGLZ7E3 application, or TMS32C6416DGLZ7E3 equivalent, key selection criteria include its 720-MHz CPU clock, 1.39-ns instruction cycle time, VCP/TCP offload capability for AMR/3GPP decoding, PCI 2.2 interface support, and 532-pin GLZ BGA package compatibility with industrial temperature-grade operation.

Technical Context

The TMS32C6416DGLZ7E3 implements a dual-side VelociTI.2™ DSP core with six ALUs and two multipliers-each multiplier supporting four 16×16-bit or eight 8×8-bit operations per cycle-and 64 × 32-bit general-purpose registers. Its non-aligned load-store architecture enables byte-, half-word-, word-, and doubleword-addressable data access without alignment constraints.

Memory hierarchy includes 16 KB L1P direct-mapped cache, 16 KB L1D 2-way set-associative cache, and 1024 KB flexible L2 unified RAM/cache configurable as mapped memory or mixed cache/mapped space. Peripheral integration includes three McBSPs, UTOPIA Level 2 slave (8-bit @ 50 MHz), PCI 2.2 master/slave, HPI32/HPI16, and EDMA with 64 independent channels.

Key Specifications

Pinout & Package

532-pin plastic ball grid array (GLZ) package, 23 mm × 23 mm, 0.8-mm ball pitch, RoHS-compliant lead-free bump and soldered balls. Thermal and mechanical data conform to TI's SPRS146N specification.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar fixed-point DSP applications.

Compared with TMS32C6416DGLZ7E3, the TMS320C6416DGLZ6E3 trades 20% peak throughput for 15% lower dynamic power, while the TMS320C6416DGLZ5E0 removes PCI/UTOPIA to reduce system-level routing complexity and cost-but sacrifices scalability to next-gen 3GPP features requiring those interfaces.

Availability

TMS32C6416DGLZ7E3 is available at Aetrix Electronics and suitable for wireless infrastructure, telecom line cards, and VoIP media gateways requiring stable component supply across extended product lifecycles and industrial temperature operation.

Supply support for TMS32C6416DGLZ7E3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 50 years of innovation in DSP architectures and industrial-grade reliability.

The TMS320C64x™ product line was designed specifically for high-throughput, low-latency fixed-point signal processing in 3G/4G wireless infrastructure, medical imaging, and industrial automation-emphasizing hardware-accelerated channel coding and deterministic real-time performance.

FAQ

What is the maximum operating frequency and corresponding instruction cycle time for the TMS32C6416DGLZ7E3?

The TMS32C6416DGLZ7E3 operates at a maximum CPU clock rate of 720 MHz, yielding an instruction cycle time of 1.39 ns. This timing is validated under recommended operating conditions with 1.4-V core supply and industrial temperature range (−40°C to 105°C). The device achieves 5760 million instructions per second (MIPS) at this frequency, as confirmed in TI's SPRS146N datasheet Section 5 (Device Characteristics).

Does the TMS32C6416DGLZ7E3 include hardware accelerators for wireless channel decoding?

Yes, the TMS32C6416DGLZ7E3 integrates two dedicated coprocessors: the Viterbi Decoder Coprocessor (VCP) supports >600 AMR voice channels at 7.95 Kbps, and the Turbo Decoder Coprocessor (TCP) handles up to seven 2-Mbps or forty-three 384-Kbps 3GPP turbo decoding streams. Both operate independently of the CPU core and communicate via the EDMA controller, as detailed in SPRS146N Sections 4 and 6.

What external memory interfaces does the TMS32C6416DGLZ7E3 support, and what are their widths?

The TMS32C6416DGLZ7E3 features two glueless external memory interfaces: a 64-bit EMIFA supporting SDRAM, ZBT SRAM, and FIFO, and a 16-bit EMIFB compatible with asynchronous memories (SRAM/EPROM) and synchronous peripherals. EMIFA operates at up to 133 MHz in 720-MHz devices, while EMIFB runs at CPU/4 frequency (180 MHz), per SPRS146N Table 1 and Section 8.

Is the TMS32C6416DGLZ7E3 pin-compatible with other C641x devices, and what conditions apply?

Yes, the TMS32C6416DGLZ7E3 is pin-for-pin compatible with TMS320C6414 and TMS320C6415 in GLZ packages when PCI and UTOPIA peripherals are disabled on the latter two. Compatibility requires identical BEA[9:7] pin configurations and shared peripheral selection mode, as specified in SPRS146N Section 6 (Device Compatibility) and Table 2.

What is the L2 memory configuration and flexibility of the TMS32C6416DGLZ7E3?

The TMS32C6416DGLZ7E3 provides 1024 KB (8 Mbit) of unified L2 memory that can be flexibly allocated as mapped RAM, cache (up to 256 KB), or a combination thereof. This allocation is software-configurable via memory-mapped registers, enabling optimization for deterministic latency (cache-heavy) or large buffer storage (RAM-heavy), as described in SPRS146N Section 4 (Description) and Figure 1.